SMT POWER INDUCTORS
Shielded Drum Core - P1174 Series
Height:
2.8mm Max
Footprint:
6.7mm x 4.5mm Max
Current Rating:
up to 3.0A
Inductance Range:
1µH to 5000µH
Electrical Specifications @ 25°C — Operating Temperature -40°C to +130°C
Part
2,3
Number
P1174.102
P1174.152
P1174.222
P1174.332
P1174.472
P1174.682
P1174.103
P1174.153
P1174.223
P1174.333
P1174.473
P1174.683
P1174.104
P1174.154
P1174.224
P1174.334
P1174.474
P1174.604
P1174.684
P1174.105
P1174.335
P1174.505
Inductance
@ 0A
DC
(uH ±20%)
1.0
1.5
2.2
3.3
4.7
6.8
10
15
22
33
47
68
100
150
220
330
470
600
680
1000
3300
5000
Inductance
@ Irated
Typical
0.7
1.0
1.6
2.3
3.4
4.8
7.2
14
18
26
32
45
74
109
161
208
350
412
500
744
2300
4900
Irated
5
(A
DC
)
3
2.0
1.7
1.3
1.0
0.90
0.80
0.60
0.50
0.40
0.35
0.32
0.28
0.22
0.15
0.14
0.13
0.12
0.10
0.07
0.065
0.05
Ω
DCR (mΩ)
(MAX)
13
15
18
21
30
51
73
90
120
188
230
370
470
620
950
1340
1800
2550
2650
4000
11000
18500
Saturation
6
Current
-30% (A)
3
2.0
1.7
1.3
1.0
0.90
0.80
0.60
0.50
0.40
0.35
0.32
0.28
0.22
0.15
0.14
0.13
0.12
0.10
0.07
0.065
0.05
Heating
7
Current
+30°C (A)
3.0
2.8
1.8
1.6
1.4
1.2
1.0
0.8
0.7
0.6
0.5
0.4
0.3
0.26
0.22
0.20
0.19
0.18
0.17
0.15
0.09
0.05
Core Loss
8
Factor
(K2)
1600
1900
2300
3400
4100
4500
5400
6300
8000
10000
11000
14000
17000
21000
26000
32000
39000
43000
47000
57000
99000
130000
SRF
(MHz)
>40
>40
>40
>40
>40
34
31
25
20
16
14
11
9.0
8.0
6.0
5.0
3.9
3.7
3.6
2.6
1.6
1.2
NOTES FROM TABLE:
(See page 43)
Mechanical
.110
2,79 MAX
Schematic
Weight
. . . . . . . . 0.1 grams
Tape & Reel
. . . . . 2500/reel
Dimensions:
Inches
mm
Unless otherwise specified,
all tolerances are ± .010
0,25
SUGGESTED PAD LAYOUT
.180
4,57
1
2
XXX
.175
4,45 MAX
.265
6,73 MAX
.075
1,91
.039
0,98
TYPICAL INDUCTANCE
VS.
DC BIAS
1000.0
P1174.105
INDUCTANCE (µH)
.138
3,50
.315
8,00
100.0
P1174.104
10.0
P1174.103
.285
7,25
.630
16,00
1.0
P1174.102
0.1
0.30
0.80
1.30
1.80
2.30
2.80
3.30
3.80
4.30
0.25
0.10
0.15
0.20
0.05
0.00
TAPE & REEL LAYOUT
USER DIRECTION OF FEED
CURRENT (A)
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai
86 21 54643211 / 2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
www.pulseeng.com
31
SPM2007 (7/07)
SMT POWER INDUCTORS
Shielded Drum Core Series
Notes from Tables
(pages 27 - 42)
1. Unless otherwise specified, all testing is made at
100kHz, 0.1VAC.
2. Optional Tape & Reel packaging can be ordered by
adding a "T" suffix to the part number (i.e. P1166.102
becomes P1166.102T). Pulse complies with industry
standard Tape and Tape & Reel specification EIA481.
3. To order RoHS compliant part, add the suffix "NL"
to the part number (i.e. P1166.102 becomes
P1166.102NL
and
P1166.102T
becomes
P1166.102NLT).
4. Temperature of the component (ambient plus
temperature rise) must be within specified operating
temperature range.
5. The rated current (Irated) as listed is either the satura-
tion current or the heating current depending on which
value is lower.
6. The saturation current, Isat, is the current at which
the component inductance drops by the indicated
percentage (typical) at an ambient temperature of
25°C. This current is determined by placing the
component in the specified ambient environment and
applying a short duration pulse current (to eliminate
self-heating effects) to the component.
7. The heating current, Idc, is the DC current required
to raise the component temperature by the indicated
delta (approximately). The heating current is
determined by mounting the component on a
typical PCB and applying current for 30 minutes. The
temperature is measured by placing the thermocouple
on top of the unit under test.
Part No.
PG0085/86
PG0087
PG0040/41
P1174
PF0601
PF0464
PF0465
P1166
P1167
PF0560NL
P1168/69
P1170/71
P1172/73
PF0552NL
PF0553NL
Trise Factor
(K0 )
2.3
5.8
0.8
0.8
4.6
3.6
3.6
1.9
2.1
5.5
4.8
4.3
5.6
8.3
7.1
Core Loss Factor
(K1)
5.29E-10
15.2E-10
2.80E-10
6.47E-10
14.0E-10
24.7E-10
33.4E-10
29.6E-10
42.2E-10
136E-10
184E-10
201E-10
411E-10
201E-10
411E-10
8. In high volt*time (Et) or ripple current applications, addi-
tional heating in the component can occur due to core
losses in the inductor which may necessitate derating
the current in order to limit the temperature rise of the
component. In order to determine the approximate total
loss (or temperature rise) for a given application, both
copper losses and core losses should be taken into
account.
Estimated Temperature Rise:
Trise
= [Total loss (mW) / K0]
.833
(
o
C )
Total loss
= Copper loss + Core loss (mW)
Copper loss
= I
RMS
2
x DCR (Typical) (mW)
Irms
= [I
DC
2
+
ΔI
2
/12]
1/2
(A)
Core loss
= K1 x f (kHz)
1.23
x Bac(Ga)
2.38
(mW)
Bac (peak to peak flux density)
= K2 x
ΔI
(Ga)
[= K2/L(µH) x Et(V-µSec) (Ga)]
where f varies between 25kHz and 1MHz, and Bac is
less than 2500 Gauss.
K2 is a core size and winding dependant value and
is given for each p/n in the proceeding datasheets.
K0 & K1 are platform and material dependant constants
and are given in the table below for each platform.
Core Loss / K1 (mW)
3.00E+10
2.50E+10
2.00E+10
1.50E+10
1.00E+10
0.50E+10
0
0
CoreLoss/K1 Vs Flux Density
100KHz
200KHz
300KHz
400KHz
500KHz
700KHz
1.0MHz
500
1000
where
DB
= K2 x
DI
[= K2/L(µH) x Et(V-µSec)]
DB
(Gauss)
1500
2000
2500
Take note that the component's temperature rise varies depending on the system condition. It is suggested that the
component be tested at the system level, to verify the temperature rise of the component during system operation.
USA 858 674 8100
•
Germany 49 7032 7806 0
•
Singapore 65 6287 8998
•
Shanghai
86 21 54643211 / 2
•
China 86 755 33966678
•
Taiwan 886 3 4641811
www.pulseeng.com
43
SPM2007 (7/07)
ARM技术
