Clare's Hi-Rel PLA171PH is a single-pole, normally
open (1-Form-A) Solid State Relay that uses optically
coupled MOSFET technology to provide enhanced
input-to-output isolation of 5000V
rms
. The efficient
MOSFET switches and photovoltaic die use Clare’s
patented OptoMOS
®
architecture.
Control of the optically-coupled output is by the input
GaAIAs infrared LED. The PLA171PH is designed
to replace electromechanical relays and offers the
superior reliability associated with Clare's Hi-Rel
Solid State devices. This device provides bounce-free
switching in a compact surface mount package.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Operational Temperature Range: -40ºC to +105ºC
800V
P
Blocking Voltage
5000V
rms
Input/Output Isolation
Electrical Tests at Room Temperature and at 85ºC
100% Burn-In
JESD22-A108 / MIL-STD-883 Method 1015
100% Post Burn-In Electrical Test
Small 6-Pin Surface Mount Package
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Flammability Rating UL 94 V-0
Approvals
•
UL Certified Component: File # E76270
•
EN/IEC 60950 Certified Component:
TUV Certificate B 09 07 49410 004
•
Meets Requirements of:
AEC-Q101 "Temperature Grade 2" - Pending
Ordering Information
Part #
PLA171PH
PLA171PHTR
Description
6-Lead Surface Mount (50/Tube)
6-Lead Surface Mount, Tape & Reel (1000/Reel)
Applications
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Automotive High-Voltage Circuitry
•
Aerospace
•
Industrial Controls
Pin Configuration
AC/DC Configuration
NC
+ Control
– Control
NC
1
2
3
4
5
Load
8
Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
RoHS
2002/95/EC
e
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DS-PLA171PH-R02
1
PLA171PH
Absolute Maximum Ratings
(@ 25ºC Unless otherwise noted)
Parameter
Blocking Voltage (-40ºC to +105ºC)
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output (60 Seconds)
Operational Temperature
Storage Temperature
1
2
Ratings Units
800
V
P
5
V
50
mA
1
A
150
mW
800
mW
5000
V
rms
-40 to +105
°C
-40 to +125
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristcs
Parameter
Conditions
Output Characteristics @ 25°C
Load Current
I
F
=2mA
Continuous
1
Peak
I
F
=2mA , t=10ms
2
I
F
=2mA, I
L
= 100mA
On-Resistance
I
F
=5mA, I
L
=1mA
Off-State Leakage Current
V
L
=800V
P
Switching Speeds
Turn-On
I
F
=5mA, V
L
=10V
Turn-Off
Output Capacitance
I
F
=0mA, V
L
=50V, f=1MHz
Output Characteristics @ 105°C
On-Resistance
2
I
F
=5mA, I
L
=30mA
I
F
=5mA, I
L
=1mA
Off-State Leakage Current
V
L
=800V
P
Input Characteristics @ 25°C
Input Control Current
3
I
L
=100mA
Input Dropout Current
-
Input Voltage Drop
I
F
=5mA
Reverse Input Current
V
R
=5V
Common Characteristics @ 25°C
Input to Output Capacitance
-
1
2
3
Symbol
Min
Typ
Max
Units
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OUT
R
ON
I
LEAK
I
F
I
F
V
F
I
R
C
I/O
-
-
-
-
-
-
-
-
-
-
-
-
0.1
0.9
-
-
-
-
40
70
-
0.42
0.15
11
75
115
-
0.39
-
1.2
-
3
100
350
50
85
1
5
5
-
110
140
5
2
-
1.4
10
-
mA
Ω
µA
ms
pF
Ω
µA
mA
mA
V
µA
pF
Load derates linearly from 100mA @ 25
o
C to 40mA @105
o
C.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60
o
C) an LED drive current of 5mA is recommended.
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R02
PLA171PH
PERFORMANCE DATA*
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA, T
A
=25ºC)
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA, T
A
=25ºC)
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA, T
A
=25ºC)
35
30
Device Count (N)
25
20
15
10
5
0
20
Device Count (N)
Device Count (N)
0.36
0.38
0.40 0.42 0.44 0.46
Turn-On Time (ms)
0.48
25
20
15
10
5
0
1.230
1.235 1.240 1.245 1.250
LED Forward Voltage (V)
1.255
15
10
5
0
0.135 0.140 0.145 0.150 0.155 0.160 0.165
Turn-Off Time (ms)
15
Typical I
F
for Switch Operation
(N=50, I
L
=100mA, T
A
=25ºC)
35
30
Device Count (N)
Typical On-Resistance Distribution
(N=50, I
F
=2mA, I
L
=100mA, T
A
=25ºC)
15
Typical Blocking Voltage Distribution
(N=50, T
A
=25ºC)
Device Count (N)
10
25
20
15
10
5
Device Count (N)
40.0
40.5
41.0
41.5
42.0
On-Resistance (Ω)
42.5
10
5
5
0
0.33
0.35
0.37 0.39 0.41
LED Current (mA)
0.43
0.45
0
0
956
964
972 980 988 996
Blocking Voltage (V
P
)
1004
Typical LED Forward Drop
vs. Temperature
1.6
LED Voltage Drop (V)
1.5
Turn-On Time (ms)
1.4
1.3
1.2
1.1
1.0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
1.0
Turn-On Time vs. Temperature
0.22
0.20
Turn-Off Time (ms)
0.8
I
F
=2mA
0.6
0.4
I
F
=5mA
0.2
0.0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
0.18
0.16
0.14
0.12
0.10
0.08
0.06
-40
-20
Typical Turn-Off Time
vs. Temperature
I
F
=2mA
I
F
=5mA
0
20
40
60
80
Temperature (ºC)
100
120
0.70
0.65
LED Current (mA)
0.60
0.55
0.50
0.45
0.40
0.35
-40
-20
LED Current to Operate
(I
L
=55mA)
Load Current (mA)
100
Typical Load Current
vs. Load Voltage
(I
F
=2mA, T
A
=25ºC)
120
Load Current (mA)
100
80
60
40
20
-6
-4
-2
0
2
Voltage (V)
4
6
Typical Load Current vs. Temperature
(I
F
=5mA)
50
0
-50
-100
0
20
40
60
80
Temperature (ºC)
100
120
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02
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3
PLA171PH
PERFORMANCE DATA*
Typical On-Resistance
vs. Temperature
(I
F
=5mA)
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
1100
Leakage Current (nA)
300
250
200
150
100
50
0
-40
-20
0
20
40
60
80
Temperature (ºC)
100
120
-40
-20
80
On-Resistance (Ω)
70
60
50
40
30
20
-40
-20
Typical Leakage Current
vs. Temperature
(V
L
=800V)
1050
I
L
=30mA
I
L
=55mA
1000
950
900
0
20
40
60
80
Temperature (ºC)
100
120
0
20
40
60
80
Temperature (ºC)
100
120
Energy Rating Curve
1.0
0.8
0.6
0.4
0.2
0.0
10μs 100μs 1ms 10ms 100ms
Time
Load Current (A)
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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R02
PLA171PH
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard,
IPC/JEDEC J-STD-020,
in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA171PH
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA171PH
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy
