NX3DV3899
Dual double-pole double-throw analog switch
Rev. 3 — 9 November 2011
Product data sheet
1. General description
The NX3DV3899 is a dual double-pole double-throw analog data-switch suitable for use
as an analog or digital multiplexer/demultiplexer. It consists of four switches, each with two
independent input/outputs (nY0 and nY1) and a common input/output (nZ). The two digital
inputs (1S and 2S) are used to select the switch position. Schmitt trigger action at the
select input (nS) makes the circuit tolerant to slower input rise and fall times across the
entire V
CC
range from 1.4 V to 4.3 V.
A low input voltage threshold allows pin nS to be driven by lower level logic signals without
a significant increase in supply current I
CC
. This makes it possible for the NX3DV3899 to
switch 4.3 V signals with a 1.8 V digital controller, eliminating the need for logic level
translation. The NX3DV3899 allows signals with amplitude up to V
CC
to be transmitted
from nZ to nY0 or nY1; or from nY0 or nY1 to nZ.
2. Features and benefits
Wide supply voltage range from 1.4 V to 4.3 V
Very low ON resistance (peak):
7.2
(typical) at V
CC
= 1.4 V
5.4
(typical) at V
CC
= 1.65 V
2.9
(typical) at V
CC
= 2.5 V
2.4
(typical) at V
CC
= 3.0 V
2.3
(typical) at V
CC
= 3.6 V
2.2
(typical) at V
CC
= 4.3 V
Break-before-make switching
High noise immunity
ESD protection:
HBM JESD22-A114F Class 2A exceeds 2000 V (all pins)
HBM JESD22-A114F Class 3A exceeds 5000 V (I/O pins to GND)
MM JESD22-A115-A exceeds 200 V
CDM AEC-Q100-011 revision B exceeds 1000 V
CMOS low-power consumption
Latch-up performance exceeds 100 mA per JESD 78B Class II Level A
1.8 V control logic at V
CC
= 3.6 V
Control input accepts voltages above supply voltage
Very low supply current, even when input is below V
CC
High current handling capability (350 mA continuous current under 3.3 V supply)
Specified from
40 C
to +85
C
and from
40 C
to +125
C
NXP Semiconductors
NX3DV3899
Dual double-pole double-throw analog switch
3. Applications
Data switch
Cell phone
PDA
Portable media player
4. Ordering information
Table 1.
Ordering information
Package
Temperature range
NX3DV3899HR
40 C
to +125
C
Name
Description
Version
SOT1039-1
HXQFN16U plastic thermal enhanced extremely thin quad flat
package; no leads; 16 terminals; UTLP based;
body 3
3
0.5 mm
XQFN16
plastic, extremely thin quad flat package; no leads;
16 terminals; body 1.80
2.60
0.50 mm
Type number
NX3DV3899GU
40 C
to +125
C
SOT1161-1
5. Marking
Table 2.
Marking codes
Marking code
99
9
Type number
NX3DV3899HR
NX3DV3899GU
6. Functional diagram
1Y0
1Z
1Y1
2Y0
2Z
2Y1
1S
3Y0
3Z
3Y1
4Y0
4Z
4Y1
2S
001aak174
Fig 1.
Logic symbol
NX3DV3899
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 9 November 2011
2 of 22
NXP Semiconductors
NX3DV3899
Dual double-pole double-throw analog switch
1Y1
3Y1
1Z
3Z
1Y0
1S
3Y0
2S
2Y1
4Y1
2Z
4Z
2Y0
4Y0
001aam785
Fig 2.
Logic diagram
7. Pinning information
7.1 Pinning
14 V
CC
16 1Z
terminal 1
index area
15 1Y1
13 4Y0
12 4Z
11 4Y1
10 2S
9 3Y0
3Z 8
001aam787
© NXP B.V. 2011. All rights reserved.
terminal 1
index area
V
CC
14
16
15
1Y1
1Z
13
4Y0
1Y0
1S
2Y1
2Z
1
2
12
11
4Z
4Y1
2S
3Y0
1Y0 1
1S 2
NX3DV3899
3
4
5
GND(1)
6
7
8
10
9
2Y1 3
2Z 4
NX3DV3899
2Y0 5
GND 6
001aam786
Transparent top view
Transparent top view
(1) This is not a supply pin, the substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad
however if it is soldered the solder land should remain
floating or be connected to GND.
Fig 3.
Pin configuration SOT1039-1 (HXQFN16U)
Fig 4.
Pin configuration SOT1161-1 (XQFN16)
NX3DV3899
All information provided in this document is subject to legal disclaimers.
Product data sheet
Rev. 3 — 9 November 2011
3Y1 7
3Y1
2Y0
GND
3Z
3 of 22
NXP Semiconductors
NX3DV3899
Dual double-pole double-throw analog switch
7.2 Pin description
Table 3.
Symbol
1Y0, 2Y0, 3Y0, 4Y0
1S, 2S
1Y1, 2Y1, 3Y1, 4Y1
1Z, 2Z, 3Z, 4Z
GND
V
CC
Pin description
Pin
1, 5, 9, 13
2, 10
15, 3, 7, 11
16, 4, 8, 12
6
14
Description
independent input or output
select input
independent input or output
common output or input
ground (0 V)
supply voltage
8. Functional description
Table 4.
Input nS
L
H
[1]
H = HIGH voltage level; L = LOW voltage level.
Function table
[1]
Channel on
nY0
nY1
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
V
CC
V
I
V
SW
I
IK
I
SK
I
SW
Parameter
supply voltage
input voltage
switch voltage
input clamping current
switch clamping current
switch current
V
I
<
0.5
V
V
I
<
0.5
V or V
I
> V
CC
+ 0.5 V
V
SW
>
0.5
V or V
SW
< V
CC
+ 0.5 V;
source or sink current
V
SW
>
0.5
V or V
SW
< V
CC
+ 0.5 V;
pulsed at 1 ms duration, < 10 % duty cycle;
peak current
T
stg
P
tot
storage temperature
total power dissipation
T
amb
=
40 C
to +125
C
HXQFN16U
XQFN16
[1]
[2]
[3]
[4]
The minimum input voltage rating may be exceeded if the input current rating is observed.
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not
exceed 4.6 V.
For HXQFN16U package: above 135
C
the value of P
tot
derates linearly with 16.9 mW/K.
For XQFN16 package: above 133
C
the value of P
tot
derates linearly with 14.5 mW/K.
[3]
[4]
Conditions
select input nS
[1]
[2]
Min
0.5
0.5
0.5
50
-
-
-
Max
+4.6
+4.6
-
50
350
500
Unit
V
V
mA
mA
mA
mA
V
CC
+ 0.5 V
65
-
-
+150
250
250
C
mW
mW
NX3DV3899
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 9 November 2011
4 of 22
NXP Semiconductors
NX3DV3899
Dual double-pole double-throw analog switch
10. Recommended operating conditions
Table 6.
V
CC
V
I
V
SW
T
amb
t/V
[1]
Recommended operating conditions
Conditions
select input nS
[1]
Symbol Parameter
supply voltage
input voltage
switch voltage
ambient temperature
input transition rise and fall rate
Min
1.4
0
0
40
-
Max
4.3
4.3
V
CC
+125
200
Unit
V
V
V
C
ns/V
V
CC
= 1.4 V to 4.3 V
[2]
To avoid sinking GND current from terminal nZ when switch current flows in terminal nYn, the voltage drop across the bidirectional
switch must not exceed 0.4 V. If the switch current flows into terminal nZ, no GND current will flow from terminal nYn. In this case, there
is no limit for the voltage drop across the switch.
Applies to control signal levels.
[2]
11. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground 0 V).
Symbol Parameter
Conditions
Min
V
IH
HIGH-level
input voltage
V
CC
= 1.4 V to 1.6 V
V
CC
= 1.65 V to 1.95 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 2.7 V to 3.6 V
V
CC
= 3.6 V to 4.3 V
V
IL
LOW-level
input voltage
V
CC
= 1.4 V to 1.6 V
V
CC
= 1.65 V to 1.95 V
V
CC
= 2.3 V to 2.7 V
V
CC
= 2.7 V to 3.6 V
V
CC
= 3.6 V to 4.3 V
I
I
input leakage
current
OFF-state
leakage
current
ON-state
leakage
current
select input nS;
V
I
= GND to 4.3 V;
V
CC
= 1.4 V to 4.3 V
nY0 and nY1 port;
see
Figure 5
V
CC
= 1.4 V to 4.3 V
nZ port; see
Figure 6
V
CC
= 1.4 V to 4.3 V
-
-
5
-
50
500
nA
-
-
5
-
50
500
nA
0.9
0.9
1.1
1.3
1.4
-
-
-
-
-
-
T
amb
= 25
C
Typ
-
-
-
-
-
-
-
-
-
-
-
Max
-
-
-
-
-
0.3
0.4
0.4
0.5
0.6
-
T
amb
=
40 C
to +125
C
Min
0.9
0.9
1.1
1.3
1.4
-
-
-
-
-
-
Max
Max
(85
C)
(125
C)
-
-
-
-
-
0.3
0.4
0.4
0.5
0.6
0.5
-
-
-
-
-
0.3
0.3
0.4
0.5
0.6
1
V
V
V
V
V
V
V
V
V
V
A
Unit
I
S(OFF)
I
S(ON)
I
CC
supply current V
I
= V
CC
or GND;
V
SW
= GND or V
CC
V
CC
= 3.6 V
V
CC
= 4.3 V
-
-
-
-
100
150
-
-
500
800
5000
6000
nA
nA
NX3DV3899
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 9 November 2011
5 of 22
