www.msksemi.com
PESD18VF1BLYL-MS
Semiconductor
Compiance
Features
Ultra-Low capacitance:0.05pF(typ.)
Low leakage current(<10nA)
Fast response time(<1ns)
Bi-directional,single line protection
IEC 61000-4-2 (ESD Air): 15kV
IEC 61000-4-2 (ESD Contact): 8kV
Pin Description
Applications
USB 3.0/3.1
HDMI 1.3/1.4/2.0
RF Antenna
SATA and eSATA Interface
Schematic Diagram
Limiting Values(T
A
= 25 °C, unless otherwise specified)
Symbol
V
ESD
T
A
T
stg
Parameter
Electrostatic Discharge Voltage
Operating Temperature Range
Storage Temperature Range
Conditions
IEC 61000-4-2; Contact Discharge
IEC 61000-4-2; Air Discharge
-
-
Min
-
-
-55
-40
Max
8
15
125
85
Unit
kV
kV
℃
℃
Electrical Characteristics(T
A
= 25 °C unless otherwise specified)
Symbol
V
DC
V
T
V
C
I
L
C
J
Parameter
Continuous Operating Voltage
Trigger Voltage
Clamping Voltage
Leakage Current
Capacitance
discharge
IEC61000-4-2 8kV contact
discharge
DC 5V shall be applied
on component
Measured at 10MHz
Conditions
-
IEC61000-4-2 8kV contact
Min
-
-
-
-
-
Typ.
-
450
40
-
0.05
Max
18
-
-
10
-
Unit
V
V
V
nA
pF
www.msksemi.com
PESD18VF1BLYL-MS
Semiconductor
Compiance
Recommended Solder Pad Footprint
*Sizes in mm
Notes：
This solder pad layout is for reference purposes only.
Dimension
L
W
p
H
Unit: Millimeters
Min.
0.90
0.42
0.15
0.25
Max.
1.10
0.62
0.35
0.45
REEL SPECIFICATION
P/N
PESD18VF1BLYL-MS
SOD-882
PKG
10000
QTY
www.msksemi.com
PESD18VF1BLYL-MS
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative
nearest
you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities
concerned
in
accordance with the above law.
■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable,
but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or
other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
www.msksemi.com
GD32 MCU
