描述 |
OT PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 |
UV PLD, 20ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 |
OT PLD, 20ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24 |
Visible LED, |
OT PLD, 15ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24 |
OT PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 |
OT PLD, 20ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 |
OT PLD, 15ns, PAL-Type, CMOS, CDIP24, CERAMIC, DIP-24 |
OT PLD, 15ns, CMOS, PQCC28, PLASTIC, LCC-28 |
Reach Compliance Code |
unknown |
not_compliant |
not_compliant |
compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
unknown |
其他特性 |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
UL RECOGNIZED |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
端子数量 |
28 |
24 |
24 |
2 |
24 |
28 |
28 |
24 |
28 |
最高工作温度 |
75 °C |
125 °C |
125 °C |
85 °C |
125 °C |
125 °C |
125 °C |
125 °C |
85 °C |
最低工作温度 |
- |
-55 °C |
-55 °C |
-40 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-40 °C |
表面贴装 |
YES |
NO |
YES |
NO |
YES |
YES |
YES |
NO |
YES |
端子节距 |
1.27 mm |
2.54 mm |
1.27 mm |
2.5 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
1.27 mm |
零件包装代码 |
QLCC |
DIP |
DFP |
- |
DFP |
QLCC |
QLCC |
DIP |
QLCC |
包装说明 |
QCCJ, |
DIP, DIP24,.3 |
DFP, FL24,.4 |
- |
DFP, FL24,.4 |
CERAMIC, LCC-28 |
QCCN, LCC28,.45SQ |
DIP, DIP24,.3 |
QCCJ, |
针数 |
28 |
24 |
24 |
- |
24 |
28 |
28 |
24 |
28 |
最大时钟频率 |
50 MHz |
31.2 MHz |
31.2 MHz |
- |
50 MHz |
50 MHz |
31.2 MHz |
50 MHz |
50 MHz |
JESD-30 代码 |
S-PQCC-J28 |
R-GDIP-T24 |
R-GDFP-F24 |
- |
R-GDFP-F24 |
S-CQCC-N28 |
S-CQCC-N28 |
R-GDIP-T24 |
S-PQCC-J28 |
长度 |
11.5316 mm |
31.877 mm |
15.367 mm |
- |
15.367 mm |
11.43 mm |
11.43 mm |
31.877 mm |
11.5316 mm |
专用输入次数 |
11 |
11 |
11 |
- |
11 |
11 |
11 |
11 |
11 |
I/O 线路数量 |
10 |
10 |
10 |
- |
10 |
10 |
10 |
10 |
10 |
组织 |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
- |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
11 DEDICATED INPUTS, 10 I/O |
输出函数 |
MACROCELL |
MACROCELL |
MACROCELL |
- |
MACROCELL |
MACROCELL |
MACROCELL |
MACROCELL |
MACROCELL |
封装主体材料 |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
- |
CERAMIC, GLASS-SEALED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
封装代码 |
QCCJ |
DIP |
DFP |
- |
DFP |
QCCN |
QCCN |
DIP |
QCCJ |
封装形状 |
SQUARE |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
SQUARE |
SQUARE |
RECTANGULAR |
SQUARE |
封装形式 |
CHIP CARRIER |
IN-LINE |
FLATPACK |
- |
FLATPACK |
CHIP CARRIER |
CHIP CARRIER |
IN-LINE |
CHIP CARRIER |
可编程逻辑类型 |
OT PLD |
UV PLD |
OT PLD |
- |
OT PLD |
OT PLD |
OT PLD |
OT PLD |
OT PLD |
传播延迟 |
15 ns |
20 ns |
20 ns |
- |
15 ns |
15 ns |
20 ns |
15 ns |
15 ns |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
4.57 mm |
5.08 mm |
2.286 mm |
- |
2.286 mm |
1.9812 mm |
1.9812 mm |
5.08 mm |
4.57 mm |
最大供电电压 |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 |
4.5 V |
4.5 V |
4.5 V |
- |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 |
5 V |
5 V |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
5 V |
技术 |
CMOS |
CMOS |
CMOS |
- |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
COMMERCIAL EXTENDED |
MILITARY |
MILITARY |
- |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
INDUSTRIAL |
端子形式 |
J BEND |
THROUGH-HOLE |
FLAT |
- |
FLAT |
NO LEAD |
NO LEAD |
THROUGH-HOLE |
J BEND |
端子位置 |
QUAD |
DUAL |
DUAL |
- |
DUAL |
QUAD |
QUAD |
DUAL |
QUAD |
宽度 |
11.5316 mm |
7.62 mm |
9.652 mm |
- |
9.652 mm |
11.43 mm |
11.43 mm |
7.62 mm |
11.5316 mm |
是否Rohs认证 |
- |
不符合 |
不符合 |
符合 |
不符合 |
不符合 |
不符合 |
不符合 |
- |
ECCN代码 |
- |
3A001.A.2.C |
3A001.A.2.C |
- |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
- |
架构 |
- |
PAL-TYPE |
PAL-TYPE |
- |
PAL-TYPE |
PAL-TYPE |
PAL-TYPE |
PAL-TYPE |
- |
JESD-609代码 |
- |
e0 |
e0 |
- |
e0 |
e0 |
e0 |
e0 |
- |
输入次数 |
- |
22 |
22 |
- |
22 |
22 |
22 |
22 |
- |
输出次数 |
- |
10 |
10 |
- |
10 |
10 |
10 |
10 |
- |
产品条款数 |
- |
132 |
132 |
- |
132 |
132 |
132 |
132 |
- |
封装等效代码 |
- |
DIP24,.3 |
FL24,.4 |
- |
FL24,.4 |
LCC28,.45SQ |
LCC28,.45SQ |
DIP24,.3 |
- |
峰值回流温度(摄氏度) |
- |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
240 |
240 |
NOT SPECIFIED |
- |
电源 |
- |
5 V |
5 V |
- |
5 V |
5 V |
5 V |
5 V |
- |
筛选级别 |
- |
MIL-STD-883 |
MIL-STD-883 |
- |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
- |
端子面层 |
- |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) - hot dipped |
- |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) - hot dipped |
Tin/Lead (Sn/Pb) - hot dipped |
- |
处于峰值回流温度下的最长时间 |
- |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
30 |
30 |
NOT SPECIFIED |
- |
Base Number Matches |
- |
1 |
1 |
- |
1 |
1 |
1 |
1 |
- |