型号
- 型号
- 关键词
11.35Gbps Differential Modulator Driver with Output Waveform Shaping 16-VQFN -40 to 100
器件标准：
| 型号 | ONET1151MRGTR | ONET1151MRGTT |
|---|---|---|
| 描述 | 11.35Gbps Differential Modulator Driver with Output Waveform Shaping 16-VQFN -40 to 100 | 11.35Gbps Differential Modulator Driver with Output Waveform Shaping 16-VQFN -40 to 100 |
| Brand Name | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 |
| 包装说明 | HVQCCN, LCC16,.12SQ,20 | VQFN-16 |
| Reach Compliance Code | compli | compliant |
| Factory Lead Time | 6 weeks | 6 weeks |
| 应用程序 | SONET; SDH | SONET; SDH |
| JESD-30 代码 | S-PQCC-N16 | S-PQCC-N16 |
| JESD-609代码 | e4 | e4 |
| 长度 | 3 mm | 3 mm |
| 湿度敏感等级 | 2 | 2 |
| 功能数量 | 1 | 1 |
| 端子数量 | 16 | 16 |
| 最高工作温度 | 100 °C | 100 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN |
| 封装等效代码 | LCC16,.12SQ,20 | LCC16,.12SQ,20 |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 |
| 座面最大高度 | 1 mm | 1 mm |
| 最大压摆率 | 100 mA | 100 mA |
| 标称供电电压 | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES |
| 电信集成电路类型 | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3 mm |
| Base Number Matches | 1 | 1 |
