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PZUxDB2 series
Dual Zener diodes
Rev. 01 — 31 March 2008
Product data sheet
1. Product profile
1.1 General description
Dual isolated general-purpose Zener diodes in SOT353 (SC-88A) very small
Surface-Mounted Device (SMD) standard plastic and dark-green plastic packages.
1.2 Features
I
Non-repetitive peak reverse power
dissipation: P
ZSM
= 40 W
I
Total power dissipation: P
tot
≤
250 mW
I
Tolerance series:
B2: approximately
±2
%
I
Wide working voltage range:
nominal 2.7 V to 24 V
I
Dual isolated diodes configuration
I
Small standard plastic package suitable
for surface-mounted design
I
Small dark-green, halogen-free plastic
package suitable for surface-mounted
design
I
AEC-Q101 qualified
1.3 Applications
I
General regulation functions
1.4 Quick reference data
Table 1.
Symbol
Per diode
V
F
P
ZSM
[1]
[2]
Quick reference data
Parameter
forward voltage
non-repetitive peak reverse
power dissipation
Conditions
I
F
= 100 mA
[1]
[2]
Min
-
-
Typ
-
-
Max
1.1
40
Unit
V
W
Pulse test: t
p
≤
300
µs; δ ≤
0.02.
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
2. Pinning information
Table 2.
Pin
1
2
3
4
5
Pinning
Description
anode (diode 1)
not connected
anode (diode 2)
cathode (diode 2)
cathode (diode 1)
1
2
3
1
2
3
006aab219
Simplified outline
5
4
Graphic symbol
5
4
3. Ordering information
Table 3.
Ordering information
Package
Name
PZU2.7DB2 to
PZU24DB2
[1]
PZU2.7DB2/DG to
PZU24DB2/DG
[1][2]
[1]
[2]
The series consists of 25 types with nominal working voltages from 2.7 V to 24 V.
/DG: halogen-free plastic package
Type number
Description
plastic surface-mounted package; 5 leads
Version
SOT353
SC-88A
4. Marking
Table 4.
Marking codes
Marking code
[1]
T1*
T2*
T3*
T4*
T5*
T6*
T7*
T8*
T9*
TA*
TB*
TC*
TD*
TE*
Type number
[2]
PZU2.7DB2/DG
PZU3.0DB2/DG
PZU3.3DB2/DG
PZU3.6DB2/DG
PZU3.9DB2/DG
PZU4.3DB2/DG
PZU4.7DB2/DG
PZU5.1DB2/DG
PZU5.6DB2/DG
PZU6.2DB2/DG
PZU6.8DB2/DG
PZU7.5DB2/DG
PZU8.2DB2/DG
PZU9.1DB2/DG
Marking code
[1]
U1*
U2*
U3*
U4*
U5*
U6*
U7*
U8*
U9*
UA*
UB*
UC*
UD*
UE*
Type number
PZU2.7DB2
PZU3.0DB2
PZU3.3DB2
PZU3.6DB2
PZU3.9DB2
PZU4.3DB2
PZU4.7DB2
PZU5.1DB2
PZU5.6DB2
PZU6.2DB2
PZU6.8DB2
PZU7.5DB2
PZU8.2DB2
PZU9.1DB2
PZUXDB2_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 31 March 2008
2 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
Marking codes
…continued
Marking code
[1]
TF*
TG*
TH*
TK*
TL*
TM*
TN*
TP*
TR*
TS*
TT*
Type number
[2]
PZU10DB2/DG
PZU11DB2/DG
PZU12DB2/DG
PZU13DB2/DG
PZU14DB2/DG
PZU15DB2/DG
PZU16DB2/DG
PZU18DB2/DG
PZU20DB2/DG
PZU22DB2/DG
PZU24DB2/DG
Marking code
[1]
UF*
UG*
UH*
UK*
UL*
UM*
UN*
UP*
UR*
US*
UT*
Table 4.
PZU10DB2
PZU11DB2
PZU12DB2
PZU13DB2
PZU14DB2
PZU15DB2
PZU16DB2
PZU18DB2
PZU20DB2
PZU22DB2
PZU24DB2
[1]
Type number
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
/DG: halogen-free plastic package
[2]
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per diode
I
F
I
ZSM
P
ZSM
Per device
P
tot
T
j
T
amb
T
stg
[1]
[2]
[3]
Parameter
forward current
non-repetitive peak reverse
current
non-repetitive peak reverse
power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
Conditions
Min
-
[1]
Max
200
see
Table 8
40
Unit
mA
-
-
[1]
W
T
amb
≤
25
°C
[2]
[3]
-
-
-
−55
−65
250
275
150
+150
+150
mW
mW
°C
°C
°C
t
p
= 100
µs;
square wave; T
j
= 25
°C
prior to surge
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
PZUXDB2_SER_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 31 March 2008
3 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
6. Thermal characteristics
Table 6.
Symbol
Per device
R
th(j-a)
R
th(j-sp)
[1]
[2]
[3]
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Conditions
in free air
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
500
455
200
Unit
K/W
K/W
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
Soldering points at pin 4 and pin 5.
7. Characteristics
Table 7.
Characteristics
T
j
= 25
°
C unless otherwise specified.
Symbol
Per diode
V
F
forward voltage
I
F
= 10 mA
I
F
= 100 mA
[1]
Pulse test: t
p
≤
300
µs; δ ≤
0.02.
[1]
Parameter
Conditions
Min
Typ
Max
Unit
-
-
-
-
0.9
1.1
V
V
Table 8.
Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG
T
j
= 25
°
C unless otherwise specified.
PZUxDB2
Working
PZUxDB2/DG voltage
V
Z
(V)
I
Z
= 5 mA
Min
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
PZUXDB2_SER_1
Differential resistance Reverse
current
r (Ω)
dif
Temperature
coefficient
S
Z
(mV/K)
I
Z
= 5 mA
I
R
(µA)
I
Z
= 0.5 mA I
Z
= 5 mA
Max
1000
1000
1000
1000
1000
1000
800
250
100
80
60
60
Max
100
95
95
90
90
90
80
60
40
30
20
10
Max
20
10
5
5
3
3
2
2
1
0.5
0.5
0.5
V
R
(V)
1
1
1
1
1
1
1
1.5
2.5
3
3.5
4
Diode
Non-repetitive
capacitance peak reverse
current
C (pF)
[1]
d
I
ZSM
(A)
[2]
Max
2.9
3.2
3.5
3.8
4.1
4.34
4.75
5.2
5.73
6.33
6.93
7.6
Typ
−2.0
−2.1
−2.4
−2.4
−2.5
−2.5
−1.4
0.3
1.9
2.7
3.4
4.0
Max
440
425
410
390
370
350
325
300
275
250
215
170
Max
8
8
8
8
8
8
8
5.5
5.5
5.5
5.5
3.5
© NXP B.V. 2008. All rights reserved.
2.65
2.95
3.25
3.55
3.87
4.15
4.55
4.98
5.49
6.06
6.65
7.28
Product data sheet
Rev. 01 — 31 March 2008
4 of 12
嵌入式系统
