PX-400
Clock Oscillator
400
PX-
Features
*
*
Performance Specifications
Frequency Stabilities
Parameter
Min
Typ
Max
Units
Condition
Initial tolerance
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Performance Specifications
Frequency Stabilities
Parameter
Min
Typ
Max
Units
Condition
Supply Voltage (Vs)
RF Output
Signal
HCMOS / ACMOS
ns
ns
ns
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Performance Specifications
Frequency Stabilities
Parameter
Signal
Min
Typ
Max
TTL
0
4
Units
TTL
Condition
2.4
0.8 V
TTL
2.0 V
ns
ns
Absolute Maximum Ratings
V
V
Additional Parameters
Vectron Verification
Standard Environmentals
Acceleration
202
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Outline Drawing / Enclosure
Code 0 (4 pin)
0
Code 2 (4 pin SMD)
2
Code 1 (14 pin)
1
Code 3 (4 pin with stand-offs)
3
Pin Connections
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Recommended Reflow Profile
tp
T
p
Ramp up
Ts
Critical Zone
T
L
to T
p
T
L
Temperature
t
L
Ramp dow n
Ts
ts
preheat
25
t 25°C to peak
Time
230°C Reflow Profile
W
&
^ W
3°C/seconds max.
135°C
155°C
60-90 seconds
W
&
^ W
4 minutes max.
Average ramp-up rate (TL to TP)
Preheat - Temperature min Tsmin
- Temperature Min Tsmax
- Time (min to max) (ts)
Tsmax to TL -Ramp-up Rate
Time maintained above - Temperature (TL)
- Time (TL)
Peak Temperature (Tp)
E
Time 25°C to Peak Temperature
Time maintained above
- Temperature (TL)
183°C
45-60 seconds
Standard Shipping Method
- Time (tL)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
3°C/seconds max.
183°C
40-60 seconds
max 230°C
10-20 seconds max.
6°C/seconds max.
All temperatures refer to topside of the package, measured on the package body surface.
260°C Reflow Profile
W
&
W &
3°C/seconds max.
150°C
200°C
60-180 seconds
3°C/seconds max.
217°C
60-150 seconds
max 260°C
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
6°C/seconds max.
20-40 seconds max.
W
&
W &
8 minutes max.
Average ramp-up rate (TL to TP)
Preheat - Temperature min Tsmin
- Temperature min Tsmax
- Time (min to max) (ts)
Tsmax to TL -Ramp-up Rate
Time maintained above - Temperature (TL)
- Time (TL)
Peak Temperature (Tp)
E
Time 25°C to Peak Temperature
Time maintained above
- Temperature (TL)
- Time (tL)
217°C
60-150 seconds
All temperatures refer to topside of the package, measured on the package body surface.
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模拟电子
