Nichia STS-DA1-0506B
<Cat.No.090602>
SPECIFICATIONS FOR NICHIA CHIP TYPE
WARM WHITE
MODEL :
NS2L123BT
LED
NICHIA CORPORATION
-0-
Nichia STS-DA1-0506B
<Cat.No.090602>
1.SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Dice Temperature
Soldering Temperature
Absolute Maximum Rating
280
400
85
1.00
-40 ~ +100
-40 ~ +100
135
Reflow Soldering : 260°C
Hand Soldering : 350°C
I
FP
Conditions : Pulse Width
≤
10msec. and Duty
≤
1/10
Symbol
I
F
I
FP
I
R
P
D
T
opr
T
stg
T
j
T
sld
(Ts=25°C)
Unit
mA
mA
mA
W
°C
°C
°C
for 10sec.
for 3sec.
(2) Initial Electrical/Optical Characteristics
Item
Symbol
Forward Voltage
V
F
Luminous Flux
φv
x
-
Chromaticity Coordinate
y
-
Condition
I
F
=150[mA]
I
F
=150[mA]
I
F
=150[mA]
I
F
=150[mA]
Typ.
(3.2)
(32)
0.41
0.39
(Ts=25°C)
Max.
Unit
3.6
V
-
lm
-
-
-
-
Forward Voltage Measurement allowance is ± 3%.
Luminous flux value is traceable to the CIE 127:2007-compliant national standards.
Please refer to CIE 1931 chromaticity diagram.
(3) Ranking
Item
Luminous Flux
Rank P12
Rank P11
Rank P10
Rank P9
Symbol
φv
Condition
I
F
=150[mA]
Min.
36.0
30.3
25.5
21.4
(Ts=25°C)
Max.
Unit
42.8
36.0
lm
30.3
25.5
Luminous Flux Measurement allowance is ± 7%.
Color Ranks
x
y
x
y
x
y
0.3575
0.3612
0.3545
0.3408
0.3897
0.3823
0.3610
0.3850
0.3575
0.3612
0.3988
0.4116
(I
F
=150mA,Ts=25°C)
Rank d1
0.3780 0.3988
0.3970 0.4116
Rank d2
0.3720 0.3897
0.3714 0.3823
Rank e1
0.4162 0.4390
0.4200 0.4310
0.3897
0.3823
0.3822
0.3580
0.4255
0.4000
-1-
0.3720
0.3714
0.3667
0.3484
0.4053
0.3907
Nichia STS-DA1-0506B
<Cat.No.090602>
Rank e2
0.4053 0.4255
0.3907 0.4000
0.4519
0.4086
0.4355
0.3785
x
y
x
y
x
y
0.3822
0.3580
0.4255
0.4000
0.4129
0.3725
0.3897
0.3823
0.4129
0.3725
x
y
x
y
0.3954
0.3642
0.4519
0.4086
0.4355
0.3785
Rank f4
0.4680 0.4970
0.4385 0.4466
Rank f6
0.4519 0.4770
0.4086 0.4137
0.4770
0.4137
0.4588
0.3838
Rank f3
0.4390 0.4680
0.4310 0.4385
Rank f5
0.4255 0.4519
0.4000 0.4086
Color Coordinates Measurement allowance is ± 0.01.
Basically, a shipment shall consist of the LEDs of a combination of the above ranks.
The percentage of each rank in the shipment shall be determined by Nichia.
Correspondence table of Color Coordinates – Luminous Flux ranks
Ranking by Luminous Flux
Ranking by Color Coordinates
P9
P10
P11
P12
d1, d2
e1, e2
f3, f4,f5,f6
Shaded ranks are available.
Chromaticity Coordinate – Luminous Flux (Reference)
Ranking by Color Coordinates
Chromaticity Coordinate Luminous Flux
(0.3720,0.3714)
(33)lm
d1, d2
(0.41,0.39)
(32)lm
e1, e2
(0.452,0.409)
(29)lm
f3, f4,f5,f6
2.INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to “CHARACTERISTICS” on the following pages.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
Please refer to “OUTLINE DIMENSIONS” on the following page.
: Ceramics
Material as follows ; Package
: Silicone Resin (with Diffused + Phosphor)
Encapsulating Resin
: Ag Plating
Electrodes
-2-
Nichia STS-DA1-0506B
<Cat.No.090602>
4.PACKAGING
· The LEDs are packed in cardboard boxes after taping.
Please refer to “TAPING DIMENSIONS” and “PACKING ”on the following pages.
The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity
· In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation.
· The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
· The boxes are not water resistant and therefore must be kept away from water and moisture.
· When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows
lot number.
The lot number is composed of the following characters;
-
- Year
( 8 for 2008, 9 for 2009 )
- Month ( 1 for Jan., 9 for Sep., A for Oct.,
- Nichia's Product Number
- Ranking by Color Coordinates
- Ranking by Luminous Flux
B for Nov. )
-3-
Nichia STS-DA1-0506B
<Cat.No.090602>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
303 303A
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 203
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=245 ± 5°C,
5sec.
using flux
Lead-free Solder (Sn-3.0Ag-0.5Cu)
-40°C
~
100°C
1min. (10sec.) 1min.
(Pre treatment 30°C,70%,168hrs.)
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
25°C ~ 65°C ~ -10°C
90%RH 24hrs./1cycle
Ta=100°C
Ta=60°C,
Ta=-40°C
Ta=25°C, I
F
=280mA
Tested with Nichia standard circuit board.
Note
2 times
Number of
Damaged
0/22
1 time
over 95%
100 cycles
0/22
0/50
Temperature Cycle
Moisture Resistance Cyclic
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Permanence of Marking
100 cycles
10 cycles
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
1000 hrs.
500 hrs.
1000 hrs.
1 time
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/22
RH=90%
Ta=100°C, I
F
=90mA
Tested with Nichia standard circuit board.
60°C, RH=90%, I
F
=200mA
Tested with Nichia standard circuit board.
Ta=-40°C, I
F
=150mA
Tested with Nichia standard circuit board.
JEITA ED-4701
500 501
JEITA ED-4701
400 403
JEITA ED-4701
300 304
Vibration
Electrostatic Discharges
Solvent : Isopropyl Alcohol
Solvent Temperature : 20 ~ 25°C
Dipping Time : 5 min.
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3directions, 4cycles
R=1.5kΩ, C=100pF
Test Voltage=2kV
48min.
0/10
3 times
Negative/Positive
0/22
Thermal resistance of LED with Nichia standard circuit board : Rja
≒
95°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
V
F
I
F
=150mA
-
Initial Level
Luminous Flux
I
F
=150mA
Initial Level 0.7
-
φv
The test is performed after the board is cooled down to the room temperature.
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1.1
