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P0406FC05C-T75-1

Trans Voltage Suppressor Diode, 250W, 5V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6

器件类别:分立半导体    二极管   

厂商名称:ProTek Devices

厂商官网:http://www.protekdevices.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
ProTek Devices
零件包装代码
FLIP-CHIP
包装说明
R-XBGA-B6
针数
6
Reach Compliance Code
compli
ECCN代码
EAR99
最小击穿电压
6 V
最大钳位电压
14.7 V
配置
COMMON CATHODE, 6 ELEMENTS
二极管元件材料
SILICON
二极管类型
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码
R-XBGA-B6
JESD-609代码
e0
湿度敏感等级
1
最大非重复峰值反向功率耗散
250 W
元件数量
6
端子数量
6
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
245
极性
BIDIRECTIONAL
认证状态
Not Qualified
最大重复峰值反向电压
5 V
表面贴装
YES
技术
AVALANCHE
端子面层
TIN LEAD
端子形式
BALL
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
文档预览
05155
Only One Name Means ProTek’Tion™
P0406FC3.3C - P0406FC36C
250w FliP ChiP tvs aRRay
DesCRiPtion
The P0406FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the
P0406FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance
virtually eliminates overshoot voltage due to package inductance.
FeatuRes
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Protection for 3 to 5 Lines
RoHS Compliant
REACH Compliant
aPPliCations
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
MeChaniCal ChaRaCteRistiCs
Standard EIA Chip Size: 0406
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
Pin ConFiGuRation
05155.R6 2/11
Page 1
www.protekdevices.com
05155
Only One Name Means ProTek’Tion™
P0406FC3.3C - P0406FC36C
tyPiCal DeviCe ChaRaCteRistiCs
MaXiMuM RatinGs
@ 25°C unless otherwise specified
PaRaMeteR
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
syMBol
P
PP
T
A
T
STG
value
250
-55 to 150
-55 to 150
units
Watts
°C
°C
eleCtRiCal ChaRaCteRistiCs PeR line
@ 25°C unless otherwise specified
PaRt
nuMBeR
(note 1)
RateD
stanD-oFF
voltaGe
v
wM
volts
P0406FC3.3C
P0406FC05C
P0406FC08C
P0406FC12C
P0406FC15C
P0406FC24C
P0406FC36C
notes
3.3
5.0
8.0
12.0
15.0
24.0
36.0
MiniMuM
BReaKDown
voltaGe
@ 1ma
v
(BR)
volts
4.0
6.0
8.5
13.3
16.7
26.7
40.0
MaXiMuM
ClaMPinG
voltaGe
(Fig. 2)
@ i
P
= 1a
v
C
volts
7.0
11.0
13.2
19.8
25.4
37.2
70.0
MaXiMuM
ClaMPinG
voltaGe
(Fig. 2)
@ 8/20µs
v
C
@ i
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9A
35.7V @ 7A
55.0V @ 5A
84.0V @ 3A
MaXiMuM
leaKaGe
CuRRent
(note 2)
@v
wM
i
D
µa
75*
10**
10***
1
1
1
1
tyPiCal
CaPaCitanCe
@0v, 1Mhz
C
pF
150
100
75
50
40
30
25
1. All devices are bidirectional. Electrical characteristics apply in both directions.
2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. ***Maximum leakage current < 200nA @ 5V.
05155.R6 2/11
Page 2
www.protekdevices.com
05155
Only One Name Means ProTek’Tion™
P0406FC3.3C - P0406FC36C
tyPiCal DeviCe ChaRaCteRistiCs
FiGuRe 1
PeaK Pulse PoweR vs Pulse tiMe
10,000
P
PP
- Peak Pulse Power - watts
1,000
250W, 8/20µs Waveform
100
10
0.1
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
120
i
PP
- Peak Pulse Current - % of i
PP
FiGuRe 2
Pulse wave FoRM
t
f
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
100
80
% of Rated Power
FiGuRe 3
PoweR DeRatinG CuRve
Peak Pulse Power
8/20µs
100
80
60
40
20
0
0
5
e
-t
60
40
20
0
Average Power
t
d
= t/(I
PP
/2)
10
15
t - time - µs
20
25
30
0
25
50
75 100 125
t
a
- ambient temperature - °C
150
05155.R6 2/11
Page 3
www.protekdevices.com
05155
Only One Name Means ProTek’Tion™
P0406FC3.3C - P0406FC36C
tyPiCal DeviCe ChaRaCteRistiCs
FiGuRe 4
oveRshoot & ClaMPinG voltaGe FoR P0406FC05C
35
25
5 volts per Division
15
5
-5
esD test Pulse - 25 kilovolt, 1/30ns (waveshape)
FiGuRe 5
tyPiCal ClaMPinG voltaGe vs PeaK Pulse CuRRent P0406FC05C
12
v
C
- Clamping voltage - volts
8
4
0
0
5
10
i
PP
- Peak Pulse Current - amps
15
20
05155.R6 2/11
Page 4
www.protekdevices.com
05155
Only One Name Means ProTek’Tion™
P0406FC3.3C - P0406FC36C
solDeR ReFlow inFoRMation
PRinteD CiRCuit BoaRD ReCoMMenDations
PaRaMeteR
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP (Entek Cu Plus 106A)
±50µm
±20µm
60 seconds
270°C
value
RequiReMents
Temperature:
T
P
for Lead-Free (Sn/Ag/Cu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
ReCoMMenDeD non-solDeR MasK
DeFineD PaD illustRation
non-solder Mask Defined Pad
0.275mm Dia.
solder Mask opening
0.325mm Dia.
solder stencil opening
0.330mm Dia.
Maximum solder Reflow
(35-53°C above Maximum solder Melt temp)
t
P
temperature - °C
Ramp-up
solder Melt
(Maximum temp)
Ramp-Down
Preheat
(stay Below Flux activation temp)
30-60 seconds
Ramp-up
15 seconds
(Minimize)
Page 5
solder-time
15-20 seconds
Ramp-Down
05155.R6 2/11
www.protekdevices.com
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