型号
- 型号
- 关键词
LOW-VOLTAGE TRANSLATING 16-BIT I
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：NXP(恩智浦)
厂商官网：https://www.nxp.com
器件标准：
| 型号 | PCAL6416AEX1Z | PCAL6416AHF118 | PCAL6416AEVJ | PCAL6416AEXX | PCAL6416APW,118 |
|---|---|---|---|---|---|
| 描述 | LOW-VOLTAGE TRANSLATING 16-BIT I | Interface - I/O Expanders PCAL6416AHF/HWQFN24/REEL13// | Translation - Voltage Levels DUAL-BIT DUAL SUPPLY TRANSCEIVER | Ferrite Beads 220ohms GHz HiSpd | IC I/O EXPANDER 16BIT 24TSSOP |
| Brand Name | NXP Semiconductor | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | VFLGA, | - | VFBGA, BGA24,5X5,20 | VFBGA, BGA24,5X5,16 | TSSOP, TSSOP24,.25 |
| 制造商包装代码 | SOT1895-1 | - | SOT1199-1 | SOT1342-1 | SOT355-1 |
| Reach Compliance Code | compliant | - | compliant | compliant | compliant |
| JESD-30 代码 | S-PBGA-B24 | - | S-PBGA-B24 | S-PBGA-B24 | R-PDSO-G24 |
| 长度 | 2 mm | - | 3 mm | 2 mm | 7.8 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 |
| I/O 线路数量 | 16 | - | 16 | 16 | 16 |
| 端口数量 | 2 | - | 2 | 2 | 2 |
| 端子数量 | 24 | - | 24 | 24 | 24 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFLGA | - | VFBGA | VFBGA | TSSOP |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | 260 | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 0.4 mm | - | 1 mm | 0.5 mm | 1.1 mm |
| 最大供电电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 1.65 V | - | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BUTT | - | BALL | BALL | GULL WING |
| 端子节距 | 0.4 mm | - | 0.5 mm | 0.4 mm | 0.65 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 2 mm | - | 3 mm | 2 mm | 4.4 mm |
| uPs/uCs/外围集成电路类型 | PARALLEL IO PORT, GENERAL PURPOSE | - | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
| 零件包装代码 | - | - | BGA | BGA | TSSOP2 |
| 针数 | - | - | 24 | 24 | 24 |
| 位数 | - | - | 16 | 16 | 16 |
| 封装等效代码 | - | - | BGA24,5X5,20 | BGA24,5X5,16 | TSSOP24,.25 |
| 电源 | - | - | 1.8/5 V | 1.8/5 V | 1.8/5 V |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified |
嵌入式系统
单片机
嵌入式系统
WindowsCE
DSP 与 ARM 处理器
测试/测量
