Posistor
®
for over current protection PRG SERIES
PRG18BB***MS1RB SERIES
1.Part Numbering
ex)
PR
G
BC-E0206C
For Automotive
Product ID Series
Dimensions
18
Temperature
Characteristics
BB
Resistance
330
Resistance
Tolerance
M
Individual
Specifications
S1
Packaging
RB C
2. Ratings
Part Number
Charac.
Resistance
(at 25°C)
33 ohm
±20%
Max.
Voltage
*1
Max.
Current
600mA
*2
Hold
Current
18mA
(at +75°C)
36mA
(at +25°C)
14mA
(at +75°C)
29mA
(at +25°C)
12mA
(at +75°C)
21mA
(at +25°C)
8mA
(at +75°C)
14mA
(at +25°C)
5mA
(at +75°C)
10mA
(at +25°C)
*3
Trip
Current
95mA
(at -20°C)
91mA
(at +25°C)
78mA
(at -20°C)
61mA
(at +25°C)
56mA
(at -20°C)
45mA
(at +25°C)
36mA
(at -20°C)
29mA
(at +25°C)
26mA
(at -20°C)
21mA
(at +25°C)
PRG18BB330MS1RB
PRG18BB470MS1RB
47 ohm ±20%
420mA
PRG18BB101MS1RB
BB
C.P.100°C
approx.
100 ohm ±20%
DC 16 V
200mA
PRG18BB221MS1RB
220 ohm ±20%
90mA
PRG18BB471MS1RB
470 ohm ±20%
40mA
Packaging Tape : Taping (Standard quantity is 4000pcs. Per reel)
*1 Shows the Maximum Current value which Shall be passed repeatedly when the circuit runs abnormally.
*2 Shows the Maximum Current value which Shall be passed continuously without tripping at +25,+75°C.
*3 Shows the Tripping Current value when Posistor
®
shall protects circuit flow over load at -20,+25°C.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
3. Dimensions (mm)
L1
(1) Electrode ( Sn Plating)
(2) BaTiO3 Semiconductive Ceramic
W
(1)
L2
L3
(2)
W
H
H
L1
1.60±0.15
W
0.80±0.15
H
0.80±0.15
L2 and L3
0.1½0.6
4. Quantity (Standard Quantity)
Products quantity in a reel
4,000 pcs. /reel
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
Resistance-Temperature Characteristics
Typical Curve
1000
100
Resistance Change（R/R25）
10
1
0.1
-40
-20
0
20
40
60
80
Temperature (℃)
100
120
140
160
BB-040'
This information may be changed without a previous notice.
Notice for use
CAUTION
1. This product is designed for application, which is used under ordinary environment. (room temperature,
normal humidity, normal pressure) Do not expose this to the following environments, because all these
factors can deteriorate the characteristic of this and can cause failure or burn out.
(1) Corrosive gas or deoxidizing gases (Cl
2
, H
2
S, NH
3
, SOx, NOx etc.)
(2) Volatile, flammable gas
(3) Dusty place
(4) Place in a vacuum, reducing or putting pressure
(5) Place in splashed water, or high humidity and dewing place
(6) Salt water, oil, chemical liquid and solvent
(7) Vibratile place
(8) Other place equivalent to the above
2. Limitation of Applications
Please contact us before using our products for the under-mentioned applications requiring especially high
reliability in order to prevent defects which might directly cause damage to other party’s life body or property
(listed below).
(1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment
(4) Power plant control equipment (5) Medical equipment
(6) Transportation equipment (automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / Crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to
the applications listed in the above
3. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that
may be caused by the abnormal function or the failure of our product.
Notice
1. Do not apply abnormal voltage/current exceeding the specified maximum value.
Because they may deteriorate or destroy PTC element.
2. Use this product within the specified temperature. A higher temperature may deteriorate
the characteristic or material.
3. The body of this product is not insulated. Please keep an adequate distance to surrounding
components and wiring.
4. Storage conditions
To keep solderability from declining, following storage condition is recommended.
(1) Condition Temperature : -10 to +40°C
Humidity
: Less than 75%RH (not dewing condition)
(2) Term: Please use this POSISTOR within 6 months after shipment by first-in and first-out stocking
system.
(3) Handling after seal open: After unpacking of the minimum package, reseal it promptly or store it
inside a sealed container with a drying agent.
(4) Place: Do not store this product in corrosive gas (SOx, Cl etc) or under sunlight.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-017O
5. Solder and Flux
(1) Solder Paste
Use Sn:Pb=60:40wt% ,Sn:Pb=63:37wt%, Sn:Ag:Cu=96.5:3.0:0.5wt% or equivalent type of solder paste.
Do not use strong acidic flux (with halide content exceeding 0.2wt%).
Use of the solder containing Zn may reduce adhesive strength.
When you use the solder containing Zn, please contact us in advance.
For your reference, we are using
‘63Sn/37Pb RMA9086 90-3-M18’, manufactured by Alpha Metals Japan Ltd.,
’96.5Sn/3.0Ag/0.5Cu M705-GRN360-K2-V’, manufactured by Senju Metal Industry Co.,LTD.
for any Internal tests of this product.
(2) Flux
Use rosin type flux in soldering process.
If below flux is used, some problems might be caused in the product characteristics and reliability.
Please do not use below flux.
• Strong acidic flux (with halide content exceeding 0.2wt%).
• Water-soluble flux(*Water-soluble flux can be defined as non rosin type flux including wash-type flux
and non-wash-type flux.)
6. For removing the flux after soldering, observe the following points in order to avoid deterioration of
the characteristics or any change of the external electrodes quality.
(1) Cleaning Conditions
Solvent
Dipping Cleaning
Ultrasonic Cleaning
Less than 5 min.
A sufficient cleaning shall
Less than 1 min.
at room temp.
be applied to remove flux
20W/L max.
2-propanol
or
completely.
Frequency of several 10 kHz
Less than 2 min.
to several 100 kHz.
at 40°C max.
(2) Drying : After cleaning, dry promptly this product.
7. In your mounting process, observe the following points in order to avoid deterioration of the
characteristics or destruction of this product. The mounting quality of this product may also be affected by
the mounting conditions, shown the points below.
This product is for only reflow soldering. Flow soldering shall not be allowed.
Please mount this product by soldering. When mounted by other methods, such as conductive adhesives,
please contact us in advance.
(1) Standard Land Size
Too big land size gives too much solder paste on the land. It may cause destruction of this product,
because of the mechanical stress especially in the case of board bending.
b
a
c
a
0.6~0.8
b
0.6~0.7
c
0.6~0.8
(mm)
(2) Printing Conditions of Solder Paste
i.
Standard thickness of solder paste printing shall be from 0.15 to 0.20 mm.
ii.After soldering, the solder fillet shall be a height from 0.2 mm to the thickness of this product.
(See the figures below.)
iii.Too much solder gives too strong mechanical stress to this product, such stress may cause cracking
or any mechanical damage. And also, it can destroy the electrical performance of this product.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-017O
