P4C1024
HIGH SPEED 128K x 8
DUAL CHIP ENABLE
CMOS STATIC RAM
FEATURES
High Speed (Equal Access and Cycle Times)
— 15/20/25/35 ns (Commercial/Industrial)
— 20/25/35/45/55/70/85/100/120 ns (Military)
Single 5 Volts ±10% Power Supply
Easy Memory Expansion Using
CE
1,
CE
2
and
OE
Inputs
Common Data I/O
Three-State Outputs
Fully TTL Compatible Inputs and Outputs
Advanced CMOS Technology
Fast t
OE
Automatic Power Down
Packages
—32-Pin 300 mil DIP and SOJ
—32-Pin 400 mil SOJ
—32-Pin 600 mil Ceramic DIP
—32-Pin 400 mil Ceramic DIP
—32-Pin Solder Seal Flatpack
—32-Pin LCC (450 x 550 mil)
—32-Pin LCC (400 x 820 mil) [Two-Sided]
—32-Pin Ceramic SOJ
DESCRIPTION
The P4C1024 is a 1,048,576-bit high-speed CMOS
static RAM organized as 128Kx8. The CMOS memory
requires no clocks or refreshing, and has equal access
and cycle times. Inputs are fully TTL-compatible. The
RAM operates from a single 5V±10% tolerance power
supply.
Access times of 15 nanoseconds permit greatly en-
hanced system operating speeds. CMOS is utilized to
reduce power consumption to a low level. The P4C1024
is a member of a family of PACE RAM™ products offer-
ing fast access times.
The P4C1024 device provides asynchronous operations
with matching access and cycle times. Memory loca-
tions are specified on address pins A
0
to A
16
. Reading
is accomplished by device selection (CE
1
low and CE
2
high) and output enabling (OE) while write enable (WE)
remains HIGH. By presenting the address under these
conditions, the data in the addressed memory location
is presented on the data input/output pins. The input/
output pins stay in the HIGH Z state when either
CE
1
or
OE
is HIGH or
WE
or CE
2
is LOW.
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
DIP (P300, C10, C11),
SOJ (J300, J400, CJ1),
LCC (L1),
SOLDER SEAL
FLATPACK (FS-3) SIMILAR
LCC (L6)
Document #
SRAM124
REV C
Revised December 2011
P4C1024
MAxIMUM RATINGS
(1)
Symbol
V
CC
Parameter
Power Supply Pin with
Respect to GND
Terminal Voltage with
Respect to GND
(up to 7.0V)
Operating Temperature
Value
–0.5 to +7
–0.5 to
V
CC
+0.5
–55 to +125
Unit
V
Symbol
T
BIAS
T
STG
P
T
I
OUT
Parameter
Temperature Under
Bias
Storage Temperature
Power Dissipation
DC Output Current
Value
–55 to +125
–65 to +150
1.0
50
Unit
°C
°C
W
mA
V
TERM
T
A
V
°C
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLy VOLTAGE
Grade
(2)
Military
Ambient
Temperature
GND
0V
0V
0V
V
CC
5.0V ± 10%
5.0V ± 10%
5.0V ± 10%
CAPACITANCES
(4)
Symbol
C
IN
C
OUT
V
CC
= 5.0V, T
A
= 25°C, f = 1.0MHz
Parameter
Input Capacitance
Conditions Typ. Unit
V
IN
= 0V
8
10
pF
pF
–55°C to +125°C
–40°C to +85°C
Industrial
Commercial
0°C to +70°C
Output Capacitance
V
OUT
= 0V
DC ELECTRICAL CHARACTERISTICS
Symbol
V
IH
V
IL
V
HC
V
LC
V
CD
V
OL
V
OH
I
LI
I
LO
Parameter
Input High Voltage
Input Low Voltage
CMOS Input High Voltage
CMOS Input Low Voltage
Over recommended operating temperature and supply voltage
(2)
Test Conditions
P4C1024
Min
Max
2.2
V
CC
+0.5
–0.5
(3)
–0.5
(3)
0.8
0.2
–1.2
0.4
2.4
–10
–5
–10
–5
___
___
+10
+5
+10
+5
35
30
25
20
2.4
–5
n/a
–5
n/a
___
___
+5
n/a
+5
n/a
25
n/a
P4C1024L
Unit
Min
Max
2.2
V
CC
+0.5
V
–0.5
(3)
–0.5
(3)
0.8
0.2
–1.2
0.4
V
V
V
V
V
V
µA
µA
mA
V
CC
–0.2
V
CC
+0.5
V
CC
–0.2
V
CC
+0.5
Input Clamp Diode Voltage V
CC
= Min., I
IN
= –18 mA
Output Low Voltage
I
OL
= +8 mA, V
CC
= Min.
(TTL Load)
Output High Voltage
I
OH
= –4 mA, V
CC
= Min.
(TTL Load)
V
CC
= Max.
Mil.
Input Leakage Current
V
IN
= GND to V
CC
Ind./Com’l.
Output Leakage Current
Standby Power Supply
Current (TTL Input Levels)
V
CC
= Max.,
CE
= V
IH
,
V
OUT
= GND to V
CC
Mil.
Ind./Com’l.
I
SB
CE
1
≥
V
IH
or
Mil.
CE
2
≤V
IL
,
Ind./Com’l.
V
CC
= Max,
f = Max., Outputs Open
CE
1
≥
V
HC
or
Mil.
CE
2
≤V
LC
,
Ind./Com’l.
V
CC
= Max,
f = 0, Outputs Open
V
IN
≤
V
LC
or V
IN
≥
V
HC
I
SB1
Standby Power Supply
Current
(CMOS Input Levels)
___
___
___
___
2
n/a
mA
Notes:
1. Stresses greater than those listed under
MAxIMuM RATINGS
may
cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification
is not implied. Exposure to MAxIMuM rating conditions for extended
periods may affect reliability.
2. Extended temperature operation guaranteed with 400 linear feet per
minute of air flow.
3. Transient inputs with V
IL
and I
IL
not more negative than –3.0V and
–100mA, respectively, are permissible for pulse widths up to 20 ns.
4. This parameter is sampled and not 100% tested.
Document #
SRAM124
REV C
Page 2 of 14
P4C1024
POWER DISSIPATION CHARACTERISTICS VS. SPEED
Symbol
Parameter
Temperature
Range
Commercial
I
CC
Dynamic
Operating
Current*
Industrial
Military
-15
190
N/A
N/A
-20
160
175
150
-25
150
165
140
-35
145
160
135
-45
N/A
155
130
-55
N/A
N/A
125
-70
N/A
N/A
115
-85
N/A
N/A
110
-100 -120
N/A
N/A
105
N/A
N/A
100
Unit
mA
mA
mA
*V
CC
= 5.5V. Tested with outputs open. f = Max. Switching inputs are 0V and 3V.
CE
1
= V
IL
, CE
2
= V
IH
,
OE
= V
IH
DATA RETENTION CHARACTERISTICS (P4C1024L, Military Temperature Only)
Symbol
V
DR
I
CCDR
t
CDR
t
R†
*
T
A
= +25°C
§
†
Parameter
V
CC
for Data Retention
Data Retention Current
Chip Deselect to
Data Retention Time
Operation Recovery Time
Test Condition
Min
2.0
Typ.*
V
CC
=
2.0V
3.0V
50
200
Max
V
CC
=
2.0V
3.0V
400
600
Unit
V
µA
ns
ns
CE
1
≥
V
CC
– 0.2V or
CE
2
≤
0.2V, V
IN
≥
V
CC
– 0.2V
or V
IN
≤
0.2V
t
RC§
0
t
RC
= Read Cycle Time
This parameter is guaranteed but not tested.
DATA RETENTION WAVEFORM
Document #
SRAM124
REV C
Page 3 of 14
P4C1024
AC ELECTRICAL CHARACTERISTICS—READ CyCLE
(V
CC
= 5V ± 10%, All Temperature Ranges)
(2)
-15
-20
-25
-35
-45
-55
-70
-85
-100
-120
Sym
Parameter
Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Unit
20
15
20
25
25
35
35
45
45
55
55
70
70
85
85
100
100
120
120
ns
ns
t
RC
t
AA
t
AC
t
OH
t
LZ
t
HZ
t
OE
t
OLZ
t
OHZ
t
PU
t
PD
Read Cycle Time 15
Address Access
Time
Chip Enable
Access Time
Output Hold from
Address Change
Chip Enable to
Output in Low Z
Chip Disable to
Output in High Z
Output Enable
Low to Data Valid
Output Enable
Low to Low Z
Output Enable
High to High Z
Chip Enable to
Power Up Time
Chip Disable
to Power Down
Time
15
20
25
35
45
55
70
85
100
120
ns
3
3
3
3
3
3
3
3
3
3
ns
3
3
3
3
3
3
3
3
3
3
ns
8
9
11
15
20
25
30
35
40
50
ns
7
9
11
15
20
25
30
35
40
50
ns
0
0
0
0
0
0
0
0
0
0
ns
7
9
11
15
20
25
30
35
40
50
ns
0
0
0
0
0
0
0
0
0
0
ns
12
20
20
20
25
30
35
40
45
50
ns
Document #
SRAM124
REV C
Page 4 of 14
P4C1024
TIMING WAVEFORM OF READ CyCLE NO. 1 (OE CONTROLLED)
(5)
TIMING WAVEFORM OF READ CyCLE NO. 2 (ADDRESS CONTROLLED)
(5,6)
TIMING WAVEFORM OF READ CyCLE NO. 3 (CE
1
, CE
2
CONTROLLED)
(5,7,10)
Notes:
5.
WE
is HIGH for READ cycle.
6.
CE
1
is LOW, CE
2
is HIGH and
OE
is LOW for READ cycle.
7. ADDRESS must be valid prior to, or coincident with
CE
1
transition
LOW and CE
2
transition HIGH.
8. Transition is measured ± 200 mV from steady state voltage prior
to change, with loading as specified in Figure 1. This parameter is
sampled and not 100% tested.
9. READ Cycle Time is measured from the last valid address to the first
transitioning address.
10. Transitions caused by a chip enable control have similar delays
irrespective of whether
CE
1
or CE
2
causes them.
Document #
SRAM124
REV C
Page 5 of 14
微控制器 MCU
