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QL3025-1PB256C

Field Programmable Gate Array, 672 CLBs, 25000 Gates, 225MHz, 672-Cell, CMOS, PBGA256, 27 X 27 MM, 2.13 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MS-034BAL-2, BGA-256

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:QuickLogic Corporation

厂商官网:https://www.quicklogic.com

下载文档
器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
QuickLogic Corporation
零件包装代码
BGA
包装说明
BGA, BGA256,20X20,50
针数
256
Reach Compliance Code
compliant
其他特性
CAN ALSO BE OPERATED AT 5.0V
最大时钟频率
225 MHz
CLB-Max的组合延迟
4.8 ns
JESD-30 代码
S-PBGA-B256
JESD-609代码
e0
长度
27 mm
湿度敏感等级
3
可配置逻辑块数量
672
等效关口数量
25000
输入次数
204
逻辑单元数量
672
输出次数
196
端子数量
256
最高工作温度
70 °C
最低工作温度
组织
672 CLBS, 25000 GATES
封装主体材料
PLASTIC/EPOXY
封装代码
BGA
封装等效代码
BGA256,20X20,50
封装形状
SQUARE
封装形式
GRID ARRAY
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
3.3,3.3/5 V
可编程逻辑类型
FIELD PROGRAMMABLE GATE ARRAY
认证状态
Not Qualified
座面最大高度
2.34 mm
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
27 mm
文档预览
QL3025 pASIC 3 FPGA Data Sheet
••••••
25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance
and High Density
Device Highlights
High Performance & High Density
25,000 Usable PLD Gates with 204 I/Os
300 MHz 16-bit Counters,
Four Low-Skew Distributed
Networks
Two array clock/control networks available
400 MHz Datapaths
0.35
µm
four-layer metal non-volatile
CMOS process for smallest die sizes
Easy to Use / Fast Development
Cycles
100% routable with 100% utilization and
to the logic cell flip-flop clock, set and reset
inputs — each driven by an input-only pin
Two global clock/control networks available
to the logic cell; F1, clock set, reset inputs
and the input, I/O register clock, reset, and
enable inputs as well as the output enable
control — each driven by an input-only or
I/O pin, or any logic cell output or I/O cell
feedback
complete pin-out stability
Variable-grain logic cells provide high
performance and 100% utilization
Comprehensive design tools include high
quality Verilog/VHDL synthesis
High Performance
Input + logic cell + output total delays
under 6 ns
Data path speeds over 400 MHz
Counter speeds over 300 MHz
Advanced I/O Capabilities
Interfaces with both 3.3 V and 5.0 V devices
PCI compliant with 3.3 V and 5.0 V buses
for -1/-2/-3/-4 speed grades
Full JTAG boundary scan
I/O Cells with individually controlled
Registered Input Path and Output Enables
Total of 204 I/O Pins
196 bidirectional input/output pins,
PCI-compliant for 5.0 V and 3.3 V buses for
-1/-2/-3/-4 speed grades
Four High Drive input-only pins
Four High Drive input-only/distributed
network pins
Figure 1: 672 pASIC 3 Logic Cells
© 2002 QuickLogic Corporation
www.quicklogic.com
1
QL3025 pASIC 3 FPGA Data Sheet Rev E
Architecture Overview
The QL3025 is a 25,000 usable PLD gate member of the pASIC 3 family of FPGAs.
pASIC 3 FPGAs are fabricated on a 0.35
µm
four-layer metal process using QuickLogic
's
patented ViaLink
technology to provide a unique combination of high performance, high
density, low cost, and extreme ease-of-use.
The QL3025 contains 672 logic cells. With a maximum of 204 I/Os, the QL3025 is
available in
144-pin TQFP, 208-pin PQFP, and 256-pin PBGA packages.
Software support for the complete pASIC 3 family, including the QL3025, is available
through three basic packages. The turnkey QuickWorks
package provides the most
complete FPGA software solution from design entry to logic synthesis, to place and route,
to simulation. The QuickTools
TM
for Workstations package provides a solution for designers
who use Cadence
, Exemplar
TM
, Mentor
, Synopsys
, Synplicity
, Viewlogic
TM
, Aldec
TM
,
or other third-party tools for design entry, synthesis, or simulation.
2
www.quicklogic.com
© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
Electrical Specifications
AC Characteristics at V
CC
= 3.3 V, TA = 25°C (K = 1.00)
To calculate delays, multiply the appropriate K factor from
Table 7
by the numbers provided
in
Table 1
through
Table 5
.
Table 1: Logic Cells
Symbol
Parameter
1
t
PD
t
SU
t
H
t
CLK
t
CWHI
t
CWLO
t
SET
t
RESET
t
SW
t
RW
Combinatorial Delay
Setup Time
b
Hold Time
Clock to Q Delay
Clock High Time
Clock Low Time
Set Delay
Reset Delay
Set Width
Reset Width
b
Propagation Delays (ns) Fanout
a
2
1.7
1.7
0.0
1.0
1.2
1.2
1.3
1.1
1.9
1.8
3
1.9
1.7
0.0
1.2
1.2
1.2
1.5
1.3
1.9
1.8
4
2.2
1.7
0.0
1.5
1.2
1.2
1.8
1.6
1.9
1.8
8
3.2
1.7
0.0
2.5
1.2
1.2
2.8
2.6
1.9
1.8
1.4
1.7
0.0
0.7
1.2
1.2
1.0
0.8
1.9
1.8
a. Stated timing for worst case Propagation Delay over process variation at V
CC
= 3.3 V and
TA = 25
°
C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature
settings as specified in
Table 7
.
b. These limits are derived from a representative selection of the slowest paths through the
pASIC 3 logic cell including typical net delays. Worst case delay values for specific paths should
be determined from timing analysis of your particular design.
Table 2: Input-Only/Clock Cells
Symbol
Parameter
1
t
IN
t
INI
t
ISU
t
IH
t
lCLK
t
lRST
t
lESU
t
lEH
High Drive Input Delay
High Drive Input, Inverting Delay
Input Register Set-Up Time
Input Register Hold Time
Input Register Clock To Q
Input Register Reset Delay
Input Register clock Enable Set-Up Time
Input Register Clock Enable Hold Time
1.5
1.6
3.1
0.0
0.7
0.6
2.3
0.0
Propagation Delays (ns) Fanout
a
2
1.6
1.7
3.1
0.0
0.8
0.7
2.3
0.0
3
1.8
1.9
3.1
0.0
1.0
0.9
2.3
0.0
4
1.9
2.0
3.1
0.0
1.1
1.0
2.3
0.0
8
2.4
2.5
3.1
0.0
1.6
1.5
2.3
0.0
12
2.9
3.0
3.1
0.0
2.1
2.0
2.3
0.0
24
4.4
4.5
3.1
0.0
3.6
3.5
2.3
0.0
a. Stated timing for worst case Propagation Delay over process variation at V
CC
= 3.3 V and
TA = 25
°
C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and tempera-
ture settings as specified in
Table 7
.
© 2002 QuickLogic Corporation
www.quicklogic.com
3
QL3025 pASIC 3 FPGA Data Sheet Rev E
Table 3: Clock Cells
Symbol
Parameter
Propagation Delays (ns) Loads per Half Column
a
1
t
ACK
t
GCKP
t
GCKB
Array Clock Delay
Global Clock Pin Delay
Global Clock Buffer Delay
1.2
0.7
0.8
2
1.2
0.7
0.8
3
1.3
0.7
0.9
4
1.3
0.7
0.9
8
1.5
0.7
1.1
10
1.6
0.7
1.2
11
1.7
0.7
1.3
a. The array distributed networks consist of 40 half columns and the global distributed networks con-
sist of 44 half columns, each driven by an independent buffer. The number of half columns used
does not affect clock buffer delay. The array clock has up to eight loads per half column. The glo-
bal clock has up to 11 loads per half column.
Table 4: Input-Only I/O Cells
Symbol
Parameter
Propagation Delays (ns) Fanout
a
1
t
I/O
t
ISU
t
IH
t
lOCLK
t
lORST
t
lESU
t
lEH
Input Delay (bidirectional pad)
Input Register Set-Up Time
Input Register Hold Time
Input Register Clock To Q
Input Register Reset Delay
Input Register clock Enable Set-Up Time
Input Register Clock Enable Hold Time
1.3
3.1
0.0
0.7
0.6
2.3
0.0
2
1.6
3.1
0.0
1.0
0.9
2.3
0.0
3
1.8
3.1
0.0
1.2
1.1
2.3
0.0
4
2.1
3.1
0.0
1.5
1.4
2.3
0.0
8
3.1
3.1
0.0
2.5
2.4
2.3
0.0
10
3.6
3.1
0.0
3.0
2.9
2.3
0.0
a. Stated timing for worst case Propagation Delay over process variation at V
CC
= 3.3 V and
TA = 25
°
C. Multiply by the appropriate Delay Factor, K, for speed grade, voltage, and temperature
settings as specified in
Table 7
.
4
www.quicklogic.com
© 2002 QuickLogic Corporation
QL3025 pASIC 3 FPGA Data Sheet Rev E
Table 5: Output-Only I/O Cells
Symbol
Parameter
30
t
OUTLH
t
OUTHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Output Delay Low to High
Output Delay High to Low
Output Delay Tri-state to High
Output Delay Tri-state to Low
Output Delay High to Tri-State
Output Delay Low to Tri-State
a
Propagation Delays (ns) Output Load
Capacitance (pF)
50
2.5
2.6
1.7
2.0
-
-
75
3.1
3.2
2.2
2.6
-
-
100
3.6
3.7
2.8
3.1
-
-
150
4.7
4.8
3.9
4.2
-
-
2.1
2.2
1.2
1.6
2.0
1.2
a. The following loads presented in
Figure 2
are used for t
PXZ
:
t
PHZ
1ΚΩ
5 pF
1ΚΩ
t
PLZ
5 pF
Figure 2: Loads used for t
PXZ
© 2002 QuickLogic Corporation
www.quicklogic.com
5
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