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PIC18LF4610-E/P

FLASH, MICROCONTROLLER, PDIP40, 0.600 INCH, LEAD FREE, PLASTIC, DIP-40

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Microchip(微芯科技)

厂商官网:https://www.microchip.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Microchip(微芯科技)
零件包装代码
DIP
包装说明
0.600 INCH, LEAD FREE, PLASTIC, DIP-40
针数
40
Reach Compliance Code
compliant
具有ADC
YES
地址总线宽度
位大小
8
最大时钟频率
20 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
R-PDIP-T40
JESD-609代码
e3
长度
51.7525 mm
I/O 线路数量
36
端子数量
40
片上程序ROM宽度
16
最高工作温度
125 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
RAM(字节)
3968
ROM(单词)
32768
ROM可编程性
FLASH
座面最大高度
6.35 mm
速度
40 MHz
最大供电电压
5.5 V
最小供电电压
4.2 V
标称供电电压
5 V
表面贴装
NO
技术
CMOS
温度等级
AUTOMOTIVE
端子面层
Matte Tin (Sn)
端子形式
THROUGH-HOLE
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
15.24 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
PIC18F2X1X/4X1X
28/40/44-Pin Flash Microcontrollers with
10-Bit A/D and nanoWatt Technology
Power-Managed Modes:
Run: CPU On, Peripherals On
Idle: CPU Off, Peripherals On
Sleep: CPU Off, Peripherals Off
Idle mode Currents Down to 3.0
μA
Typical
Sleep mode Currents Down to 20 nA Typical
Timer1 Oscillator: 1.8
μA,
32 kHz, 2V
Watchdog Timer: 2.1
μA
Two-Speed Oscillator Start-up
Flexible Oscillator Structure:
• Four Crystal modes, Up to 40 MHz
• 4x Phase Lock Loop (PLL) – Available for Crystal
and Internal Oscillators
• Two External RC modes, Up to 4 MHz
• Two External Clock modes, Up to 40 MHz
• Internal Oscillator Block:
- 8 user-selectable frequencies, from 31 kHz to
8 MHz
- Provides a complete range of clock speeds
from 31 kHz to 32 MHz when used with PLL
- User-tunable to compensate for frequency drift
• Secondary Oscillator using Timer1 @ 32 kHz
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock stops
Peripheral Highlights:
• High-Current Sink/Source 25 mA/25 mA
• Up to 2 Capture/Compare/PWM (CCP) modules,
One with Auto-Shutdown (28-pin devices)
• Enhanced Capture/Compare/PWM (ECCP)
module (40/44-pin devices only):
- One, two or four PWM outputs
- Selectable polarity
- Programmable dead time
- Auto-shutdown and auto-restart
• Master Synchronous Serial Port (MSSP) module
Supporting 3-Wire SPI (all 4 modes) and I
2
C™
Master and Slave modes
• Enhanced Addressable USART module:
- Supports RS-485, RS-232 and LIN 1.2
- RS-232 operation using internal oscillator
block (no external crystal required)
- Auto-wake-up on Start bit
- Auto-Baud Detect
• 10-Bit, Up to 13-Channel Analog-to-Digital
Converter module (A/D):
- Auto-acquisition capability
- Conversion available during Sleep
• Dual Analog Comparators with Input Multiplexing
• Programmable 16-Level High/Low-Voltage
Detection (HLVD) module:
- Supports interrupt on High/Low-Voltage Detection
Special Microcontroller Features:
• C Compiler Optimized Architecture:
- Optional extended instruction set designed to
optimize re-entrant code
• 100,000 Erase/Write Cycle Flash Program
Memory Typical
• Three Programmable External Interrupts
• Four Input Change Interrupts
• Priority Levels for Interrupts
• 8 x 8 Single-Cycle Hardware Multiplier
• Extended Watchdog Timer (WDT):
- Programmable period from 4 ms to 131s
• Single-Supply 5V In-Circuit Serial
Programming™ (ICSP™) via Two Pins
• In-Circuit Debug (ICD) via Two Pins
• Wide Operating Voltage Range: 2.0V to 5.5V
• Programmable Brown-out Reset (BOR) with
Software Enable Option
©
2009 Microchip Technology Inc.
DS39636D-page 3
PIC18F2X1X/4X1X
Device
Flash
(bytes)
16K
32K
48K
64K
16K
32K
48K
64K
# Single-Word
Instructions
8192
16384
24576
32768
8192
16384
24576
32768
SRAM
(bytes)
768
1536
3968
3968
768
1536
3968
3968
I/O
10-Bit
A/D (ch)
10
10
10
10
13
13
13
13
CCP/ECCP
(PWM)
2/0
2/0
2/0
2/0
1/1
1/1
1/1
1/1
EUSART
Program Memory
Data
Memory
MSSP
SPI
Y
Y
Y
Y
Y
Y
Y
Y
Master
I
2
C™
Y
Y
Y
Y
Y
Y
Y
Y
Comp.
Timers
8/16-Bit
1/3
1/3
1/3
1/3
1/3
1/3
1/3
1/3
PIC18F2410
PIC18F2510
PIC18F2515
PIC18F2610
PIC18F4410
PIC18F4510
PIC18F4515
PIC18F4610
25
25
25
25
36
36
36
36
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
DS39636D-page 4
©
2009 Microchip Technology Inc.
PIC18F2X1X/4X1X
Pin Diagrams
28-pin SPDIP, SOIC
MCLR/V
PP
/RE3
RA0/AN0
RA1/AN1
RA2/AN2/V
REF
-/CV
REF
RA3/AN3/V
REF
+
RA4/T0CKI/C1OUT
RA5/AN4/SS/HLVDIN/C2OUT
V
SS
OSC1/CLKI/RA7
OSC2/CLKO/RA6
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
(1)
RC2/CCP1
RC3/SCK/SCL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
RB7/KBI3/PGD
RB6//KBI2/PGC
RB5/KBI1/PGM
RB4/KBI0/AN11
RB3/AN9/CCP2
(1)
RB2/INT2/AN8
RB1/INT1/AN10
RB0/INT0/FLT0/AN12
V
DD
V
SS
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RA1/AN1
RA0/AN0
MCLR/V
PP
/RE3
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4KBI0/AN11
28 27 26 25 24 23 22
RA2/AN2/V
REF
-/CV
REF
RA3/AN3/V
REF
+
RA4/T0CKI/C1OUT
RA5/AN4/SS/HLVDIN/C2OUT
V
SS
OSC1/CLKI/RA7
OSC2/CLKO/RA6
1
2
3
4
5
6
7
21
20
19
18
17
16
15
RB3/AN9/CCP2
(1)
RB2/INT2/AN8
RB1/INT1/AN10
RB0/INT0/FLT0/AN12
V
DD
V
SS
RC7/RX/DT
28-pin QFN
PIC18F2410
PIC18F2510
8 9 10 11 12 13 14
40-pin PDIP
MCLR/V
PP
/RE3
RA0/AN0
RA1/AN1
RA2/AN2/V
REF
-/CV
REF
RA3/AN3/V
REF
+
RA4/T0CKI/C1OUT
RA5/AN4/SS/HLVDIN/C2OUT
RE0/RD/AN5
RE1/WR/AN6
RE2/CS/AN7
V
DD
V
SS
OSC1/CLKI/RA7
OSC2/CLKO/RA6
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
(1)
RC2/CCP1/P1A
RC3/SCK/SCL
RD0/PSP0
RD1/PSP1
Note
1:
RB3 is the alternate pin for CCP2 multiplexing.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
RB7/KBI3/PGD
RB6/KBI2/PGC
RB5/KBI1/PGM
RB4/KBI0/AN11
RB3/AN9/CCP2
(1)
RB2/INT2/AN8
RB1/INT1/AN10
RB0/INT0/FLT0/AN12
V
DD
V
SS
RD7/PSP7/P1D
RD6/PSP6/P1C
RD5/PSP5/P1B
RD4/PSP4
RC7/RX/DT
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
©
2009 Microchip Technology Inc.
PIC18F4X1X
RC0/T1OSO/T13CKI
RC1/T1OSI/CCP2
(1)
RC2/CCP1
RC3/SCK/SCL
RC4/SDI/SDA
RC5/SDO
RC6/TX/CK
PIC18F2X1X
DS39636D-page 5
PIC18F2X1X/4X1X
Pin Diagrams (Cont.’d)
44-pin TQFP
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1/P1A
RC1/T1OSI/CCP2
(1)
NC
44
43
42
41
40
39
38
37
36
35
34
44-pin QFN
44
43
42
41
40
39
38
37
36
35
34
RC6/TX/CK
RC5/SDO
RC4/SDI/SDA
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC3/SCK/SCL
RC2/CCP1/P1A
RC1/T1OSI/CCP2
(1)
RC0/T1OSO/T13CKI
NC
NC
RB4/KBI0/AN11
RB5/KBI1/PGM
RB6/KBI2/PGC
RB7/KBI3/PGD
MCLR/V
PP
/RE3
RA0/AN0
RA1/AN1
RA2/AN2/V
REF
-/CV
REF
RA3/AN3/V
REF
+
12
13
14
15
16
17
18
19
20
21
22
RC7/RX/DT
RD4/PSP4
RD5/PSP5/P1B
RD6/PSP6/P1C
RD7/PSP7/P1D
V
SS
V
DD
RB0/INT0/FLT0/AN12
RB1/INT1/AN10
RB2/INT2/AN8
RB3/AN9/CCP2
(1)
1
2
3
4
5
6
7
8
9
10
11
PIC18F4X1X
33
32
31
30
29
28
27
26
25
24
23
NC
RC0/T1OSO/T13CKI
OSC2/CLKO/RA6
OSC1/CLKI/RA7
V
SS
V
DD
RE2/CS/AN7
RE1/WR/AN6
RE0/RD/AN5
RA5/AN4/SS/HLVDIN/C2OUT
RA4/T0CKI/C1OUT
Note
1:
RB3 is the alternate pin for CCP2 multiplexing.
RB3/AN9/CCP2
(1)
NC
RB4/KBI0/AN11
RB5/KBI1/PGM
RB6/KBI2/PGC
RB7/KBI3/PGD
MCLR/V
PP
/RE3
RA0/AN0
RA1/AN1
RA2/AN2/V
REF
-/CV
REF
RA3/AN3/V
REF
+
12
13
14
15
16
17
18
19
20
21
22
RC7/RX/DT
RD4/PSP4
RD5/PSP5/P1B
RD6/PSP6/P1C
RD7/PSP7/P1D
V
SS
V
DD
V
DD
RB0/INT0/FLT0/AN12
RB1/INT1/AN10
RB2/INT2/AN8
1
2
3
4
5
6
7
8
9
10
11
PIC18F4X1X
33
32
31
30
29
28
27
26
25
24
23
OSC2/CLKO/RA6
OSC1/CLKI/RA7
V
SS
V
SS
V
DD
V
DD
RE2/CS/AN7
RE1/WR/AN6
RE0/RD/AN5
RA5/AN4/SS/HLVDIN/C2OUT
RA4/T0CKI/C1OUT
DS39636D-page 6
©
2009 Microchip Technology Inc.
PIC18F2X1X/4X1X
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Oscillator Configurations ............................................................................................................................................................ 25
3.0 Power-Managed Modes ............................................................................................................................................................. 35
4.0 Reset .......................................................................................................................................................................................... 43
5.0 Memory Organization ................................................................................................................................................................. 55
6.0 Flash Program Memory.............................................................................................................................................................. 77
7.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 81
8.0 Interrupts .................................................................................................................................................................................... 83
9.0 I/O Ports ..................................................................................................................................................................................... 97
10.0 Timer0 Module ......................................................................................................................................................................... 115
11.0 Timer1 Module ......................................................................................................................................................................... 119
12.0 Timer2 Module ......................................................................................................................................................................... 125
13.0 Timer3 Module ......................................................................................................................................................................... 127
14.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 131
15.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 139
16.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 153
17.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 193
18.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 213
19.0 Comparator Module.................................................................................................................................................................. 223
20.0 Comparator Voltage Reference Module................................................................................................................................... 229
21.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 233
22.0 Special Features of the CPU.................................................................................................................................................... 239
23.0 Instruction Set Summary .......................................................................................................................................................... 259
24.0 Development Support............................................................................................................................................................... 309
25.0 Electrical Characteristics .......................................................................................................................................................... 313
26.0 DC and AC Characteristics Graphs And Tables ...................................................................................................................... 351
27.0 Packaging Information.............................................................................................................................................................. 353
Appendix A: Revision History............................................................................................................................................................. 361
Appendix B: Device Differences ........................................................................................................................................................ 361
Appendix C: Conversion Considerations ........................................................................................................................................... 362
Appendix D: Migration From Baseline to Enhanced Devices ............................................................................................................ 362
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 363
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 363
Index ................................................................................................................................................................................................. 365
The Microchip Web Site ..................................................................................................................................................................... 375
Customer Change Notification Service .............................................................................................................................................. 375
Customer Support .............................................................................................................................................................................. 375
Reader Response .............................................................................................................................................................................. 376
PIC18F2X1X/4X1X Product Identification System............................................................................................................................. 377
©
2009 Microchip Technology Inc.
DS39636D-page 7
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