首页 > 器件类别 > 无源元件 > 电阻器

PCNM1206K2460DBTI

Fixed Resistor, Thin Film, 2W, 246ohm, 100V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

下载文档
器件参数
参数名称
属性值
是否Rohs认证
不符合
Objectid
145045338651
包装说明
CHIP
Reach Compliance Code
unknown
Country Of Origin
USA
ECCN代码
EAR99
YTEOL
5.93
其他特性
FLAME PROOF, PRECISION
构造
Rectangular
JESD-609代码
e0
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.381 mm
封装长度
3.2004 mm
封装形式
SMT
封装宽度
1.6002 mm
包装方法
TR
额定功率耗散 (P)
2 W
额定温度
70 °C
电阻
246 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
1206
表面贴装
YES
技术
THIN FILM
温度系数
100 ppm/°C
端子面层
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
0.5%
工作电压
100 V
文档预览
PCNM
www.vishay.com
Vishay Dale Thin Film
High Power Aluminum Nitride, Wraparound Surface Mount,
Precision Thin Film Non-Magnetic Chip Resistor (up to 6 W)
FEATURES
High thermal conductivity aluminum nitride substrate
Power rating up to 6.0 W
Resistance range 2
to 30.1 k
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
APPLICATIONS
PCNM series chip resistors are designed on aluminum
nitride ceramic substrates with enlarged backside
terminations to reduce the thermal resistance between the
topside resistor layer and the solder joint on the end users
circuit assembly.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the heat is critical to the overall
performance of the device.
• Power supplies
• Power switching
• Braking system
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Power Rating: Resistor
Stability: Absolute
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
Note
(1)
Dependant on component mounting by user
SPECIFICATIONS
Nichrome
2
to 30.1 k
25 ppm/°C (standard) and 100 ppm/°C
0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 %
0.5 W to 6.0 W
(1)
R
1.0 %
< 0.1 ppm/V
75 V to 100 V
-55 °C to +155 °C
-55 °C to +155 °C
< -30 dB
± 0.01 %
CONDITIONS
-
-
-
-55 °C to +150 °C
Maximum at +70 °C
1000 h at +70 °C
-
-
-
-
-
1 year at +25 °C
COMPONENT RATINGS
CASE SIZE
1206
2512
POWER RATING (mW)
2000
(1)
6000
(1)
WORKING VOLTAGE (V)
100
100
RESISTANCE RANGE ()
2 to 30.1K
2 to 30.1K
Notes
• 0603 and 0805 case size under engineering qualification
(1)
Dependant on component mounting by user
Revision: 08-May-2018
Document Number: 60130
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
ENVIRONMENTAL TESTS
ENVIRONMENTAL TEST
(1)
Resistance temperature characteristic
Maximum ambient temperature at rated wattage
Maximum ambient temperature at power derating
Thermal shock
Low temperature operation
Short time overload
High temperature exposure
Resistance to soldering heat
Moisture resistance
Life at +70 °C for 1000 h
TEST LIMITS
± 25 ppm/°C
+70 °C
+150 °C
± 0.25 %
± 0.25 %
± 0.5 %
± 0.2 %
± 0.25 %
± 0.4 %
± 1.00 %
TYPICAL VISHAY
PERFORMANCE
± 15 ppm/°C
+70 °C
+150 °C
± 0.10 %
± 0.01 %
± 0.2 %
± 0.05 %
± 0.02 %
± 0.01 %
± 0.02 %
Note
(1)
Environmental testing was performed based on MIL-STD-202 Standard Test Methods
DIMENSIONS
in inches
D
T
D
W
E
L
L
T
CASE SIZE
1206
2512
LENGTH
L
0.126 ± 0.008
0.259 + 0.009 / - 0.015
WIDTH
W
0.063 ± 0.005
0.124 ± 0.005
THICKNESS
T
MIN./MAX.
0.015 ± 0.003
0.015 ± 0.003
TOP PAD
D
0.020 + 0.005 / - 0.010
0.020 ± 0.005
BOTTOM PAD
E
0.040 ± 0.005
0.050 ± 0.005
LAND PATTERN DIMENSIONS
in inches
1206 Land Pattern
0.1730
0.0710
2512 Land Pattern
0.2910
0.0220
0.0755
0.1260
0.1090
0.0910
STANDARD MATERIAL SPECIFICATIONS
Resistive element
Substrate material
Terminations (tin / lead)
Terminations (lead (Pb)-free)
Revision: 08-May-2018
Nichrome
Aluminum nitride
Tin / lead solder over copper
Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over copper
Document Number: 60130
2
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
PCNM2512 CHIP TEMP VS. APPLIED POWER
16.0
10
Ω
14.0
12.0
Applied Power (W)
PCAN1206 CHIP TEMP VS. APPLIED POWER
12.0
10.0
Applied Power (W)
1000
Ω
100
Ω
10
Ω
1000
Ω
10 000
Ω
100
Ω
8.0
10.0
8.0
6.0
4.0
6.0
4.0
2.0
2.0
0.0
0.0
70
150
Chip
Surface
Temperature Temperature (°C)
200
70
150
Chip
Surface
Temperature Temperature (°C)
200
Notes
• Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C
• Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full
range of power levels
• Thermal imaging and load life testing was conducted mounting one device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both
surfaces. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces of the test card
DERATING CURVE
100
Percent of Rated Power
80
60
40
20
0
0
70
125
155
Ambient Temperature °C
PULSE HANDLING RESULTS
100
100
Ω
- 2512
Peak Power (W)
10
100
Ω
- 1206
1
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Duration (s)
Revision: 08-May-2018
Document Number: 60130
3
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: PCNM1206H1000BBT1
P
GLOBAL
MODEL
PCNM
C
CASE
SIZE
1206
2512
N
M
1
2
0
6
H
1
0
0
0
B
B
T
1
TCR
CHARACTERISTIC
E
= ± 25 ppm/°C
H
= ± 50 ppm/°C
K
= ± 100 ppm/°C
(1)
RESISTANCE
The first 3 digits are
significant figures and
the last digit specifies
the number of zeros
to follow.
“R” designates the
decimal point.
Example:
10R0
= 10
1000
= 100
TOLERANCE
B
= ± 0.1 %
(2)
C
= ± 0.25 %
D
= ± 0.5 %
F
= ± 1.0 %
(1)
G
= ± 2.0 %
TERMINATION
B
= wraparound
Sn/Pb solder
w/ nickel barrier
S
= wraparound
lead (Pb)-free
solder (e1)
RoHS compliant
G
= wraparound Au,
over Ni (gold)
termination
epoxy bondable
RoHS compliant
(e4)
PACKAGING
BS
= BULK
100 min., 1 mult
WS
= WAFFLE
100 min., 1 mult
W0
= 100 pc min. waffle,
1 mult
WI
= 100 min., 1 mult
(package unit single lot
date code)
TAPE AND REEL
T0
= 100 min., 100 mult
T1
= 1000 min., 1000 mult
T3
= 300 min., 300 mult
T5
= 500 min., 500 mult
TF
= Full reel
TS
= 100 min., 1 mult
TI
= 100 min., 1 mult
(item single lot date code)
TP
= 100 min., 1 mult
(package unit single lot
date code)
Notes
(1)
Less than 10
100 ppm/°C and 1 % tolerance best
(2)
Available on 10
and higher
Revision: 08-May-2018
Document Number: 60130
4
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000
查看更多>
怎么样将应用层的数据传到IAP中?
ST的IAP方案需要按键,可是我设计的板子没有按键,只是通过串口实现控制。这样话IAP就没法...
wangshujun stm32/stm8
利用DSP控制直流无刷电机
摘 要 :介绍了一种利用双口RAM实现DSP与单片机高速数据通信的方法,给出了它们之间的接口电...
fighting DSP 与 ARM 处理器
【Microchip WBZ451 Curiosity】发射功率测试
1.测试目的: 验证芯片的最大Tx power, 2.测试设备: 1)信号分析仪:型号Kin...
Invlker RF/无线
LSM6DSL运动传感器角速度数据波动问题
我在用stm32的板子采集LSM6DSL模块数据的过程中,陀螺仪的角速度数据可以稳定输出,但是...
HIK-wbb MEMS传感器
深入浅出ARM7+LPC+213x+214x+上册
深入浅出ARM7+LPC+213x+214x+上册 深入浅出ARM7+LPC+213x+214x+上...
Martin_Pan ARM技术
【ESP32-S2-Kaluga-1测评】5. 图片显示,按键以及RGB LED操作
这一周弄了弄板载的按键以及RGB LED。 下面说一下具体实现的功能,使用官方提供的例程进行修改...
hehung 国产芯片交流
热门器件
热门资源推荐
器件捷径:
S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY
需要登录后才可以下载。
登录取消