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PIC12LF1501T-I/MS

8-bit microcontrollers - mcu 1.75kb FL 64br 6 I/O clc nco 10-bit adc

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
零件包装代码
MSOP
包装说明
MSOP-8
针数
8
Reach Compliance Code
compliant
Factory Lead Time
23 weeks
具有ADC
YES
地址总线宽度
位大小
8
CPU系列
PIC
最大时钟频率
16 MHz
DAC 通道
YES
DMA 通道
NO
外部数据总线宽度
集成缓存
NO
JESD-30 代码
S-PDSO-G8
JESD-609代码
e3
长度
3 mm
湿度敏感等级
1
I/O 线路数量
6
端子数量
8
计时器数量
3
片上数据RAM宽度
8
片上程序ROM宽度
14
最高工作温度
85 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
TSSOP
封装等效代码
TSSOP8,.19
封装形状
SQUARE
封装形式
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)
260
电源
2/3.3 V
认证状态
Not Qualified
RAM(字节)
64
RAM(字数)
64
ROM(单词)
1024
ROM可编程性
FLASH
座面最大高度
1.1 mm
速度
20 MHz
最大压摆率
1.8 mA
最大供电电压
3.6 V
最小供电电压
2.5 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子节距
0.65 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
40
宽度
3 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER, RISC
文档预览
PIC12(L)F1501
PIC12(L)F1501 Family
Silicon Errata and Data Sheet Clarification
The PIC12(L)F1501 family devices that you have
received conform functionally to the current Device Data
Sheet (DS41615A), except for the anomalies described
in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in
Table 1.
The silicon issues are summarized in
Table 2.
The errata described in this document will be addressed
in future revisions of the PIC12(L)F1501 silicon.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated in the last column of
Table 2
apply to the current silicon
revision (A0).
For example, to identify the silicon revision level using
MPLAB IDE in conjunction with MPLAB ICD 3 or
PICkit™ 3:
1.
Using the appropriate interface, connect the
device to the MPLAB ICD 3 programmer/
debugger or PICkit™ 3.
From the main menu in MPLAB IDE, select
Configure>Select Device,
and then select the
target part number in the dialog box.
Select
the
MPLAB
hardware
tool
(Debugger>Select
Tool).
Perform a “Connect” operation to the device
(Debugger>Connect). Depending on the
development tool used, the part number
and
Device Revision ID value appear in the
Output
window.
Note:
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
2.
3.
4.
Data Sheet clarifications and corrections start on
page 4,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB
®
IDE and Microchip’s
programmers, debuggers, and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
The DEVREV values for the various PIC12(L)F1501
silicon revisions are shown in
Table 1.
TABLE 1:
SILICON DEVREV VALUES
DEVICE ID<13:0>
Part Number
DEV<8:0>
(1)
REV<4:0> Silicon Revision
(2)
A0
PIC12F1501
PIC12LF1501
Note 1:
2:
10 1100 110
10 1101 100
0 0000
0 0000
The Device ID is located in the configuration memory at address 8006h.
Refer to the
“PIC12(L)F1501/PIC16(L)F150X Memory Programming Specification”
(DS41573) for detailed
information on Device and Revision IDs for your specific device.
2012 Microchip Technology Inc.
DS80539A-page 1
PIC12(L)F1501
TABLE 2:
SILICON ISSUE SUMMARY
Feature
HFINTOSC Ready/Stable
bit
Clock Switching
Item
Number
1.1
1.2
Issue Summary
Bits remained set to ‘1’ after initial
trigger
Clock switching fails
Affected
Revisions
(1)
A0
X
X
Module
Oscillator
Oscillator
Note 1:
Only those issues indicated in the last column apply to the current silicon revision.
DS80539A-page 2
2012 Microchip Technology Inc.
PIC12(L)F1501
Silicon Errata Issues
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A0).
1. Module: Oscillator
1.1 OSCSTAT bits: HFIOFR and HFIOFS
When HFINTOSC is selected, the HFIOFR and
HFIOFS bits will become set when the oscillator
becomes ready and stable. Once these bits are
set, they become “stuck”, indicating that
HFINTOSC is always ready and stable. If the
HFINTOSC is disabled, the bits fail to be cleared.
Work around
None.
Affected Silicon Revisions
A0
X
1.2 Clock Switching
When switching clock sources between INTOSC
clock source and an external clock source, one
corrupted instruction may be executed after the
switch occurs.
Work around
When switching from an external oscillator clock
source, first switch to 16 MHz HFINTOSC. Once
running at 16 MHz HFINTOSC, configure IRCF to
run at desired internal oscillator frequency.
When switching from an internal oscillator
(INTOSC) to an external oscillator clock source,
first switch to HFINTOSC High-Power mode (8
MHz or 16 MHz). Once running from HFINTOSC,
switch to the external oscillator clock source.
Affected Silicon Revisions
A0
X
2012 Microchip Technology Inc.
DS80539A-page 3
PIC12(L)F1501
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS41615A):
Note:
Corrections are shown in
bold.
Where
possible, the original bold text formatting
has been removed for clarity.
1. Module: Fixed Voltage Reference
The following clarifications apply to both F and LF
versions of the device and can be found in the DC
Characteristics chapter of the data sheet, Section
27.1.
27.1
DC Characteristics: PIC12(L)F1501-I/E (Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
T
A
+85°C for industrial
-40°C
T
A
+125°C for extended
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
T
A
+85°C for industrial
-40°C
T
A
+125°C for extended
Characteristic
Fixed Voltage Reference Voltage for
ADC, Initial Accuracy
Min.
-7
-8
-7
-8
-2
-4
Typ†
Max.
6
6
6
6
11
10
Units
%
Conditions
1.024V, V
DD
2.5V, 85°C (NOTE
2)
1.024V, V
DD
2.5V, 125°C (NOTE
2)
2.048V, V
DD
2.5V, 85°C
2.048V, V
DD
2.5V, 125°C
4.096V, V
DD
4.75V, 85°C
4.096V, V
DD
4.75V, 125°C
PIC12LF1501
PIC12F1501
Param.
No.
D003
Sym.
V
ADFVR
Note 2:
For proper operation, the minimum value of the ADC positive voltage reference must be 1.8V or greater.
When selecting the FVR or the V
REF
+ pin as the source of the ADC positive voltage reference, be aware
that the voltage must be 1.8V or greater.
DS80539A-page 4
2012 Microchip Technology Inc.
PIC12(L)F1501
APPENDIX A:
DOCUMENT
REVISION HISTORY
Rev A Document (3/2012)
Initial release of this document.
2012 Microchip Technology Inc.
DS80539A-page 5
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参数对比
与PIC12LF1501T-I/MS相近的元器件有:PIC12LF1501-E/SN、PIC12F1501T-I/MS。描述及对比如下:
型号 PIC12LF1501T-I/MS PIC12LF1501-E/SN PIC12F1501T-I/MS
描述 8-bit microcontrollers - mcu 1.75kb FL 64br 6 I/O clc nco 10-bit adc 8-bit microcontrollers - mcu 1.75kb FL 64br 6 I/O clc nco 10-bit adc 8-bit microcontrollers - mcu 1.75kb FL 64br 6 I/O clc nco 10-bit adc
是否Rohs认证 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
零件包装代码 MSOP SOIC MSOP
包装说明 MSOP-8 SOIC-8 MSOP-8
针数 8 8 8
Reach Compliance Code compliant compliant compliant
Factory Lead Time 23 weeks 20 weeks 20 weeks
具有ADC YES YES YES
位大小 8 8 8
CPU系列 PIC PIC PIC
最大时钟频率 16 MHz 16 MHz 16 MHz
DAC 通道 YES YES YES
DMA 通道 NO NO NO
集成缓存 NO NO NO
JESD-30 代码 S-PDSO-G8 R-PDSO-G8 S-PDSO-G8
JESD-609代码 e3 e3 e3
长度 3 mm 4.9 mm 3 mm
湿度敏感等级 1 1 1
I/O 线路数量 6 6 6
端子数量 8 8 8
计时器数量 3 3 3
片上数据RAM宽度 8 8 8
片上程序ROM宽度 14 14 14
最高工作温度 85 °C 125 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
PWM 通道 YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP SOP TSSOP
封装等效代码 TSSOP8,.19 SOP8,.25 TSSOP8,.19
封装形状 SQUARE RECTANGULAR SQUARE
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 260 260
电源 2/3.3 V 2/3.3 V 2.5/5 V
认证状态 Not Qualified Not Qualified Not Qualified
RAM(字节) 64 64 64
RAM(字数) 64 64 64
ROM(单词) 1024 1024 1024
ROM可编程性 FLASH FLASH FLASH
座面最大高度 1.1 mm 1.75 mm 1.1 mm
速度 20 MHz 20 MHz 20 MHz
最大压摆率 1.8 mA 1.8 mA 2 mA
最大供电电压 3.6 V 3.6 V 5.5 V
最小供电电压 2.5 V 2.5 V 2.5 V
标称供电电压 3 V 3 V 3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL AUTOMOTIVE INDUSTRIAL
端子面层 Matte Tin (Sn) Matte Tin (Sn) - annealed Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING
端子节距 0.65 mm 1.27 mm 0.65 mm
端子位置 DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 40 40
宽度 3 mm 3.9 mm 3 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER, RISC MICROCONTROLLER, RISC MICROCONTROLLER, RISC
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