2. Surge protection devices are normally selected according to the working peak reverse voltage (V
RWM
), which should be equal or greater
than the DC or continuous peak operating voltage level.
3. V
BR
is measured at pulse test current I
T
.
www.onsemi.com
2
NUP5120X6
120
% OF RATED POWER OR I
PP
100
80
60
40
20
0
0
25
50
75
100
125
150
10
1
10
PULSE DURATION (μS)
100
PEAK POWER (W)
1000
T
A
= 25
°C
100
T
A
, AMBIENT TEMPERATURE (°C)
Figure 1. Power Derating vs. Ambient
Temperature
Figure 2. Peak Power vs. Pulse Duration
100
C
T
, TYPICAL CAPACITANCE (pF)
T
A
= 25
°C
I
PP
, PEAK CURRENT (A)
60
T
A
= 25
°C
50
40
30
20
10
0
0
1
2
3
4
5
6
10
1
0.1
6
8
10
12
14
16
V
CL
, CLAMP VOLTAGE (V)
V
R
, REVERSE VOLTAGE (V)
Figure 3. Peak Current vs. Clamp Voltage
Figure 4. Typical Capacitance vs. Reverse
Voltage
1000
T
A
= 25
°C
REVERSE CURRENT (nA)
FORWARD CURRENT (A)
100
10
1
0.1
0.01
T
J
= 125
°C
1
T
A
= 25
°C
T
J
= 125
°C
0.1
T
J
= 25
°C
T
J
= 25
°C
0.01
1
2
3
4
5
6
0.001
0.6
0.7
0.8
0.9
1.0
1.1
1.2
REVERSE VOLTAGE (V)
FORWARD VOLTAGE (V)
Figure 5. Reverse Current vs. Reverse Voltage
Figure 6. Typical Forward Current vs. Forward
Voltage
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3
NUP5120X6
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
D
−X−
6
5
4
A
L
1
2
3
E
−Y−
b
H
E
e
5
6 PL
M
C
X Y
0.08 (0.003)
DIM
A
b
C
D
E
e
L
H
E
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ON Semiconductor reserves the right to make changes without further notice to any products herein.
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