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PCB80C51BH-2H

CMOS single-chip 8-bit microcontrollers

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Philips Semiconductors (NXP Semiconductors N.V.)

厂商官网:https://www.nxp.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Philips Semiconductors (NXP Semiconductors N.V.)
包装说明
QFP, QFP44,.5SQ,32
Reach Compliance Code
unknow
位大小
8
CPU系列
8051
JESD-30 代码
S-PQFP-G44
JESD-609代码
e0
端子数量
44
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装等效代码
QFP44,.5SQ,32
封装形状
SQUARE
封装形式
FLATPACK
电源
5 V
认证状态
Not Qualified
RAM(字节)
128
ROM(单词)
4096
ROM可编程性
MROM
速度
12 MHz
最大压摆率
19 mA
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
0.8 mm
端子位置
QUAD
文档预览
INTEGRATED CIRCUITS
80C31/80C51/87C51
CMOS single-chip 8-bit microcontrollers
Product specification
IC20 Data Handbook
1996 Aug 16
Philips
Semiconductors
Philips Semiconductors
Product specification
CMOS single-chip 8-bit microcontrollers
80C31/80C51/87C51
DESCRIPTION
The Philips 80C31/80C51/87C51 is a high-performance
microcontroller fabricated with Philips high-density CMOS
technology. The CMOS 8XC51 is functionally compatible with the
NMOS 8031/8051 microcontrollers. The Philips CMOS technology
combines the high speed and density characteristics of HMOS with
the low power attributes of CMOS. Philips epitaxial substrate
minimizes latch-up sensitivity.
The 8XC51 contains a 4k
×
8 ROM (80C51) EPROM (87C51), a 128
×
8 RAM, 32 I/O lines, two 16-bit counter/timers, a five-source,
two-priority level nested interrupt structure, a serial I/O port for either
multi-processor communications, I/O expansion or full duplex UART,
and on-chip oscillator and clock circuits.
In addition, the device has two software selectable modes of power
reduction—idle mode and power-down mode. The idle mode freezes
the CPU while allowing the RAM, timers, serial port, and interrupt
system to continue functioning. The power-down mode saves the
RAM contents but freezes the oscillator, causing all other chip
functions to be inoperative.
PIN CONFIGURATIONS
P1.0 1
P1.1 2
P1.2 3
P1.3 4
P1.4 5
P1.5 6
P1.6 7
P1.7 8
RST 9
RxD/P3.0 10
TxD/P3.1 11
INT0/P3.2 12
INT1/P3.3 13
T0/P3.4 14
CERAMIC
AND
PLASTIC
DUAL
IN-LINE
PACKAGE
40 V
CC
39 P0.0/AD0
38 P0.1/AD1
37 P0.2/AD2
36 P0.3/AD3
35 P0.4/AD4
34 P0.5/AD5
33 P0.6/AD6
32 P0.7/AD7
31 EA/V
PP
30 ALE/PROG
29 PSEN
28 P2.7/A15
27 P2.6/A14
26 P2.5/A13
25 P2.4/A12
24 P2.3/A11
23 P2.2/A10
22 P2.1/A9
21 P2.0/A8
FEATURES
T1/P3.5 15
WR/P3.6 16
RD/P3.7 17
XTAL2 18
XTAL1 19
V
SS
20
8031/8051 compatible
4k
×
8 ROM (80C51)
4k
×
8 EPROM (87C51)
ROMless (80C31)
128
×
8 RAM
Two 16-bit counter/timers
Full duplex serial channel
Boolean processor
6
1
40
Memory addressing capability
64k ROM and 64k RAM
7
CERAMIC
AND
PLASTIC
LEAD
CHIP
CARRIER
39
Power control modes:
Idle mode
Power-down mode
17
29
CMOS and TTL compatible
Five speed ranges at V
CC
= 5V
12MHz
16MHz
24MHz
33MHz
1
18
28
44
34
33
PLASTIC
QUAD
FLAT
PACK
Five package styles
Extended temperature ranges
OTP package available
11
23
12
22
SU00001
SEE PAGE 3 FOR QFP AND LCC PIN FUNCTIONS.
1996 Aug 16
2
853–0169 17187
Philips Semiconductors
Product specification
CMOS single-chip 8-bit microcontrollers
80C31/80C51/87C51
CERAMIC AND PLASTIC LEADED CHIP CARRIER
PIN FUNCTIONS
6
1
40
PLASTIC QUAD FLAT PACK
PIN FUNCTIONS
44
34
7
39
1
LCC
33
PQFP
17
29
11
23
18
28
12
Pin
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Function
P2.7/A15
PSEN
ALE/PROG
NC*
EA/V
PP
P0.7/AD7
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
CC
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Function
P1.5
P1.6
P1.7
RST
P3.0/RxD
NC*
P3.1/TxD
P3.2/INT0
P3.3/INT1
P3.4/T0
P3.5/T1
P3.6/WR
P3.7/RD
XTAL2
XTAL1
Pin
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Function
V
SS
NC*
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
P2.7/A15
PSEN
22
Pin
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Function
P0.6/AD6
P0.5/AD5
P0.4/AD4
P0.3/AD3
P0.2/AD2
P0.1/AD1
P0.0/AD0
V
CC
NC*
P1.0
P1.1
P1.2
P.13
P1.4
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Function
NC*
P1.0
P1.1
P1.2
P1.3
P1.4
P1.5
P1.6
P1.7
RST
P3.0/RxD
NC*
P3.1/TxD
P3.2/INT0
P3.3/INT1
Pin
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Function
P3.4/T0
P3.5/T1
P3.6/WR
P3.7/RD
XTAL2
XTAL1
V
SS
NC*
P2.0/A8
P2.1/A9
P2.2/A10
P2.3/A11
P2.4/A12
P2.5/A13
P2.6/A14
ALE/PROG
NC*
EA/V
PP
P0.7/AD7
* DO NOT CONNECT
SU00002
* DO NOT CONNECT
SU00003
LOGIC SYMBOL
V
CC
XTAL1
PORT 0
ADDRESS AND
DATA BUS
V
SS
XTAL2
SECONDARY FUNCTIONS
RST
EA/V
PP
PSEN
ALE/PROG
RxD
TxD
INT0
INT1
T0
T1
WR
RD
PORT 3
PORT 2
PORT 1
ADDRESS BUS
SU00004
1996 Aug 16
3
Philips Semiconductors
Product specification
CMOS single-chip 8-bit microcontrollers
80C31/80C51/87C51
ORDERING INFORMATION
PHILIPS NORTH AMERICA
EPROM
SC87C51CCF40
SC87C51CCK44
SC87C51CCN40
SC87C51CCA44
SC87C51CCB44
SC87C51ACF40
SC87C51ACN40
SC87C51ACA44
SC87C51ACB44
SC87C51CGF40
SC87C51CGK44
SC87C51CGN40
SC87C51CGA44
SC87C51CGB44
SC87C51AGF40
SC87C51AGN40
SC87C51AGA44
SC87C51AGB44
DRAWING
NUMBER
DRAWING
NUMBER
ROMless
ROM
TEMPERATURE RANGE
o
C
AND PACKAGE
1
0 to +70, Ceramic Dual In-line Package, UV
0 to +70, Ceramic Leaded Chip Carrier, UV
Freq
MHz
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 12
3.5 to 16
3.5 to 16
3.5 to 16
3.5 to 16
3.5 to 16
3.5 to 16
3.5 to 16
3.5 to 16
3.5 to 16
0590B
1472A
SOT129-1
SOT187-2
SOT307-2
SC80C31BCCN40
SC80C31BCCA44
SC80C31BCCB44
SC80C51BCCN40
SC80C51BCCA44
SC80C51BCCB44
SOT129-1
SOT187-2
SOT307-2
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
0 to +70, Plastic Quad Flat Pack, OTP
–40 to +85, Ceramic Dual In-line Package, UV
0590B
SOT129-1
SOT187-2
SOT307-2
SC80C31BACN40
SC80C31BACA44
SC80C31BACB44
SC80C51BACN40
SC80C51BACA44
SC80C51BACB44
SOT129-1
SOT187-2
SOT307-2
–40 to +85, Plastic Dual In-line Package, OTP
–40 to +85, Plastic Leaded Chip Carrier, OTP
–40 to +85, Plastic Quad Flat Pack, OTP
0 to +70, Ceramic Dual In-line Package, UV
0 to +70, Ceramic Leaded Chip Carrier, UV
0590B
1472A
SOT129-1
SOT187-2
SOT307-2
SC80C31BCGN40
SC80C31BCGA44
SC80C31BCGB44
SC80C51BCGN40
SC80C51BCGA44
SC80C51BCGB44
SOT129-1
SOT187-2
SOT307-2
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
0 to +70, Plastic Quad Flat Pack, OTP
–40 to +85, Ceramic Dual In-line Package, UV
0590B
SOT129-1
SOT187-2
SOT307-2
SC80C31BAGN40
SC80C31BAGA44
SC80C31BAGB44
SC80C51BAGN40
SC80C51BAGA44
SC80C51BAGB44
SOT129-1
SOT187-2
SOT307-2
–40 to +85, Plastic Dual In-line Package, OTP
–40 to +85, Plastic Leaded Chip Carrier, OTP
–40 to +85, Plastic Quad Flat Pack, OTP
SC87C51CPF40
SC87C51CPK44
SC87C51CPN40
SC87C51CPA44
0590B
1472A
SOT129-1
SOT187-2
0 to +70, Ceramic Dual In-line Package, UV
0 to +70, Ceramic Leaded Chip Carrier, UV
SC80C31BCPN40
SC80C31BCPA44
SC80C51BCPN40
SC80C51BCPA44
SOT129-1
SOT187-2
3.5 to 24
3.5 to 24
3.5 to 24
3.5 to 24
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
SC87C51APF40
SC87C51APN40
SC87C51APA44
0590B
SOT129-1
SOT187-2
–40 to +85, Ceramic Dual In-line Package, UV
SC80C31BAPN40
SC80C31BAPA44
SC80C51BAPN40
SC80C51BAPA44
SOT129-1
SOT187-2
–40 to +85, Plastic Dual In-line Package, OTP
–40 to +85, Plastic Leaded Chip Carrier, OTP
3.5 to 24
3.5 to 24
SC87C51CYF40
SC87C51CYK44
SC87C51CYN40
SC87C51CYA44
0590B
1472A
SOT129-1
SOT187-2
0 to +70, Ceramic Dual In-line Package, UV
0 to +70, Ceramic Leaded Chip Carrier, UV
SC80C31BCYN40
SC80C31BCYA44
SC80C51BCYN40
SC80C51BCYA44
SOT129-1
SOT187-2
3.5 to 33
3.5 to 33
3.5 to 33
3.5 to 33
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
1. OTP = One Time Programmable EPROM. UV = UV Erasable EPROM
2. SOT311 replaced by SOT307-2.
1996 Aug 16
4
Philips Semiconductors
Product specification
CMOS single-chip 8-bit microcontrollers
80C31/80C51/87C51
ORDERING INFORMATION
(Continued)
PHILIPS
ROMless
(ORDER NUMBER)
ROMless
(MARKING NUMBER)
ROM
DRAWING
NUMBER
TEMPERATURE RANGE
o
C
AND PACKAGE
1
Freq
MHz
PCB80C31-2 N
PCB80C31-2 A
PCB80C31BH2-12P
PCB80C51BH-2P
SOT129-1
SOT187-2
SOT307-2
2
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
0 to +70, Plastic Quad Flat Pack, OTP
0.5 to 12
0.5 to 12
0.5 to 12
PCB80C31BH2-12WP PCB80C51BH-2WP
PCB80C31BH2-12H
PCB80C51BH-2H
PCB80C31-3 N
PCB80C31-3 A
PCB80C31BH3-16P
PCB80C51BH-3P
SOT129-1
SOT187-2
SOT307-2
2
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
0 to +70, Plastic Quad Flat Pack, OTP
1.2 to 16
1.2 to 16
1.2 to 16
PCB80C31BH3-16WP PCB80C51BH-3WP
PCB80C31BH3-16H
PCB80C51BH-3H
PCF80C31-3 N
PCF80C31-3 A
PCF80C31BH3-16P
PCF80C31BH3-16WP
PCF80C31BH3-16H
PCA80C31BH3-16P
PCF80C51BH-3P
PCF80C51BH-3WP
PCF80C51BH-3H
PCA80C51BH-3P
SOT129-1
SOT187-2
SOT307-2
2
SOT129-1
SOT187-2
–40 to +85, Plastic Dual In-line Package, OTP
–40 to +85, Plastic Leaded Chip Carrier, OTP
–40 to +85, Plastic Quad Flat Pack, OTP
–40 to +125, Plastic Dual In-line Package
–40 to +125, Plastic Leaded Chip Carrier
1.2 to 16
1.2 to 16
1.2 to 16
1.2 to 16
1.2 to 16
PCA80C31BH3-16WP PCA80C51BH-3WP
PCB80C31-4 N
PCB80C31-4 A
PCB80C31BH4-24P
PCB80C51BH-4P
SOT129-1
SOT187-2
SOT307-2
2
0 to +70, Plastic Dual In-line Package, OTP
0 to +70, Plastic Leaded Chip Carrier, OTP
0 to +70, Plastic Quad Flat Pack, OTP
1.2 to 24
1.2 to 24
1.2 to 24
PCB80C31BH4-24WP PCB80C51BH-4WP
PCB80C31BH4-24H
PCB80C51BH-4H
PCF80C31-4 N
PCF80C31-4 A
PCF80C31BH4-24P
PCF80C31BH4-24WP
PCF80C31BH4-24H
PCF80C51BH-4P
PCF80C51BH-4WP
PCF80C51BH-4H
SOT129-1
SOT187-2
SOT307-2
2
–40 to +85, Plastic Dual In-line Package, OTP
–40 to +85, Plastic Leaded Chip Carrier, OTP
–40 to +85, Plastic Leaded Chip Carrier, OTP
1.2 to 24
1.2 to 24
1.2 to 24
PCB80C31-5 N
PCB80C31-5 A
PCB80C31-5 B
PCB80C31BH5-30P
PCB80C51BH-5P
SOT129-1
SOT187-2
SOT307-2
2
0 to +70, Plastic Dual In-line Package
0 to +70, Plastic Leaded Chip Carrier
0 to +70, Plastic Quad Flat Pack
1.2 to 33
1.2 to 33
1.2 to 33
PCB80C31BH5-30WP PCB80C51BH-5WP
PCB80C31BH5-30H
PCB80C51BH-5H
1996 Aug 16
5
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