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PM105SB-101K

Fixed Inductors 100uH 10%

器件类别:无源元件    电感器   

厂商名称:Bourns

厂商官网:http://www.bourns.com

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Bourns
包装说明
1210
Reach Compliance Code
unknown
ECCN代码
EAR99
大小写代码
1210
构造
Magnetic Shielded
型芯材料
FERRITE
直流电阻
0.34 Ω
标称电感 (L)
100 µH
电感器应用
POWER INDUCTOR
电感器类型
GENERAL PURPOSE INDUCTOR
制造商序列号
PM105SB
功能数量
1
端子数量
2
最高工作温度
100 °C
最低工作温度
-30 °C
封装高度
2.2 mm
封装长度
3.2 mm
封装形式
SMT
封装宽度
2.5 mm
包装方法
TR
最小质量因数(标称电感时)
30
最大额定电流
0.72 A
自谐振频率
8 MHz
系列
PM105SB
形状/尺寸说明
RECTANGULAR PACKAGE
屏蔽
YES
表面贴装
YES
端子位置
DUAL ENDED
端子形状
ONE SURFACE
测试频率
0.001 MHz
容差
10%
文档预览
CO
M
PL
IA
N
T
Features
Formerly
Available in E12 series
Height of 2.9 mm
Current rating up to 2.1 A
RoHS compliant*
Applications
model
Input/output of DC/DC converters
Power supplies for:
*R
oH
S
Portable communication equipment
Camcorders
LCD TVs
Car radios
PM105SB Series - Shielded SMD Power Inductor
Electrical Specifications
Inductance 100 kHz
General Specifications
Test
Q Frequency
Ref.
(MHz)
39
2.52
40
2.52
35
2.52
39
2.52
35
2.52
35
2.52
27
2.52
31
2.52
27
2.52
26
2.52
26
2.52
26
2.52
29
0.796
31
0.796
24
0.796
24
0.796
27
0.796
30
0.796
29
0.796
26
0.796
26
0.796
SRF
Typ.
(MHz)
29
26
24
21
18
17
14
14
11
11
10
9
8
7
6
5
5
5
4
3
3
DCR
Max.
(Ω)
0.06
0.07
0.07
0.08
0.08
0.10
0.11
0.12
0.14
0.19
0.21
0.28
0.34
0.37
0.51
0.57
0.78
0.87
1.20
1.34
1.50
Bourns Part No.
PM105SB-100M-RC
PM105SB-120M-RC
PM105SB-150M-RC
PM105SB-180M-RC
PM105SB-220M-RC
PM105SB-270M-RC
PM105SB-330L-RC
PM105SB-390L-RC
PM105SB-470L-RC
PM105SB-560L-RC
PM105SB-680L-RC
PM105SB-820L-RC
PM105SB-101K-RC
PM105SB-121K-RC
PM105SB-151K-RC
PM105SB-181K-RC
PM105SB-221K-RC
PM105SB-271K-RC
PM105SB-331K-RC
PM105SB-391K-RC
PM105SB-471K-RC
(µH)
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
Tol. %
±20
±20
±20
±20
±20
±20
±15
±15
±15
±15
±15
±15
±10
±10
±10
±10
±10
±10
±10
±10
±10
Idc
(A)
2.1
1.9
1.7
1.6
1.4
1.3
1.2
1.1
1.0
0.93
0.85
0.79
0.72
0.63
0.55
0.50
0.47
0.41
0.37
0.35
0.33
Test Voltage ...................................1 Volt
Reflow Soldering ....230 ˚C; 50 sec max.
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
................................. 260 °C for 5 sec.
Materials
Core Material ................. Ferrite DR & RI
Wire ...........................Enameled Copper
Terminal ....................................Ag/Ni/Sn
Rated Current
...................Ind. drop 10 % typ at I sat
Temperature Rise
...................... 15 ˚C typ. at rated I rms
Packaging .................... 500 pcs. per reel
Product Dimensions
100
9.9 ± 0.3
(.390 ± .012)
Inductance vs. Current
104
7
5
3
2
103
7
4.5 ± 0.3
(.177 ± .012)
152
2.9
TYP.
(.114)
Inductance (µH)
5
3
2
102
7
5
3
2
101
7
5
3
2
100
101
471
101
330
Recommended Layout
10.0
REF.
(.394)
100
2
3
5 7 102
2
3
5 7 103
2
3
5 7 104
10.0
(.394)
REF.
DC Current (mA)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
DIMENSIONS:
MM
(INCHES)
2.8
(.110)
REF.
PM105SB Series - Shielded SMD Power Inductor
Soldering Profile
275
<1> Maximum of 10 seconds between
+255°C and +260°C
260°C peak
<1> 255°C
Electrical Schematic
225
220°C
190°C
60 - 90
seconds
Ramp Down
6°C/second
maximum
Temperature (°C)
175
150°C
125
120 - 150 seconds
10 seconds minimum
75
Ramp Up
3°C/second maximum
25
0
50
100
150
200
250
Rev. 02/22/05
300
Time (seconds)
Packaging Specifications
2.0
±
0.5
(.079
±
.020)
330.0
(12.992)
DIA.
30.4
(1.197)
21.0
±
0.8
(.827
±
.032)
DIA.
13.0 ± 0.5
(.512 ± .020)
50.0 - 0
(1.969 - 0)
13.0 ± 0.5
DIA.
(.512 ± .020)
26. + 0
(1.023 + 0)
END
16.0
(.630)
4.0
(.157)
START
DIMENSIONS:
MM
(INCHES)
100
100
100
100
NO COMPONENT
100
NO COMPONENT
COMPONENTS
200
(7.87)
400
(15.75)
USER DIRECTION OF FEED
QTY: 500 PCS. PER REEL
REV. 05/09
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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