首页 > 器件类别 > 无源元件 > 晶体/谐振器

QESM04130HM5030FREQ1

Parallel - Fundamental Quartz Crystal, 10MHz Min, 10.999MHz Max, ROHS COMPLIANT, CERAMIC, SMD, 4 PIN

器件类别:无源元件    晶体/谐振器   

厂商名称:Temex Ceramics

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Temex Ceramics
包装说明
ROHS COMPLIANT, CERAMIC, SMD, 4 PIN
Reach Compliance Code
unknown
其他特性
TAPE AND REEL; AT CUT CRYSTAL
老化
3 PPM/FIRST YEAR
晶体/谐振器类型
PARALLEL - FUNDAMENTAL
驱动电平
10 µW
频率稳定性
0.005%
频率容差
30 ppm
负载电容
30 pF
安装特点
SURFACE MOUNT
最大工作频率
10.999 MHz
最小工作频率
10 MHz
最高工作温度
50 °C
最低工作温度
-20 °C
物理尺寸
L6.0XB3.5XH1.1 (mm)/L0.236XB0.138XH0.043 (inch)
串联电阻
100 Ω
表面贴装
YES
Base Number Matches
1
文档预览
FREQUENCY
QESM04
SMD 6.0x3.5 Crystal – Ceramic SMD packaged
Specification (Rev-D)
Electrical Characteristics ......................................................P01
ESR vs. frequency range and Mode of vibration ..................P01
Mechanical Characteristics ...................................................P01
Ordering Information .............................................................P02
Suggested Reflow Soldering profile ......................................P02
Tape Drawing........................................................................P03
Reel Drawing ........................................................................P03
Frequency
QESM04
SMD 6.0x3.5 Crystal – Ceramic SMD packaged
Specification (rev-D)
September 01
th
, 2006
Electrical Characteristics
Electrical Parameters
Frequency range
Temperature Stability
Operating Temperature Range
Storage temperature range
Shunt capacitance C
0
Load capacitance
Drive level
Aging (First Year)
Insulator resistance
Unit
MHz
± ppm
°C
°C
pF
pF
µW
± ppm
MΩ
500
10
-40
Minimum Typical Maximum
10
10
10
30
30
-20/+70
80
50
50
-40/+85
+85
7.0
10pF ~ 30pF or series
100
3
Ref at 25°C
At 100V
DC
Customized specification upon request
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Refer to Ordering Information
Test conditions
Frequency Tolerance
(at 25°C) ± ppm
ESR vs. frequency range and Mode of vibration
Frequency range
(MHz)
10.000 to 10.999
11.000 to 11.999
12.000 to 15.999
Mode of vibration Max ESR (Ω)
Fund. / AT
Fund. / AT
Fund. / AT
100
80
60
Frequency range
(MHz)
16.000 to 39.999
40.000 to 80.000
Mode of vibration
Fund. / AT
3
rd
/ AT
Max ESR (Ω)
40
70
Mechanical Characteristics
Marking for QESM04
Line 1 Manuf code +Temex
code (6 digits)
Line 2 Frequency in MHz
(6digits)
Mechanical conditions
Vibration 10g, 10Hz to 2KHz
according to standard
CEI 68-2-63
Shocks
100g, 6ms according
to standard CEI 68-2-
27
Top view
Suggested pad
Note 1 :
QESM04 is fully RoHS
compliant.
H
H = 1.1 mm max
1
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM04
SMD 6.0x3.5 Crystal – Ceramic SMD packaged
Specification (rev-D)
September 01
th
, 2006
Ordering Information
QESM04
1
Part numbering system
10
JQ
10
08
39.000MHZ
Package type
Vibration
mode
1=Fundamental
3=3
rd
overtone
Frequency
tolerance
Operating
temperature
range
Frequency
stability
Load
Capacitance
00=series
10=10pF
30=30pF
Please, enter the
value of load
capacitance
Nominal
Frequency
(MHz)
Please enter the
nominal
frequency
SMD Package
QESM04 :
SMD
ceramic 6.0 x 3.5
4 pads
10=±10ppm
20=±20ppm
30=±30ppm
50=±50ppm
D=-40°C
F= -30°C
H=-20°C
J=-10°C
L=0°C
M=+50°C
N=+55°C
O=+60°C
Q=+70°C
T=+85°C
10=±10ppm
20=±20ppm
30=±30ppm
50=±50ppm
Suggested Reflow Soldering Profile
2
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Frequency
QESM04
SMD 6.0x3.5 Crystal – Ceramic SMD packaged
Specification (rev-D)
September 01
th
, 2006
Tape Drawing
Item
Pitch of components
Pitch of sprocket hole
Length from hole center to component center
Width of carrier tape
Width of adhesive tape
Height of component hole
Width of component hole
Gap of hold down tape and carrier tape
Diameter of sprocket hole
Diameter of feed hole
Total of tape thickness
Code
P
Po
P1
W
W0
A
B
W2
Do
D1
K
Dimension
8.0
4.0
2.0
16.0
7.5
7.1
4.7
1.75
1.5
1.5
1.5
Tolerance
± 0.1
± 0.1
± 0.1
±
0.3
± 0.1
± 0.1
± 0.1
± 0.1
± 0.05
± 0.25
± 0.1
Reel Drawing
2.5
13.5
Ø21.6
Ø13.5
Multiple
: 1Kpcs per Reel
Unit : mm
Ø178
1.6
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
查看更多>
ucosii开发注意事项
ucosii开发注意事项 收藏了!谢谢版主有这么多好的资料分享哦。我也会把自己学习过程中的...
zjw50001 实时操作系统RTOS
半导体、微电子、集成电路技术基础介绍
微电子学(Microelectronics)是研究在半导体材料上构成的微小化电路及系统的电子学分支...
arui1999 下载中心专版
谁有能在wince5.0上[跑的金山词霸?
谁有能在wince5.0上[跑的金山词霸?能否给我一份。给个联接也行。 谁有能在wince5.0上[...
yjx356657845 WindowsCE
DSP连接仿真器的惨痛经历
不要带电插拔, 不要带电插拔, 不要带电插拔! 重要的事情说三遍,虽然带电插拔后没事,但还...
灞波儿奔 DSP 与 ARM 处理器
运放稳定性分析
一个外国人的关于运放稳定性分析的文章,觉得还可以,就发来共享一下 运放稳定性分析 看看。 LZ辛苦。...
huchha_0104 模拟电子
封装衬底的铜皮如何转换成焊盘,或者直接添加一个管脚序号
封装衬底的铜皮如何转换成焊盘,或者直接添加一个管脚序号 封装衬底的铜皮如何转换成焊盘,或者...
QWE4562009 PCB设计
热门器件
热门资源推荐
器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
需要登录后才可以下载。
登录取消