型号
- 型号
- 关键词
EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8
厂商官网：https://www.rocelec.com/
下载文档| 型号 | NM25C160TLZET8 | NM25C160LEN | NM25C160VM8 | NM25C160TLEMT8 | NM25C160TLEMT8X | NM25C160LVM8 |
|---|---|---|---|---|---|---|
| 描述 | EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, PLASTIC, TSSOP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SOP-8 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | TSSOP, | DIP, | SOP, | TSSOP, | TSSOP, | SOP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | 1 MHz | 2.1 MHz | 2.1 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.4 mm | 9.817 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | DIP | SOP | TSSOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 座面最大高度 | 1.2 mm | 5.08 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.75 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 4.5 V | 5.5 V | 5.5 V | 4.5 V | 4.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 4.5 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 7.62 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 15 ms | 10 ms | 10 ms | 15 ms | 15 ms | 10 ms |
