PCNM
www.vishay.com
Vishay Dale Thin Film
High Power Aluminum Nitride, Wraparound Surface Mount,
Precision Thin Film Non-Magnetic Chip Resistor (Up to 6 W)
FEATURES
• High thermal conductivity aluminum nitride substrate
• Power rating up to 6.0 W
• Resistance range 2
Ω
to 30.1 kΩ
• Resistor tolerance to ± 0.1 %
• TCR to ± 25 ppm/°C
• Flame resistant UL 94 V-0
APPLICATIONS
LINKS TO ADDITIONAL RESOURCES
• Power supplies
• Power switching
• Braking system
D
D
3
3
3D Models
PCNM series chip resistors are designed on aluminum
nitride ceramic substrates with enlarged backside
terminations to reduce the thermal resistance between the
topside resistor layer and the solder joint on the end users
circuit assembly.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the heat is critical to the overall
performance of the device.
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Power Rating: Resistor
Stability: Absolute
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
Note
(1)
Dependent on component mounting by user
SPECIFICATIONS
Nichrome
2
Ω
to 30.1 kΩ
25 ppm/°C (standard) and 100 ppm/°C
0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 %
0.5 W to 6.0 W
ΔR
1.0 %
< 0.1 ppm/V
75 V to 100 V
-55 °C to +155 °C
-55 °C to +155 °C
< -30 dB
± 0.01 %
(1)
CONDITIONS
-
-
-
-55 °C to +150 °C
Maximum at +70 °C
1000 h at +70 °C
-
-
-
-
-
1 year at +25 °C
COMPONENT RATINGS
CASE SIZE
1206
2512
POWER RATING (mW)
2000
(1)
WORKING VOLTAGE (V)
100
100
RESISTANCE RANGE (Ω)
2 to 30.1K
2 to 30.1K
6000
(1)
Notes
• 0603 and 0805 case size under engineering qualification
(1)
Dependent on component mounting by user
Revision: 05-Jan-2022
Document Number: 60130
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
ENVIRONMENTAL TESTS
ENVIRONMENTAL TEST
(1)
Resistance temperature characteristic
Maximum ambient temperature at rated wattage
Maximum ambient temperature at power derating
Thermal shock
Low temperature operation
Short time overload
High temperature exposure
Resistance to soldering heat
Moisture resistance
Life at +70 °C for 1000 h
TEST LIMITS
± 25 ppm/°C
+70 °C
+150 °C
± 0.25 %
± 0.25 %
± 0.5 %
± 0.2 %
± 0.25 %
± 0.4 %
± 1.00 %
TYPICAL VISHAY
PERFORMANCE
± 15 ppm/°C
+70 °C
+150 °C
± 0.10 %
± 0.01 %
± 0.2 %
± 0.05 %
± 0.02 %
± 0.01 %
± 0.02 %
Note
(1)
Environmental testing was performed based on MIL-STD-202 standard test methods
DIMENSIONS
in inches
D
T
D
W
E
L
L
T
CASE SIZE
1206
2512
LENGTH
L
0.126 ± 0.008
0.259 + 0.009 / - 0.015
WIDTH
W
0.063 ± 0.005
0.124 ± 0.005
THICKNESS
T
MIN./MAX.
0.015 ± 0.003
0.015 ± 0.003
TOP PAD
D
0.020 + 0.005 / - 0.010
0.020 ± 0.005
BOTTOM PAD
E
0.040 ± 0.005
0.050 ± 0.005
LAND PATTERN DIMENSIONS
in inches
1206 Land Pattern
0.1730
0.0710
2512 Land Pattern
0.2910
0.0220
0.0755
0.1260
0.1090
0.0910
STANDARD MATERIAL SPECIFICATIONS
Resistive element
Substrate material
Terminations (tin / lead)
Terminations (lead (Pb)-free)
Nichrome
Aluminum nitride
Tin / lead solder over copper
Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over copper
Revision: 05-Jan-2022
Document Number: 60130
2
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
PCNM2512 CHIP TEMP VS. APPLIED POWER
16.0
10
Ω
14.0
12.0
Applied Power (W)
PCAN1206 CHIP TEMP VS. APPLIED POWER
12.0
10.0
Applied Power (W)
1000
Ω
100
Ω
10
Ω
1000
Ω
10 000
Ω
100
Ω
8.0
10.0
8.0
6.0
4.0
6.0
4.0
2.0
2.0
0.0
0.0
70
150
Chip
Surface
Temperature Temperature (°C)
200
70
150
Chip
Surface
Temperature Temperature (°C)
200
Notes
• Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C
• Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full
range of power levels
• Thermal imaging and load life testing was conducted mounting one device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both
surfaces. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces of the test card
DERATING CURVE
100
Percent of Rated Power
80
60
40
20
0
0
70
125
155
Ambient Temperature °C
PULSE HANDLING RESULTS
100
100
Ω
- 2512
Peak Power (W)
10
100
Ω
- 1206
1
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Duration (s)
Revision: 05-Jan-2022
Document Number: 60130
3
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PCNM
www.vishay.com
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: PCNM1206H1000BBT1
Vishay Dale Thin Film
P
GLOBAL
MODEL
PCNM
C
CASE
SIZE
1206
2512
N
M
1
2
0
6
H
1
0
0
0
B
B
T
1
TCR
CHARACTERISTIC
E
= ± 25 ppm/°C
(1)
H
= ± 50 ppm/°C
(1)
K
= ± 100 ppm/°C
RESISTANCE
The first 3 digits are
significant figures and
the last digit specifies
the number of zeros
to follow.
“R” designates the
decimal point.
Example:
10R0
= 10
Ω
1000
= 100
Ω
TOLERANCE
B
= ± 0.1 %
(1)
C
= ± 0.25 %
(1)
D
= ± 0.5 %
(1)
F
= ± 1.0 %
G
= ± 2.0 %
TERMINATION
B
= wraparound
Sn/Pb solder
w/ nickel barrier
S
= wraparound
lead (Pb)-free
solder (e1)
RoHS compliant
PACKAGING
BS
= BULK
100 min., 1 mult.
WS
= WAFFLE
100 min., 1 mult.
W0
= 100 pc min. waffle,
1 mult.
WI
= 100 min., 1 mult.
(package unit single lot
date code)
TAPE AND REEL
T0
= 100 min., 100 mult.
T1
= 1000 min., 1000 mult.
T3
= 300 min., 300 mult.
T5
= 500 min., 500 mult.
TF
= full reel
TS
= 100 min., 1 mult.
TI
= 100 min., 1 mult.
(item single lot date code)
TP
= 100 min., 1 mult.
(package unit single lot
date code)
Note
(1)
Available on 10
Ω
and higher; less than 10
Ω
100 ppm/°C and 1 % tolerance best
Revision: 05-Jan-2022
Document Number: 60130
4
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
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Revision: 09-Jul-2021
1
Document Number: 91000
