Stacked Film Capacitor Chips
NSWC Series
FEATURES
NSWC IS
• STACKED METALLIZED POLYETHYLENE NAPHTHALATE (PEN) FILM
RECOMMENDED
• STANDARD EIA 1206, 1210, 1913, 2416, 2820, 3022 AND 3925 SIZES
FOR NEW DESIGNS
• WIDE TEMPERATURE RANGE UP TO +125
O
C*
• HIGH HEAT AND MOISTURE RESISTANT
RoHS
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
Compliant
includes all homogeneous materials
nCHARACTERISTICS
• REFLOW SOLDERING ONLY
*See Part Number System for Details
• TAPE AND REEL PACKAGING
SPECIFICATIONS
Capacitance Range
Votage Ratings
Capacitance Tolerance
Temperature Range
Dissipation factor (20°C)
Insulation resistance (20°C)
Dielectric Withstanding
Voltage
1206
0.001 ~ 0.0047μF
Case Sizes
1913
2416
2820
3022
3925
1210
0.0056 ~ 0.01μF 0.012 ~ 0.082μF 0.1 ~ 0.15μF 0.18 ~ 0.33μF 0.39 ~ 0.47μF 0.56 ~ 1.0μF
100Vdc
0.001 ~ 0.01μF 5% (J) only,
0.012 ~ 0.15μF 5% (J) or 10% (K), 0.18 ~ 1.0μF 10% (K) only
-55°C ~ +105°C (0.001μF ~ 0.01μF)
-55°C ~ +125°C (0.012μF ~ 1.0μF with derating above +85°C)
1.0% max. @ 1KHz
3 Gigohms or 1000Ω/F whichever is lower
150% of Rated Voltage 60 Seconds
ENVIRONMENTAL CHARACTERISTICS
Life Test At +105°C
1,000 Hours at 125% of Rated Voltage
(125°C for 0.012μF ~ 1.0μF)
Resistance to Soldering Heat:
+240°C Peak
Humidity Load Life (90% ~ 95% RH)
(1) 1,000 Hours, +40°C
500 Hours for 0.012μF ~ 1.0μF
(2) 500 Hours, +60°C
for 0.001 ~ 0.01μF
Solderability with
25% Wt Rosin-Methanol Flux
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Capacitance Change
Dissipation Factor
Insulation Resistance
Within +1%/-6% of Initial Value
1.1% Maximum
1 Gigohm Minimum or 300Ω/F whichever is lower
Within ±5% for 0.012 ~ 1.0μF or ±3% for 0.001 ~ 0.01μF of initial value
1.1% Max. for 0.012 ~ 1.0μF or 0.66% Max. for 0.001 ~ 0.01μF
1 Gigohm Minimum or 300Ω/F whichever is lower
(1) +8%/-5%
(2) ±10% of Initial Value
(1) 1.5% Max.
(2) 2.0% Max.
(1) 100 Megohm Min. or 30Ω/F
(2) 10 Megohm Min. or 3Ω/F
whichever is lower
90% Minimum Coverage After 2.5 Second Dip Into 245°C Solder Pot
RECOMMENDED LAND
PATTERN (mm)
Temperature - Deg. C
EIA Size
1206
1210
1913
2416
2820
3022
3925
A
1.8
1.8
2.6
3.8
4.5
5.1
7.2
B
3.6
3.6
6.6
7.8
9.0
9.7
11.9
C
1.4
2.3
3.0
3.8
4.6
5.0
5.7
RECOMMENDED REFLOW PROFILE
300
250
200
150
100
50
25
Ramp-up
25°C ~ 150°C
90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Cool Down
Time above 220°C
60 sec. max.
Standard: +240 °C Peak Temperature
+250°C Special Order
(see part numbering system)
C
0
Time
A
B
PART NUMBER SYSTEM
NSWC 823 J 100 TR D4 N F
RoHS Compliant
Optional High Temp. Reflow (+250°C)*
Size Code
Tape & Reel
Voltage
Tolerance Code: J = ±5%
Capacitance in pF, 1st two digits are
significant, 3rd digit is no. of zeros
Series
*Special packaging and handling required.
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
1
Stacked Film Capacitor Chips
100V STANDARD PRODUCTS AND CASE SIZES
Cap.
Cap.
Size
Value
Code
Code
NSWC102J100TRB2F
0.001
102
B2
NSWC122J100TRB2F
0.0012
122
B2
NSWC152J100TRB2F
0.0015
152
B2
NSWC182J100TRB2F
0.0018
182
B2
NSWC222J100TRB2F
0.0022
222
B2
NSWC272J100TRB2F
0.0027
272
B2
NSWC332J100TRB3F
0.0033
332
B3
NSWC392J100TRB3F
0.0039
392
B3
NSWC472J100TRB3F
0.0047
472
B3
NSWC562J100TRC2F
0.0056
562
C2
NSWC682J100TRC2F
0.0068
682
C2
NSWC822J100TRC3F
0.0082
822
C3
NSWC103J100TRC3F
0.010
103
C3
NSWC123*100TRD1F
0.012
123
D1
NSWC153*100TRD1F
0.015
153
D1
NSWC183*100TRD1F
0.018
183
D1
NSWC223*100TRD1F
0.022
223
D1
NSWC273*100TRD1F
0.027
273
D1
NSWC333*100TRD1F
0.033
333
D1
NSWC393*100TRD1F
0.039
393
D1
NSWC473*100TRD2F
0.047
473
D2
NSWC563*100TRD2F
0.056
563
D2
NSWC683*100TRD3F
0.068
683
D3
NSWC823*100TRD4F
0.082
823
D4
NSWC104*100TRE1F
0.1
104
E1
NSWC124*100TRE3F
0.12
124
E3
NSWC154*100TRE4F
0.15
154
E4
NSWC184K100TRG1F
0.18
184
G1
NSWC224K100TRG2F
0.22
224
G2
NSWC274K100TRG3F
0.27
274
G3
NSWC334K100TRG5F
0.33
334
G5
NSWC394K100TRQ1F
0.39
394
Q1
NSWC474K100TRQ2F
0.47
474
Q2
NSWC564K100TRR1F
0.56
564
R1
684
R3
NSWC684K100TRR3F
0.68
NSWC824K100TRR6F
0.82
824
R6
NSWC105K100TRR8F
1.0
105
R8
*These values available in J (±5%) or K (±10%) tolerance.
Part Number
Length
L ±0.2
Width
W
Height
H ±0.2
NSWC Series
p
EIA
1.1 ± 0.3
3.2 ± 0.2
1.6 ± 0.2
0.65 ± 0.3
(Fig. 1)
1206
1.5 ± 0.3
1.5
3.2 ± 0.2
2.5 ± 0.2
2.1
1210
1.4
4.8 ± 0.2
3.3 ± 0.3
2.0
2.4
2.8
1.8
2.4
2.8
2.0
2.4
2.9
3.5
3.4
4.0
3.0
3.6
4.3
5.1
1913
6.0 ± 0.2
4.1 ± 0.3
0.35 ± 0.2
(Fig. 2)
2416
7.1 ± 0.2
5.0 ± 0.4
2820
7.7 ± 0.2
5.5 ± 0.4
3022
9.8 ± 0.2
6.3 ± 0.4
3925
Fig. 1 (D1~R8)
Stacked Element Terminations:
95.5% Sn, 4% Ag and
0.5% Cu over phosphorus
copper barrier over copper
base
Fig. 2 (B2~C3)
Stacked Element Terminations:
95.5% Sn, 4% Ag and
0.5% Cu over phenolic
resin/Ag/Ni/Cu over
copper base
H
H
p
L
2
L
1
p
W
p
L
2
L
1
p
W
®
2
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
Stacked Film Capacitor Chips
TAPE DIMENSIONS (mm)
Case Code A±0.1 B±0.1 C±0.2
t
W±0.3
F
P±0.1 D+0.2/-0
B2
1.5
1.9
B3
1.9
3.5
0.25
8.0
3.5
4.0
1.0
C2
1.9
2.8
C3
2.5
2.0
D1
D2
3.8
5.1
2.6
1.5
D3, D4
3.4
0.3
5.5
12.0
8.0
±0.05
±0.05
E1, E2
2.7
4.6
6.3
E3, E4
3.5
-
G1 ~ G5
5.5
7.4
4.7
Q1, Q2
6.91 8.43 5.685 0.343
7.5
16.0
12.0
1.5
±0.1
R1 ~ R8
8.94 10.54 5.795 ±0.013
Qty/Reel
3,000
2,000
2,000
2,000
3,000
3,000
2,000
3,000
2,000
1,500
1,000
1,000
NSWC Series
17.4
±1.0
13
±0 .0
.5
2.0
±0.5
330
±2.0
.0
21 0.8
±
13.4
±1.0
EMBOSSED PLASTIC CARRIER
t
1.5 +0.1
-0
4.0 ±0.1
1.75
±0.1
F
B
D∅
C
A
P
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
W
www.SMTmagnetics.com
80
±1.0
Specifications are subject to change
3
