R1170x SERIES
800mA LDO REGULATOR
NO.EA-084-0607
OUTLINE
The R1170x Series are positive voltage regulator ICs by CMOS process. The R1170x Series have features of
high ripple rejection, low dropout voltage, high output voltage accuracy, low consumption current. Each of these
ICs consists of a voltage reference unit, an error amplifier, resistor net for setting output voltage, a current limit
circuit at short mode, a chip enable circuit, and thermal-shunt circuit. Output Voltage of R1170 is fixed in the IC.
Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make
low dropout voltage and chip enable function prolong the battery life. These regulators are remarkable
improvement on the current regulators in terms of ripple rejection, input transient response, and load transient
response.
Maximum Output Current is large for its compact size.
Thus, the R1170x Series are suitable for various power sources for portable appliances.
Since the packages for these ICs are the SOT-89-5 package, HSON-6,or HSOP-6J, high density mounting of
the ICs on boards is possible.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Ultra-Low Supply Current............................................. Typ. 80µA
Low Standby Current ................................................... Typ. 0.1µA
Output Current ............................................................. Min. 800mA (V
IN
=V
OUT
+1.0V)
Low Dropout Voltage.................................................... Typ. 0.12V (V
OUT
=3.0V,
I
OUT
=300mA)
High Output Voltage Accuracy .....................................
±2.0%
Low Temperature-drift Coefficient of Output Voltage ... Typ.±100ppm/°C
Line Regulation ............................................................ Typ. 0.05%/V
Output Voltage ............................................................. 1.5V to 5.0V
Small Package ............................................................. SOT-89-5, HSON-6, HSOP-6J
Built-in Current Limit Circuit
Built-in Thermal Shutdown Circuit
APPLICATIONS
•
•
•
•
Local Power source for Notebook PC.
Local Power source for portable appliances, cameras, and videos.
Local Power source for equipment of battery-use.
Local Power source for home appliances.
1
R1170x
BLOCK DIAGRAMS
R1170xxx1A
V
DD
V
OUT
V
DD
R1170Dxxx1B
V
OUT
Vref
Current Limit
Thermal Shutdown
Vref
Current Limit
Thermal Shutdown
CE
GND
CE
GND
SELECTION GUIDE
The output voltage, the chip-enable polarity, the taping type can be selected at the user's request.
The selection can be made with the part number as follows;
R1170xxx1x-xx -x
←Part
Number
↑↑
ab
Code
a
↑ ↑ ↑
c d e
Contents
Package Type;
H: SOT-89-5
D: HSON-6
S: HSOP-6J
Designation of Output Voltage (V
OUT
)
Stepwise setting with 0.1V increment in the range from 1.5V to 5.0V
Designation of option;
A: Built-in Chip Enable Circuit, Active at "L"
B: Built-in Chip Enable Circuit, Active at "H"
Designation of Taping Type;
T1 (SOT-89-5), TR (HSON-6), E2 (HSOP-6J)
(Refer to Taping Specifications)
Designation of composition of pin plating
-F: Lead free plating (SOT-89-5,HSON-6,HSOP-6J)
b
c
d
e
2
R1170x
PIN CONFIGURATION
SOT-89-5
5
4
6
HSON-6
Top View
5
4
HSOP-6J
6
5
4
5
6
Bottom View
4
Φ1.0
1
2
3
3
2
1
R
1
2
3
1
2
3
PIN DESCRIPTION
•
SOT-89-5
Pin No
1
2
3
4
5
Symbol
CE
or CE
Description
Chip Enable Pin
Ground Pin
No Connection
Input Pin
Voltage Regulator Output Pin
GND
NC
V
DD
V
OUT
•
HSON-6
Pin No
1
2
3
4
5
6
Symbol
V
OUT
V
OUT
CE
or CE
Description
Voltage Regulator Output Pin
Voltage Regulator Output Pin
Chip Enable Pin
Ground Pin
Input Pin
Input Pin
GND
V
DD
V
DD
•
∗
Tab in the
parts have GND level. (They are connected to the reverse side of this IC.)
Do not connect to other wires or land patterns.
HSOP-6J
Pin No
1
2
3
4
5
6
Symbol
V
OUT
GND
CE
or CE
Description
Voltage Regulator Output Pin
Ground Pin
Chip Enable Pin
No Connection
Ground Pin
Input Pin
NC
GND
V
DD
3
R1170x
ABSOLUTE MAXIMUM RATINGS
Symbol
V
IN
V
CE
V
OUT
I
OUT
P
D
Topt
Tstg
Input Voltage
Input Voltage (
CE
or CE Input Pin)
Output Voltage
Output Current
Power Dissipation (SOT-89-5)*
1
Power Dissipation (HSON-6)*
1
Power Dissipation (HSOP-6J)*
1
Operating Temperature
Storage Temperature
Item
Rating
7.0
−0.3
to V
IN
+0.3
−0.3
to V
IN
+0.3
1.2
900
900
1700
−40
to 85
−55
to 125
°C
°C
mW
Unit
V
V
V
A
∗1
) For Power Dissipation, please refer to PACKAGE INFORMATION to be described.
4
R1170x
ELECTRICAL CHARACTERISTICS
•
R1170xxxxA
Topt=25°C
Symbol
V
IN
I
SS1
Istandby
V
OUT
I
OUT1
∆V
OUT
/
∆I
OUT
V
DIF
∆V
OUT
/
∆V
IN
Input Voltage
Item
Conditions
V
IN
−V
OUT
=1.0V,
V
CE
=GND
V
IN
=V
CE
=6.0V
V
IN
−V
OUT
=1.0V
I
OUT
=100mA
V
IN
−V
OUT
=1.0V
V
IN
−V
OUT
=1.0V
1mA
<
I
OUT
<
300mA
=
=
I
OUT
=300mA
I
OUT
=100mA
V
OUT
+0.5V
<
V
IN
=
<
=
Min.
Typ.
Max.
6.0
Unit
V
µA
µA
V
mA
Supply Current1
Standby Current
Output voltage
Output Current
Load regulation
Dropout Voltage
Line regulation
80
0.1
×0.98
800
30
160
1.0
×1.02
100
mV
Refer to Dropout Voltage Table
6.0V
0.05
0.30
%/V
RR
Ripple Rejection
f=1kHz, Ripple 0.5Vp−p
1.5V
<
V
IN
<
4.0V:
=
=
V
IN
−V
OUT
=1.0V
4.1V
<
V
IN
<
5.0V:
=
=
V
IN
−V
OUT
=0.75V
I
OUT
=10mA
−40°C
<
Topt
=
V
OUT
=0V
1.25
1.50
0.00
Junction Temperature
Junction Temperature
<
=
50
dB
∆V
OUT
/
∆Topt
I
lim
R
PU
V
CEH
V
CEL
T
TSD
T
TSR
Output Voltage
Temperature Coefficient
Short Current Limit
Pull-up resistancefor
CE
pin
CE
Input Voltage "H"
CE
Input Voltage "L"
85°C
±100
40
2.50
5.00
V
IN
0.25
150
120
ppm/°C
mA
MΩ
V
V
°C
°C
Thermal Shutdown
Detector Threshold Temperature
Thermal Shutdown
Released Temperature
5
RF/无线
