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PX1012AI-EL1/G,557

IC PCI-EXPRESS X1 PHY 81-LFBGA

器件类别:无线/射频/通信    电信电路   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
零件包装代码
BGA
包装说明
LFBGA,
针数
81
制造商包装代码
SOT-643-1
Reach Compliance Code
compliant
JESD-30 代码
S-PBGA-B81
JESD-609代码
e1
长度
9 mm
功能数量
1
端子数量
81
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
PLASTIC/EPOXY
封装代码
LFBGA
封装形状
SQUARE
封装形式
GRID ARRAY, LOW PROFILE, FINE PITCH
认证状态
Not Qualified
座面最大高度
1.6 mm
标称供电电压
1.2 V
表面贴装
YES
电信集成电路类型
INTERFACE CIRCUIT
温度等级
INDUSTRIAL
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
宽度
9 mm
Base Number Matches
1
文档预览
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
Rev. 02 — 18 May 2006
Product data sheet
1. General description
The PX1011A/PX1012A is a high-performance, low-power, single-lane PCI Express
electrical PHYsical layer (PHY) that handles the low level PCI Express protocol and
signaling. The PX1011A/1012A PCI Express PHY is compliant to the
PCI Express Base
Specification, Rev. 1.0a,
and
Rev. 1.1.
The PX1011A/1012A includes features such as
clock and data recovery (CDR), data serialization and de-serialization, 8b/10b encoding,
analog buffers, elastic buffer and receiver detection, and provides superior performance to
the Media Access Control (MAC) layer devices.
The PX1011A/1012A is a 2.5 Gbit/s PCI Express PHY with 8-bit data PXPIPE interface.
Its PXPIPE interface is a superset of the PHY Interface for the PCI Express (PIPE)
specification, enhanced and adapted for off-chip applications with the introduction of a
source synchronous clock for transmit and receive data. The 8-bit data interface operates
at 250 MHz with SSTL_2 signaling. The SSTL_2 signaling is compatible with the I/O
interfaces available in FPGA products.
The PX1011A/1012A PCI Express PHY supports advanced power management
functions. The PX1011AI/PX1012AI is for the industrial temperature range (−40
°C
to
+85
°C).
2. Features
2.1 PCI Express interface
I
I
I
I
I
I
I
I
I
I
Compliant to
PCI Express Base Specification 1.1
Single PCI Express 2.5 Gbit/s lane
Data and clock recovery from serial stream
Serializer and De-serializer (SerDes)
Receiver detection
8b/10b coding and decoding, elastic buffer and word alignment
Supports loopback
Supports direct disparity control for use in transmitting compliance pattern
Supports lane polarity inversion
Low jitter and Bit Error Rate (BER)
2.2 PHY/MAC interface
I
I
I
I
Based on Intel PHY Interface for PCI Express architecture v1.0 (PIPE)
Adapted for off-chip with additional synchronous clock signals (PXPIPE)
8-bit parallel data interface for transmit and receive at 250 MHz
2.5 V SSTL_2 class I signaling
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
2.3 JTAG interface
I
JTAG (IEEE 1149.1) boundary scan interface
I
Built-In Self Test (BIST) controller tests SerDes and I/O blocks at speed
I
3.3 V CMOS signaling
2.4 Power management
I
Dissipates < 300 mW in L0 normal mode
I
Support power management of L0, L0s and L1
2.5 Clock
I
100 MHz external reference clock with
±300
ppm tolerance
I
Supports spread spectrum clock to reduce EMI
I
On-chip reference clock termination
2.6 Miscellaneous
I
LFBGA81 lead or lead free package
I
Operating ambient temperature
N
Commercial: 0
°C
to +70
°C
N
Industrial:
−40 °C
to +85
°C
I
ESD protection voltage for Human Body Model (HBM): 2000 V
3. Quick reference data
Table 1.
V
DDD1
V
DDD2
V
DDD3
V
DD
V
DDA1
V
DDA2
f
clk(ref)
T
amb
Quick reference data
Conditions
for JTAG I/O
for SSTL_2 I/O
for core
for high-speed
serial I/O and PVT
for serializer
for serializer
operating
commercial
industrial
0
−40
-
-
+70
+85
°C
°C
Min
3.0
2.3
1.2
1.15
1.2
3.0
99.97
Typ
3.3
2.5
1.25
1.2
1.25
3.3
100
Max
3.6
2.7
1.3
1.25
1.3
3.6
100.03
Unit
V
V
V
V
V
V
MHz
digital supply voltage 1
digital supply voltage 2
digital supply voltage 3
supply voltage
analog supply voltage 1
analog supply voltage 2
reference clock frequency
ambient temperature
Symbol Parameter
PX1011A_PX1012A_2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 18 May 2006
2 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
4. Ordering information
Table 2.
Ordering information
Solder process
SnPb solder ball
compound
Pb-free (SnAgCu
solder ball compound)
Package
Name
PX1011A-EL1
PX1011A-EL1/G
LFBGA81
LFBGA81
LFBGA81
LFBGA81
LFBGA81
Description
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
×
9
×
1.05 mm
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
×
9
×
1.05 mm
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
×
9
×
1.05 mm
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
×
9
×
1.05 mm
plastic low profile fine-pitch ball grid array package;
81 balls; body 9
×
9
×
1.05 mm
Version
SOT643-1
SOT643-1
SOT643-1
SOT643-1
SOT643-1
Type number
PX1011AI-EL1/G Pb-free (SnAgCu
solder ball compound)
PX1012A-EL1/G
Pb-free (SnAgCu
solder ball compound)
PX1012AI-EL1/G Pb-free (SnAgCu
solder ball compound)
5. Marking
Table 3.
Line
A
B
C
Leaded package marking
Marking
PX1011A-EL1
xxxxxxx
2PNyyww
Description
full basic type number
diffusion lot number
manufacturing code:
2 = diffusion site
P = assembly site
N = leaded
yy = year code
ww = week code
Table 4.
Line
A
Lead-free package marking
Marking
PX1011A-EL1/G
PX1012A-EL1/G
PX1011AI-EL1/G
[1]
PX1012AI-EL1/G
[1]
B
C
xxxxxxx
2PGyyww
diffusion lot number
manufacturing code:
2 = diffusion site
P = assembly site
G = lead-free
yy = year code
ww = week code
[1]
Industrial temperature range.
Description
full basic type number
PX1011A_PX1012A_2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 18 May 2006
3 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
6. Block diagram
PCI Express MAC
TXCLK
TXDATA [7:0]
RXCLK
RXDATA [7:0]
RESET_N
PCI Express PHY
Ln_TxData0
REGISTER
8
Ln_TxData1
8b/10b
ENCODE
PARALLEL
TO
SERIAL
10b/8b
DECODE
ELASTIC
BUFFER
10
SERIAL
TO
PARALLEL
K28.5
DETECTION
250 MHz
clock
DATA
RECOVERY
CIRCUIT
CLK
GENERATOR
CLOCK RECOVERY
CIRCUIT PLL
TX I/O
REFCLK I/O
RX I/O
bit stream at 2.5 Gbit/s
TX_P TX_N REFCLK_P REFCLK_N
RX_P RX_N
002aac211
Fig 1. Block diagram
PX1011A_PX1012A_2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 18 May 2006
4 of 32
Philips Semiconductors
PX1011A/PX1012A
PCI Express stand-alone X1 PHY
7. Pinning information
7.1 Pinning
PX1011A-EL1
PX1011A-EL1/G
PX1011AI-EL1/G
PX1012A-EL1/G
PX1012AI-EL1/G
1 2 3 4 5 6 7 8 9
A
B
C
D
E
F
G
H
J
002aac171
ball A1
index area
Transparent top view
Fig 2. Pin configuration
1
A
B
C
D
E
F
G
H
J
V
SS
REFCLK_P
REFCLK_N
V
SS
RX_P
RX_N
V
SS
TX_P
TX_N
2
RXIDLE
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
VREFS
3
RXDATA6
RXDATA7
V
DDD2
V
DD
V
DDD1
TCK
TDI
TDO
RESET_N
4
RXDATA4
RXDATA5
V
SS
V
DDA2
TMS
TRST_N
V
SS
TXIDLE
RXPOL
5
RXDATA3
V
SS
V
DDD2
V
DDA1
V
DDD1
V
DDD3
V
DDD2
V
SS
TXCOMP
6
RXDATA1
RXDATA2
V
SS
PVT
V
DDD3
V
DDD3
V
SS
PWRDWN0
PWRDWN1
7
RXDATAK
RXDATA0
V
DDD2
V
SS
V
DDD2
V
SS
V
DDD2
RXDET_
LOOPB
TXDATAK
8
RXCLK
V
SS
RXVALID
PHYSTATUS
V
SS
TXDATA3
TXDATA5
V
SS
TXCLK
9
RXSTATUS0
RXSTATUS1
RXSTATUS2
TXDATA0
TXDATA1
TXDATA2
TXDATA4
TXDATA6
TXDATA7
002aac210
Transparent top view.
Fig 3. Ball mapping
PX1011A_PX1012A_2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 18 May 2006
5 of 32
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