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PC48F3P0VBQ0

8M X 16 FLASH 1.8V PROM, 85 ns, PDSO56
8M × 16 FLASH 1.8V 可编程只读存储器, 85 ns, PDSO56

器件类别:存储   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

下载文档
器件参数
参数名称
属性值
功能数量
1
端子数量
56
最小工作温度
-40 Cel
最大工作温度
85 Cel
额定供电电压
1.8 V
最小供电/工作电压
1.7 V
最大供电/工作电压
2 V
加工封装描述
14 X 20 MM, LEAD FREE, TSOP-56
each_compli
Yes
欧盟RoHS规范
Yes
状态
Transferred
ype
NOR TYPE
sub_category
Flash Memories
ccess_time_max
85 ns
boot_block
BOTTOM
command_user_interface
YES
common_flash_interface
YES
data_polling
NO
jesd_30_code
R-PDSO-G56
jesd_609_code
e3
存储密度
1.34E8 bi
内存IC类型
FLASH
moisture_sensitivity_level
NOT SPECIFIED
umber_of_sectors_size
4,127
位数
8.39E6 words
位数
8M
操作模式
ASYNCHRONOUS
组织
8MX16
包装材料
PLASTIC/EPOXY
ckage_code
TSSOP
ckage_equivalence_code
TSSOP56,.8,20
包装形状
RECTANGULAR
包装尺寸
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
ge_size__words_
4
串行并行
PARALLEL
eak_reflow_temperature__cel_
260
wer_supplies__v_
1.8,1.8/3.3
gramming_voltage__v_
1.8
qualification_status
COMMERCIAL
seated_height_max
1.2 mm
sector_size__words_
16K,64K
standby_current_max
5.00E-6 Am
最大供电电压
0.0510 Am
表面贴装
YES
工艺
CMOS
温度等级
INDUSTRIAL
端子涂层
MATTE TIN
端子形式
GULL WING
端子间距
0.5000 mm
端子位置
DUAL
ime_peak_reflow_temperature_max__s_
40
ggle_bi
NO
length
18.4 mm
width
14 mm
dditional_feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
文档预览
Intel StrataFlash
®
Embedded Memory
(P30)
1-Gbit P30 Family
Datasheet
Product Features
Security
— 85/88 ns initial access
— One-Time Programmable Registers:
• 64 unique factory device identifier bits
— 40 MHz with zero wait states, 20 ns clock-to-
• 64 user-programmable OTP bits
data output synchronous-burst read mode
• Additional 2048 user-programmable OTP bits
— 25 ns asynchronous-page read mode
— Selectable OTP Space in Main Array:
— 4-, 8-, 16-, and continuous-word burst mode
• 4x32KB parameter blocks + 3x128KB main
— Buffered Enhanced Factory Programming
blocks (top or bottom configuration)
(BEFP) at 5 µs/byte (Typ)
— Absolute write protection: V
PP
= V
SS
— 1.8 V buffered programming at 7 µs/byte (Typ)
— Power-transition erase/program lockout
Architecture
— Individual zero-latency block locking
— Multi-Level Cell Technology: Highest Density
— Individual block lock-down
at Lowest Cost
Software
— Asymmetrically-blocked architecture
— 20 µs (Typ) program suspend
— Four 32-KByte parameter blocks: top or
— 20 µs (Typ) erase suspend
bottom configuration
— Intel
®
Flash Data Integrator optimized
— 128-KByte main blocks
— Basic Command Set and Extended Command
Voltage and Power
Set compatible
— V
CC
(core) voltage: 1.7 V – 2.0 V
— Common Flash Interface capable
— V
CCQ
(I/O) voltage: 1.7 V – 3.6 V
Density and Packaging
— Standby current: 55 µA (Typ) for 256-Mbit
— 64/128/256-Mbit densities in 56-Lead TSOP
— 4-Word synchronous read current:
package
13 mA (Typ) at 40 MHz
— 64/128/256/512-Mbit densities in 64-Ball
Quality and Reliability
Intel
®
Easy BGA package
— Operating temperature: –40 °C to +85 °C
• 1-Gbit in SCSP is –30 °C to +85 °C
— 64/128/256/512-Mbit and 1-Gbit densities in
Intel
®
QUAD+ SCSP
— Minimum 100,000 erase cycles per block
— 16-bit wide data bus
— ETOX™ VIII process technology (130 nm)
High performance
The Intel StrataFlash
®
Embedded Memory (P30) product is the latest generation of Intel
StrataFlash
®
memory devices. Offered in 64-Mbit up through 1-Gbit densities, the P30 device
brings reliable, two-bit-per-cell storage technology to the embedded flash market segment.
Benefits include more density in less space, high-speed interface, lowest cost-per-bit NOR
device, and support for code and data storage. Features include high-performance synchronous-
burst read mode, fast asynchronous access times, low power, flexible security options, and three
industry standard package choices.
The P30 product family is manufactured using Intel
®
130 nm ETOX™ VIII process technology.
Order Number: 306666, Revision: 001
April 2005
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not
finalize a design with this information.
StrataFlash® Embedded Memory (P30) Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing
your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at
http://www.intel.com.
Copyright © 2005, Intel Corporation
* Other names and brands may be claimed as the property of others.
April 2005
2
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
1-Gbit P30 Family
Contents
1.0 Introduction
...............................................................................................................................7
1.1
1.2
1.3
Nomenclature .......................................................................................................................7
Acronyms ..............................................................................................................................7
Conventions..........................................................................................................................8
2.0 Functional Overview
..............................................................................................................9
3.0 Package Information
............................................................................................................10
3.1
3.2
3.3
4.1
4.2
4.3
4.4
56-Lead TSOP Package .....................................................................................................10
64-Ball Easy BGA Package ................................................................................................12
QUAD+ SCSP Packages....................................................................................................13
Signal Ballout......................................................................................................................17
Signal Descriptions .............................................................................................................20
SCSP Configurations ..........................................................................................................22
Memory Maps .....................................................................................................................24
4.0 Ballout and Signal Descriptions
......................................................................................17
5.0 Maximum Ratings and Operating Conditions
...........................................................29
5.1
5.2
6.1
6.2
7.1
7.2
7.3
7.4
7.5
8.1
8.2
8.3
9.1
Absolute Maximum Ratings ................................................................................................29
Operating Conditions ..........................................................................................................30
DC Current Characteristics .................................................................................................31
DC Voltage Characteristics.................................................................................................32
AC Test Conditions.............................................................................................................33
Capacitance ........................................................................................................................34
AC Read Specifications ......................................................................................................35
AC Write Specifications ......................................................................................................41
Program and Erase Characteristics ....................................................................................45
Power Up and Down ...........................................................................................................46
Reset Specifications ...........................................................................................................46
Power Supply Decoupling...................................................................................................47
Bus Operations ...................................................................................................................48
9.1.1 Reads ....................................................................................................................48
9.1.2 Writes.....................................................................................................................49
9.1.3 Output Disable .......................................................................................................49
9.1.4 Standby..................................................................................................................49
9.1.5 Reset .....................................................................................................................49
Device Commands .............................................................................................................50
Command Definitions .........................................................................................................51
6.0 Electrical Specifications
.....................................................................................................31
7.0 AC Characteristics
................................................................................................................33
8.0 Power and Reset Specifications
.....................................................................................46
9.0 Device Operations
.................................................................................................................48
9.2
9.3
Datasheet
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
April 2005
3
1-Gbit P30 Family
10.0 Read Operations
.................................................................................................................... 53
10.1
10.2
10.3
Asynchronous Page-Mode Read........................................................................................ 53
Synchronous Burst-Mode Read.......................................................................................... 53
Read Configuration Register .............................................................................................. 54
10.3.1 Read Mode ............................................................................................................ 55
10.3.2 Latency Count........................................................................................................ 55
10.3.3 WAIT Polarity......................................................................................................... 57
10.3.4 Data Hold............................................................................................................... 58
10.3.5 WAIT Delay............................................................................................................ 59
10.3.6 Burst Sequence ..................................................................................................... 59
10.3.7 Clock Edge ............................................................................................................ 59
10.3.8 Burst Wrap............................................................................................................. 59
10.3.9 Burst Length .......................................................................................................... 60
Word Programming............................................................................................................. 61
11.1.1 Factory Word Programming................................................................................... 62
Buffered Programming........................................................................................................ 62
Buffered Enhanced Factory Programming ......................................................................... 63
11.3.1 BEFP Requirements and Considerations .............................................................. 64
11.3.2 BEFP Setup Phase................................................................................................ 64
11.3.3 BEFP Program/Verify Phase ................................................................................. 64
11.3.4 BEFP Exit Phase ................................................................................................... 65
Program Suspend............................................................................................................... 65
Program Resume................................................................................................................ 66
Program Protection............................................................................................................. 66
Block Erase......................................................................................................................... 67
Erase Suspend ................................................................................................................... 67
Erase Resume .................................................................................................................... 68
Erase Protection ................................................................................................................. 68
Block Locking...................................................................................................................... 69
13.1.1 Lock Block ............................................................................................................. 69
13.1.2 Unlock Block .......................................................................................................... 69
13.1.3 Lock-Down Block ................................................................................................... 69
13.1.4 Block Lock Status .................................................................................................. 70
13.1.5 Block Locking During Suspend.............................................................................. 70
Selectable One-Time Programmable Blocks...................................................................... 71
Protection Registers ........................................................................................................... 72
13.3.1 Reading the Protection Registers .......................................................................... 73
13.3.2 Programming the Protection Registers.................................................................. 73
13.3.3 Locking the Protection Registers ........................................................................... 74
Read Status Register.......................................................................................................... 75
14.1.1 Clear Status Register............................................................................................. 76
Read Device Identifier ........................................................................................................ 76
11.0 Programming Operations
.................................................................................................. 61
11.1
11.2
11.3
11.4
11.5
11.6
12.1
12.2
12.3
12.4
13.1
12.0 Erase Operations
................................................................................................................... 67
13.0 Security Modes
....................................................................................................................... 69
13.2
13.3
14.0 Special Read States
............................................................................................................. 75
14.1
14.2
April 2005
4
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
1-Gbit P30 Family
14.3
CFI Query ...........................................................................................................................77
Appendix A
Appendix B
Appendix C
Appendix D
Appendix E
Appendix F
Write State Machine
..........................................................................................78
Flowcharts
............................................................................................................85
Common Flash Interface
................................................................................93
Additional Information
................................................................................... 100
Ordering Information for Discrete Products
........................................ 101
Ordering Information for SCSP Products
..............................................102
Datasheet
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
April 2005
5
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