SURFACE MOUNT LED LAMP
1206 CHIP TYPE
-
Water Clear
PACKAGE DIMENSIONS
0.133 (3.4)
0.117 (3.0)
R0.016 (0.4)
YELLOW
QTLP650C-3.7645
0.071 (1.8)
0.055 (1.4)
FEATURES
• Ultra-miniature
TOP
CATHODE MARK
0.087 (2.2)
0.071 (1.8)
• Extremely low profile
• Industrial standard footprint
• Wide viewing angle of 140°
• Water clear optics
0.051 (1.3)
0.035 (0.9)
• Moisture-proof packaging
0.024 (0.6)
SIDE
0.020 (0.5)
DESCRIPTION
These surface mount lamps are designed to fit
industry standard profile and footprint for ultra-
miniature chip type 1206. The low profile and 140°
viewing angle make this chip type LED ideal for
panel illumination, push-button backlighting and
membrane switch applications.
NOTE:
BOTTOM
Dimensions for all drawings are in inches (mm).
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Lead Soldering Time-Reflow
Continuous Forward Current
Peak Forward Current
(f = 1.0 KHz, Duty Factor = 1/10)
Reverse Voltage (I
R
= 10 µA)
Power Dissipation
(T
A
= 25°C unless otherwise specified)
Symbol
T
OPR
T
STG
T
SOL
I
F
I
F
V
R
P
D
Rating
-40 to +100
-40 to +100
260 for 5 sec
20
160
5
85
Unit
°C
°C
°C
mA
mA
V
mW
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300106A
SURFACE MOUNT LED LAMP
1206 CHIP TYPE
-
Water Clear
YELLOW
QTLP650C-3.7645
ELECTRICAL / OPTICAL CHARACTERISTICS
Part Number
Luminous Intensity (mcd)
Bin 17
Bin 18
Forward Voltage (V)
Maximum
Typical
Dominant Wavelength (nm)
Spectral Line Half Width (nm)
Viewing Angle (°)
(T
A
=25°C)
Condition
I
F
= 20 mA
3.6 - 7.2
6.0 - 12.0
I
F
= 20 mA
2.8
2.0
586 - 589
35
140
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
QTLP650C-3.7645
TYPICAL PERFORMANCE CURVES
90
2.5
RELATIVE LUMNOUS INTENSITY
(NORMALIZED AT 20 mA)
1.0
2.0
3.0
4.0
5.0
80
I
F
- FORWARD CURRENT (mA)
70
60
50
40
30
20
10
0
2.0
1.5
1.0
0.5
0.0
0
5
10
15
20
25
30
V
F
- FORWARD VOLTAGE (V)
I
F
- DC FORWARD CURRENT (mA)
Fig. 1 Forward Current vs. Forward Voltage
Fig. 2 Relative Luminous Intensity vs.
DC Forward Current
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300106A
SURFACE MOUNT LED LAMP
1206 CHIP TYPE
-
Water Clear
YELLOW
QTLP650C-3.7645
1.0
30˚
RELATIVE INTENSITY
40˚
1.0
0.5
0.9
0.8
50˚
60˚
70˚
0.7
80˚
0
500
550
600
650
700
750
0.5
0.3
0.1
0.2
0.4
0.6
90˚
WAVELENGTH (nm)
REL. LUMINOUS INTENSITY (%)
Fig. 3 Relative Intensity vs. Peak Wavelength
Fig. 4 Radiation Diagram
50
I
F
- FORWARD CURRENT (mA)
40
30
20
10
0
0
20
40
60
80
100
T
A
- AMBIENT TEMPERATURE (˚C)
Fig. 5 Current Derating Curve
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300106A
SURFACE MOUNT LED LAMP
1206 CHIP TYPE
-
Water Clear
YELLOW
QTLP650C-3.7645
RECOMMENDED PRINTED CIRCUIT BOARD PATTERN
0.079 (2.0)
0.069 (1.75)
0.069 (1.75)
0.059 (1.5)
RECOMMENDED IR REFLOW SOLDERING PROFILE
5 sec MAX
soldering time
240° C MAX
+5° C/s MAX
-5° C/s MAX
60 - 120 sec
Preheating
120 - 150° C MAX
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SURFACE MOUNT LED LAMP
1206 CHIP TYPE
-
Water Clear
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE
TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT
ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT
DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE
RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical
implant into the body,or (b) support or sustain life,
and (c) whose failure to perform when properly
used in accordance with instructions for use provided
in labeling, can be reasonably expected to result in a
significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
www.fairchildsemi.com
© 2000 Fairchild Semiconductor Corporation
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