QLS1046A, QLS1026A
Qormino Integrated Multicore communication
processor with 4GB of DDR4
Preliminary Product brief
Features
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QLS1046A has four cores and QLS1026A has two
cores
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Additional peripheral interfaces
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One Quad Serial Peripheral Interface
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–
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–
–
–
–
–
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(QSPI) controller
One Serial Peripheral Interface (SPI) controller
Integrated flash controller (IFC) supporting
NAND and NOR flash
Three high-speed USB 3.0 controllers
with integrated PHY
One Enhanced Secure Digital Host
Controller supporting SD 3.0, eMMC 4.4,
and eMMC 4.5
Four I2C controllers
Two 16550-compliant DUARTs and six low-
power UARTs (LPUARTs)
General purpose IO (GPIO), eight Flextimers
One Queue Direct Memory Access
Controller (qDMA)
One Enhanced Direct Memory Access
Controller (eDMA)
Global programmable interrupt controller (GIC)
Thermal monitoring unit (TMU)
•
4GB of DDR4 with ECC
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Four 32-bit/64-bit Arm® Cortex®-v8 A72 CPUs
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Arranged as a single cluster of four cores
sharing a single 2 MB L2 cache
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Up to 1.8 GHz operation
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Single-threaded cores with 32 KB L1 data cache
and 48 KB L1 instruction cache
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Hierarchical interconnect fabric
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Up to 700 MHz operation
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Data Path Acceleration Architecture (DPAA)
incorporating acceleration for the following
functions:
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Packet parsing, classification, and
distribution (FMan)
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Queue management for scheduling, packet
sequencing, and congestion management
(QMan)
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Hardware buffer management for buffer
allocation and de-allocation (BMan)
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Cryptography acceleration (SEC)
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IEEE 1588™ support
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1415 FC-PBGA package, 26 mm x 44 mm
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Two RGMII interfaces
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Eight SerDes lanes for high-speed peripheral
interfaces
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Three PCI Express 3.0 controllers
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One Serial ATA (SATA 6 Gbit/s) controller
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Up to two XFI (10 GbE) interfaces
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Up to five SGMII interfaces supporting 1000 Mbps
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Up to three SGMII interfaces supporting 2500
Mbps
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Up to one QSGMII interface
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Supports 10GBase-KR
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Supports 1000Base-KX
Whilst Teledyne e2v Semiconductors SAS has taken care to ensure the accuracy of the information contained herein it accepts no responsibility for the
consequences of any use thereof and also reserves the right to change the specification of goods without notice. Teledyne e2v Semiconductors SAS
accepts no liability beyond the set out in its standard conditions of sale in respect of infringement of third party patents arising from the use of the devices
in accordance with information contained herein.
Teledyne e2v Semiconductors SAS, avenue de Rochepleine 38120 Saint-Egrève, FranceHolding Company: Teledyne e2v Semiconductors SAS
Telephone: +33 (0)4 76 58 30 00
Contact Teledyne e2v by e-mail: hotline-std@teledyne-e2v.com or visit www.teledyne-e2v.com for global sales and operations centres.
Teledyne e2v Semiconductors SAS 2018
page 1
QLS1046A, QLS1026A Product brief
1
INTRODUCTION
The QLS1046A is a cost-effective, power-efficient, and highly integrated system-on-chip (SoC) design that extends the
reach of the TELEDYNE-E2V value-performance line of QorIQ communications processors. Featuring power-efficient
64-bit Arm® Cortex®-A72 cores with ECC-protected L1 and L2 cache memories for high reliability, running up to 1.8
GHz.
The QLS1046A and QLS1026A processors are perfectly suited for a range of embedded applications such as
enterprise routers and switches, linecard controllers, network attached storage, security appliances, virtual customer
premise equipment (vCPE), service providers gateways, and single board computers.
This figure shows the block diagram of the chip.
Figure 1. QLS1046A block diagram
ARM® Cortex®-A72
32-bit/64-bit Core
32 KB
D-Cache
48 KB
I-Cache
Memory
4GB DDR4 with ECC
(72 bits bus)
2 MB L2 - Cache
Secure Boot
Trust Zone
SMMUs
Power Management
IFC, QSPI, SPI
SD/SDIO/eMMC
DMA
2x DUART
4x I2C, GPIO
8x FlexTimer
3x USB3.0 w/PHY
6x LPUART
1G
CCI-400™ Coherency Fabric
Frame manager
Security
Engine
(SEC)
Queue
Mgr.
SATA 3.0
Real-time
debug
Watchpoint
cross
trigger
Perf.
monitor
PCIE 3.0
PCIE 3.0
1G
1G
1/2.5/10G
1/2.5/10G
PCIE 3.0
Parse, classify,
distribute
Buffer
Mgr.
Trace
1G
1/2.5G
DPAA Hardware
4-lane 10GHz SerDes
4-lane 10GHz SerDes
Core Complex
Accelerators and Memory Control
Basic Peripherals, Interconnect, and Debug
Networking Elements
Teledyne e2v Semiconductors SAS 2018
page 2
QLS1046A, QLS1026A Product brief
Figure 2. QLS1026A block diagram
ARM® Cortex®-A72
32-bit/64-bit Core
32 KB
D-Cache
48 KB
I-Cache
Memory
4GB DDR4 with ECC
(72 bits bus)
2 MB L2 - Cache
Secure Boot
Trust Zone
Power Management
IFC, QSPI, SPI
SD/SDIO/eMMC
DMA
2x DUART
4x I2C, GPIO
8x FlexTimer
3x USB3.0 w/PHY
6x LPUART
1G
CCI-400™ Coherency Fabric
SMMUs
Frame manager
Security
Engine
(SEC)
Queue
Mgr.
SATA 3.0
PCIE 3.0
PCIE 3.0
PCIE 3.0
Real-time
debug
Watchpoint
cross
trigger
Perf.
monitor
Parse, classify,
distribute
1G
1G
1/2.5/10G
1/2.5/10G
Trace
Buffer
Mgr.
1G
1/2.5G
DPAA Hardware
4-lane 10GHz SerDes
4-lane 10GHz SerDes
Core Complex
Accelerators and Memory Control
Basic Peripherals, Interconnect, and Debug
Networking Elements
page 3
Teledyne e2v Semiconductors SAS 2018
QLS1046A, QLS1026A Product brief
2
2.1
PIN ASSIGNMENTS
1415 BGA ball layout diagrams
This figure shows the complete view of the QLS1046A BGA ball map diagram.
Figure 4, Figure 5, Figure 6,
and
Figure
7
show quadrant views.
Figure 3. Complete BGA Map for the QLS1046A
Teledyne e2v Semiconductors SAS 2018
page 4
QLS1046A, QLS1026A Product brief
3
3.1
PACKAGE INFORMATION
Package parameters for the FC-PBGA
The package parameters are as provided in the following list. The package type is 23 mm x 23 mm, 780 flip-chip,
plastic-ball, grid array.
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•
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3.2
Package outline - 26 mm x 44 mm
Interconnects - 1415
Ball Pitch - 0.8 mm
Ball Diameter (nominal) - 0.45 mm
Ball Height (nominal) - 0.3 mm
Solder Balls Composition - 96.5% Sn, 3% Ag, and 0.5% Cu – C5 Pb free
Solder Balls Composition
‐
63% Sn, 37% Pb – C5 leaded
Module height 3.67 (typical)
Mechanical dimensions of the FC-PBGA
This figure shows the mechanical dimensions and bottom surface nomenclature of the chip.
Figure 4. Mechanical dimensions of the FC-PBGA
1.
Mechanical dimensions of the FC-PBGA – C5 Pb free
1.
2.
All dimensions are in millimeters.
Dimensions and tolerances per ASME Y14.5M-1994.
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Teledyne e2v Semiconductors SAS 2018
