首页 > 器件类别 > 无源元件 > 晶体/谐振器

QESM012110LO1000FREQ2

Series - Fundamental Quartz Crystal, 10MHz Min, 13.999MHz Max, ROHS COMPLIANT, CERAMIC, SMD, 2 PIN

器件类别:无源元件    晶体/谐振器   

厂商名称:Rakon Limited

器件标准:  

下载文档
器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Rakon Limited
包装说明
ROHS COMPLIANT, CERAMIC, SMD, 2 PIN
Reach Compliance Code
unknown
其他特性
AT CUT CRYSTAL; TAPE AND REEL
老化
5 PPM/FIRST YEAR
晶体/谐振器类型
SERIES - FUNDAMENTAL
驱动电平
10 µW
频率稳定性
0.001%
频率容差
10 ppm
安装特点
SURFACE MOUNT
最大工作频率
13.999 MHz
最小工作频率
10 MHz
最高工作温度
60 °C
最低工作温度
物理尺寸
L7.0XB5.0XH1.3 (mm)/L0.276XB0.197XH0.051 (inch)
串联电阻
50 Ω
表面贴装
YES
文档预览
FREQUENCY
QESM012
SMD 7.0x5.0 Crystal – Ceramic SMD 2 pads packaged
Specification (Rev-A)
Electrical Characteristics ......................................................P01
ESR vs. frequency range and Mode of vibration ..................P01
Mechanical Characteristics ...................................................P01
Ordering Information .............................................................P02
Suggested Reflow Soldering profile ......................................P02
Tape Drawing........................................................................P03
Reel Drawing ........................................................................P03
Frequency
QESM012
SMD 7.0x5.0 Crystal – Ceramic SMD 2 pads packaged
Specification (rev-A)
July 05
st
, 2006
Electrical Characteristics
Electrical Parameters
Frequency range
Temperature Stability
Operating Temperature Range
Storage temperature range
Shunt capacitance C
0
Load capacitance
Drive level
Aging (First Year)
Insulator resistance
Unit
MHz
± ppm
°C
°C
pF
pF
µW
± ppm
MΩ
500
10
100
-40
Minimum Typical Maximum
6
10
10
30
30
-20/+70
100
50
50
-40/+85
+85
7.0
10pF ~ 32pF or series
300
5
Ref at 25°C
At 100V
DC
Customized specification upon request
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Test conditions
Frequency Tolerance
(at 25°C) ± ppm
ESR vs. frequency range and Mode of vibration
Frequency range
(MHz)
6.000 to 9.999
10.000 to 13.999
14.000 to 19.999
Mode of vibration Max ESR (Ω)
Fund. / AT
Fund. / AT
Fund. / AT
100
50
40
Frequency range
(MHz)
20.000 to 35.000
35.000 to 39.999
40.000 to 100.000
Mode of vibration
Fund. / BT
3
rd
/ AT
3
rd
/ AT
Max ESR (Ω)
40
100
80
Mechanical Characteristics
Marking for QESM06
Line 1 Manuf code +Temex
code (6 digits)
Line 2 Frequency in MHz
(6digits)
Mechanical conditions
Vibration 10g, 10Hz to 2KHz
according to standard
CEI 68-2-63
Shocks
100g, 6ms according
to standard CEI 68-2-
27
Top view
Suggested pad
Note 1 :
QESM012 is fully RoHS
compliant.
H
H = 1.30 mm max
1
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM012
SMD 7.0x5.0 Crystal – Ceramic SMD 2 pads packaged
Specification (rev-A)
July 05
st
, 2006
Ordering Information
QESM012
1
Part numbering system
30
HQ
50
20
14.7456MHZ
Package type
Vibration
mode
1=Fundamental
3=3
rd
overtone
Frequency
tolerance
Operating
temperature
range
Frequency
stability
Load
Capacitance
00=series
10=10pF
30=30pF
Please, enter the
value of load
capacitance
Nominal
Frequency
(MHz)
Please enter the
nominal
frequency
SMD Package
QESM012 :
SMD
ceramic 7.0 x 5.0
2 pads
10=±10ppm
20=±20ppm
30=±30ppm
50=±50ppm
D=-40°C
F= -30°C
H=-20°C
J=-10°C
L=0°C
M=+50°C
N=+55°C
O=+60°C
Q=+70°C
T=+85°C
10=±10ppm
20=±20ppm
30=±30ppm
50=±50ppm
Suggested Reflow Soldering Profile
2
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM012
SMD 7.0x5.0 Crystal – Ceramic SMD 2 pads packaged
Specification (rev-A)
July 05
st
, 2006
Tape Drawing
Item
Pitch of components
Pitch of sprocket hole
Length from hole center to component center
Width of carrier tape
Width of adhesive tape
Height of component hole
Width of component hole
Gap of hold down tape and carrier tape
Diameter of sprocket hole
Diameter of feed hole
Total of tape thickness
Code
P
Po
P1
W
W0
A
B
W2
Do
D1
K
Dimension
8.0
4.0
2.0
16.0
7.5
8.18
5.56
1.75
1.5
1.5
2.16
Tolerance
± 0.1
± 0.1
± 0.1
+0.3/-0.1
± 0.1
± 0.1
± 0.1
± 0.1
± 0.05
± 0.25
± 0.1
Reel Drawing
Multiple
: 1Kpcs per Reel
Unit : mm
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
查看更多>
freescale 朋友们都留下你们的qq,我们进行技术交流
freescale 朋友们都留下你们的qq,我们进行技术交流 freescale 朋友们都留下你们的...
lowei 嵌入式系统
在wince上开发程序用ppb 超简单
在wince上开发程序用ppb 超简单 ppb 即 pocketbuilder........
nsjnc WindowsCE
数字电路接地为什么要走环路?
各位,我自己做过一段时间的硬件,而且设计了几块电路板和pcb,但是在接地上,有几个问题, 请教 ...
fu2521 嵌入式系统
DSP基础--定点小数运算
在DSP世界中,由于DSP芯片的限制,经常使用定点小数运算。所谓定点小数,实际上就是用整数来进行...
Jacktang DSP 与 ARM 处理器
50大洋的诱惑 - th2822的技术分析
此内容由EEWORLD论坛网友 fickle 原创,如需转载或用于商业用途需征得作者同意并注明...
fickle 工控电子
关于GPU编程的讨论
图形处理器(Graphics Processing Unit, GPU)和中央处理器(Centra...
ljg2np 综合技术交流
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消