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PMBD353T/R

DIODE SILICON, UHF BAND, MIXER DIODE, TO-236AB, PLASTIC, SMD, 3 PIN, Microwave Mixer Diode

器件类别:分立半导体    二极管   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
NXP(恩智浦)
零件包装代码
SOT-23
包装说明
PLASTIC, SMD, 3 PIN
针数
3
Reach Compliance Code
unknown
ECCN代码
EAR99
配置
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
最大二极管电容
1 pF
二极管元件材料
SILICON
二极管类型
MIXER DIODE
最大正向电压 (VF)
0.6 V
频带
ULTRA HIGH FREQUENCY
JEDEC-95代码
TO-236AB
JESD-30 代码
R-PDSO-G3
JESD-609代码
e3
元件数量
2
端子数量
3
最高工作温度
100 °C
最大输出电流
0.03 A
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
260
认证状态
Not Qualified
最大重复峰值反向电压
4 V
表面贴装
YES
技术
SCHOTTKY
端子面层
Matte Tin (Sn)
端子形式
GULL WING
端子位置
DUAL
处于峰值回流温度下的最长时间
40
文档预览
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D088
PMBD353
Schottky barrier double diode
Product data sheet
Supersedes data of 1999 May 25
2001 Oct 15
NXP Semiconductors
Product data sheet
Schottky barrier double diode
FEATURES
Low forward voltage
Small SMD package
Low capacitance.
APPLICATIONS
UHF mixer
Sampling circuits
Modulators
Phase detection.
handbook, 2 columns
PMBD353
PINNING
MARKING
CODE
(1)
∗4F
PIN
1
2
3
DESCRIPTION
cathode k
1
anode a
2
common connection a
1
, k
2
MARKING
TYPE NUMBER
PMBD353
Note
1.
= p: Made in Hong Kong.
= t: Made in Malaysia.
= W: Made in China.
3
handbook, 2 columns
DESCRIPTION
Planar Schottky barrier double diode
in a SOT23 small plastic SMD
package.
1
Top view
3
2
MGC487
1
2
MGC421
Fig.1
Simplified outline (SOT23) pin configuration and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
V
R
I
F
T
stg
T
j
continuous reverse voltage
continuous forward current
storage temperature
junction temperature
−65
4
30
+150
100
V
mA
°C
°C
PARAMETER
MIN.
MAX.
UNIT
2001 Oct 15
2
NXP Semiconductors
Product data sheet
Schottky barrier double diode
ELECTRICAL CHARACTERISTICS
T
amb
= 25
°C
unless otherwise specified.
SYMBOL
Per diode
V
F
forward voltage
see Fig.2
I
F
= 0.1 mA
I
F
= 1 mA
I
F
= 10 mA
I
R
C
d
Note
1. Pulse test: t
p
= 300
μs; δ
= 0.02.
THERMAL CHARACTERISTICS
SYMBOL
R
th j-a
Note
1. Refer to SOT23 standard mounting conditions.
PARAMETER
thermal resistance from junction to ambient
note 1
CONDITIONS
reverse current
diode capacitance
V
R
= 3 V; note 1; see Fig.3
f = 1 MHz; V
R
= 0; see Fig.4
PARAMETER
CONDITIONS
PMBD353
MAX.
UNIT
350
450
600
0.25
1
mV
mV
mV
μA
pF
VALUE
500
UNIT
K/W
2001 Oct 15
3
NXP Semiconductors
Product data sheet
Schottky barrier double diode
GRAPHICAL DATA
10
2
handbook, halfpage
IF
(mA)
10
MLC795
PMBD353
handbook, halfpage
10
4
MLC796
IR
(nA)
10
3
(1)
(1)
10
2
(2)
(3)
1
(2)
(3)
(4)
10
(4)
1
10
−1
10
−2
0
200
400
600
VF (mV)
800
10
1
0
1
2
V R (V)
3
(1)
(2)
(3)
(4)
T
amb
= 100
°C.
T
amb
= 60
°C.
T
amb
= 25
°C.
T
amb
=
−40 °C.
(1) T
amb
= 100
°C.
(2) T
amb
= 60
°C.
(3) T
amb
= 25
°C.
(4) T
amb
=
−40 °C.
Fig.2
Forward current as a function of forward
voltage; typical values.
Fig.3
Reverse current as a function of reverse
voltage; typical values.
MLC797
handbook, halfpage
0.8
Cd
(pF)
0.7
0.6
0.5
0.4
0
1
2
3
V R (V) 4
f = 1 MHz; T
amb
= 25
°C.
Fig.4
Diode capacitance as a function of reverse
voltage; typical values.
2001 Oct 15
4
NXP Semiconductors
Product data sheet
Schottky barrier double diode
PACKAGE OUTLINE
PMBD353
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
HE
v
M
A
3
Q
A
A1
1
e1
e
bp
2
w
M
B
detail X
Lp
c
0
1
scale
2 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
A
1.1
0.9
A
1
max.
0.1
b
p
0.48
0.38
c
0.15
0.09
D
3.0
2.8
E
1.4
1.2
e
1.9
e
1
0.95
H
E
2.5
2.1
L
p
0.45
0.15
Q
0.55
0.45
v
0.2
w
0.1
OUTLINE
VERSION
SOT23
REFERENCES
IEC
JEDEC
TO-236AB
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
2001 Oct 15
5
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