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PS-7010-EEE-2541-2187M5

SAW Oscillator,

器件类别:无源元件    振荡器   

厂商名称:Microsemi

厂商官网:https://www.microsemi.com

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器件参数
参数名称
属性值
Reach Compliance Code
compliant
振荡器类型
SAW OSCILLATOR
文档预览
High Shock Discrete
SAW Oscillator
PS-701
PS-701
Description
The PS-701 SO (Saw Oscillator) from Vectron is a high frequency, ultra low phase noise oscillator designed to support high speed
data converters and 100G / 400G coherent optical receivers. The PS-701 provides 9fs rms jitter in a 12kHz to 20MHz integration
bandwidth and is available from 0.6 to 3.0GHz. Due to its robust construction it can withstand shock up to 20.000g
Features
Frequency Range 0.6 to 3.0 GHz
Ultra low jitter performance
Typical Jitter: 9fsec rms, 12kHz to 20MHz
3.3 + 5V supply voltage
Output: Sinewave & LVPECL
5x7 mm SMD package
20.000G shock survival
See table on Page 5 for standard frequencies
Applications
Military
Test & Measurement
Industrial
Communication
Performance Specifications
Frequency Stabilities
Parameter
Over All Tolerance
Min
Typ
Max
±250
Units
ppm
Notes
Includes df vs:
•Initial
•Operating temperature range +10 .. 85°C
•Aging 10 years
•Supply Voltage Change 5%
•Load change 10%
Supply Voltage (Vs)
Supply voltage (standard)
Current consumption
Supply voltage (standard)
Current consumption
3.135
3.3
4.75
5.00
5.25
50
3.465
75
95
V DC
mA
V DC
mA
mA
@ sinewave
@ LVPECL
@ sinewave
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Performance Specifications (Continued)
RF Output
Parameter
Signal
Load
Output Power
Signal
Load
Duty Cycle
Phase Noise: 100Hz offset
Phase Noise: 1kHz offset
Phase Noise: 10kHz offset
Phase Noise: 100kHz offset
Phase Noise: 1MHz offset
Phase Noise: 10MHz offset
Phase Noise: 40MHz offset
Jitter: 12kHz to 20MHz offset
45
45
-83
-113
-140
-152
-155
-165
-167
9
50
45
4
50
7
LVPECL
55
55
Ω
%
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
fs rms
@ 1GHz
Sinewave
3.3V
Min
Typ
Max
Sinewave
55
10
Units
Ω
dBm
Notes
Package G352
Package G356
Additional Parameters
Parameter
Weight
Subharmonics
Processing and Packing
Min
1.0g
Max
-20
Units
dBc
> 1.2 GHz
Notes
Handling and Processing Note
Absolute Maximum Ratings
Parameter
Supply Voltage (V
S
)
Operable Temperature Range
Storage Temperature Range
-40
-40
Min
Max
6.0
+85
+95
Units
V
0C
0C
Notes
Environmental Conditions
Rapid Temperature Changes
Vibration
Shock
Solderability
Solvent Resistance
ESD
Moisture Sensitivity
RoHS Compliance
MIL-883-1010 Cond B 500 cycles -55/125C
MIL-STD-883 Meth 2007 Cond A: 20g 20-2000Hz 4x in each 3axis 4 min sweep time
MIL-STD-883G Meth 2002.4 Cond. D: 5000g 0,3ms 6 shocks in each direction
MIL-STD-883G Meth 2002.4 Cond. E: 20000g 0,2ms 1 shock
J-STD-002C Cond A, leaded Cond. B SMD (MIL-STD-883 M 2003); 245°C
Dip&Look with 8h damp pre-treatment
MIL-STD-883 Meth 2015 Solv. 1,3,4
JESD22-A114F Class 1; 10* 800V
Level 1 JESD22-A113-B
100% ROHS Compliant
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Typical Performance
Performance
Phase Noise
Specifications (Continued)
PS-701 @ 1GHz Sinewave
3 of 6
Outline Drawing / Enclosure
Package Codes
Code
G352
G356
Height “H”
2.5
2.5
Pin Length “L”
N/A
N/A
Dimensions in mm
Pin Assignment Sinewave (G352)
1
2
3
4
N.C.
GND
RF-Out
Supply Voltage Input (V
S
)
1
2
3
4
5
6
Pin Assignment LVPECL (G356)
N.C.
Enable
GND
RF-Out
RF-Out_complementary
Supply Voltage Input (V
S
)
Marking
PS-701-xxxx
Frequency
•AYYWW
Enable true table (optional)
LVPECL
Pin 2
High
Open
Low
Pin 4
Data
Data
No Data
Pin 5
Compl. Data
Compl. Data
No Data
4 of 6
Standard Shipping Method
Position in tape
Pin1
A
1.75±0.1
4.0
K
XXXXX
XXXXX
Unwinding direction
B
B
cross-section
A-A
R
0.7
5
A
A
±0.05
P
0.2
0
if W < 32mm only upper hole line existent
cross-section
B-B
Dimension in mm:
A, B and K are dependent uppon component dimensions
production tolerance complying DIN IEC 286-3
All dimensions in millimeters unless otherwise stated
Enclosure Type
G352 / G356
Tape Width W (mm)
24
Quantity per meter
Quantity per reel
750
W
B
Dimension P (mm)
12
Recommended Reflow Profile
TP: max 250°C (@ solder joint,
customer board level)
T
p
: max: 10…30 sec
Additional Information:
This SMD oscillator has been
designed for pick and place reflow
soldering
SMD oscillators must be on the top
side of the PCB during the reflow
process.
5 of 6
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