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OL5172M-LC

描述:
DFB Laser Module Emitter, 1530nm Min, 1565nm Max, 10000Mbps, LC Connector, Panel Mount
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概述
DFB Laser Module Emitter, 1530nm Min, 1565nm Max, 10000Mbps, LC Connector, Panel Mount
器件参数
参数名称
属性值
厂商名称
LAPIS Semiconductor Co Ltd
Reach Compliance Code
unknown
内置特性
ISOLATOR, TEC
通信标准
OC-192
连接类型
LC CONNECTOR
数据速率
10000 Mbps
光纤设备类型
DFB LASER MODULE EMITTER
光纤类型
SMF
安装特点
PANEL MOUNT
信道数量
1
最高工作温度
75 °C
最低工作温度
最大工作波长
1565 nm
最小工作波长
1530 nm
标称工作波长
1548 nm
电源电流
100 mA
表面贴装
NO
最小阈值电流
35 mA
文档预览
JOG-01245
Optical Components
OL5172M
1550nm 10Gb/s EA Modulator with DFB Laser Module.
Rev.4 [10.2008 ]
1. DESCRIPTION
OL5172M is a 1550-nm electro-absorption (EA) modulator with DFB laser (EMwL) module for
10 Gb/s applications. The package contains an EMwL chip, an optical isolator, a rear-facet monitor
photodiode, and a thermoelectric cooler.
2. FEATURES
• High temperature operation of EMwL (T
LD
=45 degreeC) for lower power consumption
• Low dispersion penalty over 40 km (800 ps/nm) for 10 Gb/s operation
• Electrical isolation between signal GND and PKG case
• Pinout with XMD-MSA-TOSA compatible
• Mounting bracket available as an option
3. APPLICATION
• 10 Gb/s (OC-192) intermediate reach transmission
• High-speed data communication
4. OPTICAL AND ELECTRICAL CHARACTERISTICS
(T
LD
= 45°C, Tc=0 to 75°C , unless otherwise specified)
Test Conditions
Min.
Typ.
Max.
Unit
CW
---
---
35
mA
---
---
---
100
mA
If = Iop, under modulation
0
---
---
dBm
If = Iop
1530
---
1565
nm
If = Iop
35
---
---
dB
If = Iop, CW, Vm = 0V
---
---
1.7
V
If = Iop, CW
50
---
1000
A
---
-1.0
---
+0.5
V
---
---
2.0
2.5
V
Note(1)
9.5
---
---
dB
-12
800 ps/nm, BER at 10
---
---
2.0
dB
Note(1)
Im=const. 0/25/75°C
- 0.5
---
0.5
dB
If = Iop
---
---
1.0
A
If = Iop
---
---
2.5
V
If = Iop
---
0.65
---
W
25°C
9.5
---
10.5
kΩ
25°C/50°C
---
3900
---
K
Parameter
Threshold Current
Operation Current
Fiber Output Power
(Average)
Peak Wavelength
Side Mode Suppression Ratio
LD Forward Voltage
Monitor Current
ON-Level Modulation Voltage
Modulator Drive Voltage
Extinction Ratio
Dispersion Penalty
Symbol
Ith
Iop
P
AVG
λp
SMSR
Vf
Im
Vo
Vpp
ER
DP
Tracking Error
TRE
TEC Current
Itec
TEC Voltage
Vtec
TEC Power Consumption
Ptec
Thermistor Resistance
Rth
Thermistor B Value
Bth
31
Note(1)9.95328Gb/s,2 -1NRZ
Revision:4
1/5
JOG-01245
OL5172M
5. ABSOLUTE MAXIMUM RATING
(T
LD
= 45°C, unless otherwise specified)
Parameter
Operating Case Temperature
Storage Temperature
LD Forward Current
*1)
LD Forward Current
*2)
LD Reverse Voltage
TEC Voltage
TEC Current
Symbol
Tc
Tstg
I
LDF
I
LDF
V
LDR
Vtec
Itec
Min.
0
-40
---
---
---
---
---
Max.
75
85
150
110
2
3
1.5
Unit
°C
°C
mA
mA
V
V
A
*1) With no voltage applied to EA modulator.
*2) Under modulation.
6. CONNECTOR AND FIBER SPECIFICATIONS
Parameter
Type
Mode Field Diameter
Cladding Diameter
Jacket Diameter
Length
Color
Flammability
Standard Connector Type
Specifications
SMF
9+/-1
125+/-2
0.9
1000+100/-50
Blue
UL1581
SC
Unit
-
um
um
mm
mm
-
-
-
7. Ordering Information
OL5172M - _ _
OPTICAL CONNECTOR
- - : SC *
* :
STANDARD PRODUCT: NO NEED TO INDICATE
LC:LC
Revision:4
2/5
JOG-01245
OL5172M
8. OUTLINE DRAWING
All dimensions in millimeters
8.1 Module
Note:Tolerances unless noted +/-0.15mm
0 .3 0 .25
0 .35
2 .7 0 .35
2 .8 0 .35
5 .6
P I N2
P I N1
12 .7 0 .5
( 4 .6 )
1 .05
0 .8
Hea t s in k s ide
7 .75
5 .5
0 .5M A X
(17 .4 )
1000 +100 / -50
Detail of Section A
2 .05 0 .2
1 .00
0 .4
0 .2
0 .30 0 .1
2 -1 .25 0 .05
4 .25 0 .1
P I N1
PIN No.
1
2
3
4
5
6
7
8
Description
TEC-
TEC+
Signal ground
Modulator anode
Signal ground
Photodiode anode
Laser anode
Thermister
5 -0 .79 0 .05
8.2 Bracket(Option)
Thermal paste or thermal sheet is recommened between module PKG and Heatsink surface.
Hea t s ink su r face
4 .95
6 -0 .4 0 .05
5 .6 0 .1
6 .1
13 .0
2 .5
17 .0
Revision:4
3/5
2 .8 0 .35
P I N1
2 .8
P I N8
P I N7
Se c t ion A
P I N8
JOG-01245
OL5172M
9. Safety Information on this product
Warning
A laser beam is emitted from this laser diode during operation.
The invisible or visible laser beam, directly or indirectly, may cause injury to
Laser Beam the eye
or loss of eyesight.
Do not look directly into the laser beam.
Avoid exposure to the laser beam, any reflected or collimated beam.
Caution
The product contains gallium arsenide, GaAs.
GaAs vapor and powder are hazardous to human health if inhaled, ingested or
GaAs
swallowed.
Product
Do not destory or burn the product.
Do not crush or chemically dissolve the product.
Do not put the product in the mouth.
Observe related laws and company regulations when discarding this product.
The product should be excluded from general industrial waste or household
garbage.
Caution
A glass-fiber is attached on the product. Handle with care.
Optical Fiber When the fiber is broken or damaged, handle carefully to avoid injury from
the damaged part or fragments.
Revision:4
4/5
JOG-01245
OL5172M
Notice
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS
Semiconductor Co., Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be
obtained from LAPIS Semiconductor upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor
shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of
application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any
license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties.
LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such
technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or
devices (such as audio visual equipment, office-automation equipment, communication devices, electronic
appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such
as derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility
whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the
instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system which
requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat
to human life or create a risk of human injury (such as a medical instrument, transportation equipment,
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS
Semiconductor shall bear no responsibility in any way for use of any of the Products for the above special
purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales
representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled
under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit
under the Law.
Copyright 2008 - 2011 LAPIS Semiconductor Co., Ltd.
Revision:4
5/5
参数对比
与OL5172M-LC相近的元器件有:OL5172M。描述及对比如下:
型号 OL5172M-LC OL5172M
描述 DFB Laser Module Emitter, 1530nm Min, 1565nm Max, 10000Mbps, LC Connector, Panel Mount DFB Laser Module Emitter, 1530nm Min, 1565nm Max, 10000Mbps, SC Connector, Panel Mount
厂商名称 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd
Reach Compliance Code unknown unknown
内置特性 ISOLATOR, TEC ISOLATOR, TEC
通信标准 OC-192 OC-192
连接类型 LC CONNECTOR SC CONNECTOR
数据速率 10000 Mbps 10000 Mbps
光纤设备类型 DFB LASER MODULE EMITTER DFB LASER MODULE EMITTER
光纤类型 SMF SMF
安装特点 PANEL MOUNT PANEL MOUNT
信道数量 1 1
最高工作温度 75 °C 75 °C
最大工作波长 1565 nm 1565 nm
最小工作波长 1530 nm 1530 nm
标称工作波长 1548 nm 1548 nm
电源电流 100 mA 100 mA
表面贴装 NO NO
最小阈值电流 35 mA 35 mA
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