Multilayer Ceramic Chip Capacitors
FEATURES
• CRACK RESISTANT TERMINATION
• SOFT TERMINATION, OPEN MODE FAILURE
• WIDE VOLTAGE RANGE (16V TO 5KV)
• HIGH CAPACITANCE (UP TO 10μF)
• RoHS COMPLIANT
• SAC SOLDER COMPATIBLE**
Temperature Coefficient
Capacitance Range
NMC-P Series
RoHS
Compliant
Includes all homogeneous materials
*See Part Number System for Details
NPO
X7R
5pF ~ 0.22μF
180pF ~ 10μF
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)
Capacitance Tolerance
±10% (K) & ±20% (M)
Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)
Operating Temperature Range
-55°C ~ +125°C
Temperature Characteristics
±30ppm/°C
±15%
Δ
Cap.
Rated Voltages
16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc
Q = > 1000 (more then 30pF)*
2.5% max. @ 1KHz, 1.0V ± 0.2Vrms
Q or Dissipation Factor
Q = > 400 + 20 x C in pF (30pF and below)*
insulation Resistance
10,000Megohm or 500Megohm/μF whichever is less @ +25°C
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)
Dielectric Withstanding Voltage
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms
**Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.
PART NUMBER SYSTEM
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F
Series
RoHS Compliant
Tape & Reel (Plastic Carrier)
Tape & Reel (Punched Carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF,
fi
rst 2 digits are
significant, 3rd digit is no. of zeros
Temperature Characteristic (NPO or X7R)
Size Code (see chart)
CONSTRUCTION
Base layer (Cu 50V ~ 250V)
(Ag 500V ~ up)
Flexible layer (Polymer)
Barrier layer (Ni)
Finish layer (Sn)
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS
Termination Separation
(Open Failure Mode)
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
1
Multilayer Ceramic Chip Capacitors
NPO VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
5.0
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1μF
0603
1.60 ± 0.1
0.80 ± 0.1
0.90 max.
0.15 min.
200
16 25
0805
2.00 ± 0.2
1.25 ± 0.25
1.45 max.
0.20 min.
1206
3.20 ± 0.3
1.60 ± 0.2
1.80 max.
0.30 min.
Working Voltage (Vdc)
50 200 250 500 16 25 50 200 250 500 1K
NMC-P Series
1210
3.20 ± 0.30
2.50 ± 0.20
2.60 max.
0.30 min.
2K
3K
16
25
50 200 250 500
®
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Multilayer Ceramic Chip Capacitors
NPO VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
5.0
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
0.001μF
0.0012
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1μF
0.12
0.15
0.22
1K
1808
4.60 ± 0.3
2.00 ±0.2
2.20 max.
0.30 min.
2K
3K
5K
1812
1825
4.60 ± 0.3
4.60 ± 0.3
3.20 ±0.3
6.35 ±0.4
3.00 max.
2.60 max.
0.30 min.
0.30 min.
Working Voltage (Vdc)
16 25 50 1K 2K 3K 250 500 1K
2220
5.70 ± 0.4
5.00 ±0.4
3.00 max.
0.30 min.
1K
5K
NMC-P Series
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
3
Multilayer Ceramic Chip Capacitors
X7R LOW VOLTAGE VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
0.1μF
0.15
0.22
0.33
0.47
0.68
1.0μF
1.5
2.2
3.3
4.7
6.8
10μF
0805
2.00 ± 0.2
1.25 ± 0.25
1.45 max.
0.20 min.
50
100
1206
3.20 ± 0.3
1.60 ± 0.2
1.80 max.
0.30 min.
50
100
1210
3.20 ± 0.3
2.50 ± 0.2
2.60 max.
0.30 min.
50
1812
1825
4.60 ± 0.3
4.60 ± 0.3
3.20 ± 0.3
6.35 ± 0.4
3.00 max.
2.60 max.
0.30 min.
0.30 min.
Working Voltage (Vdc)
100
50
100
50
100
NMC-P Series
2220
5.70 ± 0.4
5.00 ± 0.4
3.00 max.
0.30 min.
50
100
2225
5.70 ± 0.4
6.35 ± 0.4
3.00 max.
0.30 min
50
100
X7R HIGH V0LTAGE VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
180pF
220
270
330
390
470
560
680
0.001μF
0.0015μF
0.0022μF
0.0027μF
0.0033μF
0.0039μF
0.0047μF
0.0056μF
0.0068μF
0.01μF
0.012μF
0.015μF
0.018μF
0.022μF
0.027μF
0.033μF
0.039μF
0.047μF
0.056μF
0.068μF
0.1μF
0.12μF
0.15μF
0.18μF
0.22μF
®
200
0805
2.00 ± 0.2
1.25 ± 0.25
1.45 max.
0.20 min.
250
500
200
1206
3.20 ± 0.3
1.60 ± 0.2
1.80 max.
0.30 min.
Working Voltage (Vdc)
250
500
630
1K
1210
3.20 ± 0.3
2.50 ± 0.2
2.60 max.
0.30 min.
200
250
500
1K
4
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Multilayer Ceramic Chip Capacitors
X7R HIGH V0LTAGE VALUES AND SIZES (mm)
EIA Case Size
Length (L)
Width (W)
Thickness max. (T)
Termination Width (P)
Capacitance
150pF
180
220
270
330
390
470
560
680
0.001μF
0.0015
0.0018
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.01μF
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.1μF
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
1.0μF
1.5
2.2
W
500
1808
4.60 ± 0.3
2.0 ± 0.2
2.20 max.
0.30 min.
1K
2K
3K
200
250
1812
4.60 ± 0.3
3.2 ± 0.3
3.00 max.
0.30 min.
500
1K
1825
4.60 ± 0.3
6.35 ± 0.4
2.60 max.
0.30 min.
Working Voltage (Vdc)
2K
3K 250 500 1K
2220
5.70 ± 0.4
5.00 ± 0.4
3.00 max.
0.30 min.
250
500
1K
NMC-P Series
2225
5.70 ± 0.4
6.35 ± 0.4
3.00 max.
0.30 min.
2K
250
500
1K
T
P
L
®
100% Sn over Ni barrier
P
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
5
FPGA/CPLD
