R1171x SERIES
2.0A/1.5A LDO REGULATOR
NO. EA-125-090202
OUTLINE
The R1171x Series are CMOS-based positive voltage regulator ICs. The R1171x Series have features of low
dropout voltage, high output voltage accuracy, low consumption current. Each of these ICs consists of a voltage
reference unit, an error amplifier, resistor net for setting output voltage, a current limit circuit at short mode, a
chip enable circuit, and thermal shutdown circuit. The output voltage of R1171 is fixed in the IC.
Low consumption current by the merit of CMOS process and built-in transistors with low ON-resistance make
low dropout voltage and chip enable function prolongs the battery life. These regulators are remarkable
improvement on the current regulators in terms of input transient response, and load transient response.
Thus, the R1171x Series are suitable for various power sources.
Since the packages for these ICs are high wattage HSOP-6J package, TO-252-5-P1, high density mounting of
the ICs on boards is possible.
FEATURES
•
Supply Current ............................................................. Typ. 130μA
•
Standby Current ........................................................... Typ. 0.1μA
•
Output Current ............................................................. Min. 1.5A (V
IN
=V
OUT
+1.0V,
R1171Sxx1A/B)
Min. 2.0A (V
IN
=V
OUT
+1.0V,
R1171Jxx1C/D)
•
Input Voltage ................................................................ 2.1V to 6.0V
•
Output Voltage ............................................................. 1.5V to 5.0V (R1171Sxx1A/B)
1.8V to 5.0V (R1171Jxx1C/D)
•
Output Voltage Accuracy..............................................
±
2.0%
•
Dropout Voltage ........................................................... Typ. 0.09V (V
OUT
=3.0V,
I
OUT
=300mA)
•
Temperature-drift Coefficient of Output Voltage........... Typ.
±
100ppm/°C
•
Line Regulation ............................................................ Typ. 0.05%/V
•
Packages ..................................................................... HSOP-6J, TO-252-5-P1
•
Built-in Current Limit Circuit
•
Built-in Thermal Shutdown Circuit
•
Ceramic capacitor for phase compensation ................ C
IN
=C
OUT
=Ceramic
10μF (V
OUT
<1.8V)
C
IN
=C
OUT
=Ceramic
4.7μF (V
OUT
>
1.8V)
=
APPLICATIONS
•
•
•
•
Local Power source for Notebook PC.
Local Power source for portable appliances, cameras, and videos.
Local Power source for equipment of battery-use.
Local Power source for home appliances.
1
R1171x
BLOCK DIAGRAMS
R1171xxx1A/C
V
DD
V
OUT
V
DD
R1171xxx1B/D
V
OUT
Vref
Current Limit
Thermal Shutdown
GND
Vref
Current Limit
Thermal Shutdown
GND
CE
GND
CE
GND
SELECTION GUIDE
The output voltage, the chip-enable polarity, the taping type can be selected at the user's request.
The selection can be made with the part number as follows;
R1171xxx1x-xx-x
←Part
Number
↑ ↑
a b
Code
a
↑ ↑ ↑
c d e
Contents
Package Type;
S: HSOP-6J
J: TO-252-5-P1
Designation of Output Voltage (V
OUT
)
Stepwise setting with 0.1V increment in the range from 1.5V to 5.0V (A/B version),
from 1.8V to 5.0V (C/D version).
Exception; 1.85V Type: R1171x181x5, 2.85V type: R1171x281x5-xx
Designation of option;
A: Built-in Chip Enable Circuit, Active at "L" (Output Current :Min.1.5A)
B: Built-in Chip Enable Circuit, Active at "H" (Output Current :Min.1.5A)
C: Built-in Chip Enable Circuit, Active at "L" (Output Current :Min.2.0A)
D: Built-in Chip Enable Circuit, Active at "H" (Output Current :Min.2.0A)
Designation of Taping Type;
E2: HSOP-6J
T1: TO-252-5-P1 (Refer to Taping Specifications)
Designation of composition of pin plating:
-F: Lead free solder plating (HSOP-6J, TO-252-5-P1)
b
c
d
e
2
R1171x
PIN CONFIGURATIONS
HSOP-6J
6
5
4
TO-252-5-P1
R
1
2
3
1
2
3
4
5
PIN DESCRIPTIONS
•
HSOP-6J
Pin No.
1
2
3
4
5
6
Symbol
V
OUT
GND
CE
or CE
•
Description
Output Pin
Ground Pin
Chip Enable Pin
No Connection
Ground Pin
Input Pin
TO-252-5-P1
Pin No.
1
2
3
4
5
Symbol
V
OUT
CE
or CE
Description
Output Pin
Chip Enable Pin
Ground Pin
Ground Pin
Input Pin
GND
GND
V
DD
NC
GND
V
DD
*) No.3 and No.4 pins must be wired short each
other and connected to the GND plane when it is
mounted on board.
3
R1171x
ABSOLUTE MAXIMUM RATINGS
Symbol
V
IN
V
CE
V
OUT
I
OUT
P
D
Topt
Tstg
Input Voltage
Input Voltage (
CE
or CE Input Pin)
Output Voltage
Output Current
Power Dissipation (HSOP-6J)
∗
1
Power Dissipation (TO-252-5-P1)
∗
1
Operating Temperature
Storage Temperature
Item
Rating
7.0
−0.3
to V
IN
+0.3
−0.3
to V
IN
+0.3
3.5
1700
1900
−40
to 85
−55
to 125
°C
°C
Unit
V
V
V
A
mW
∗1)
For Power Dissipation, please refer to PACKAGE INFORMATION to be described.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the
permanent damages and may degrade the life time and safety for both device and system using the device
in the field.
The functional operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the
recommended operating conditions, even if when they are used over such conditions by momentary
electronic noise or surge.
And the semiconductor devices may receive serious damage when they continue to operate over the
recommended operating conditions.
4
R1171x
ELECTRICAL CHARACTERISTICS
•
R1171Sxx1A
Symbol
V
OUT
I
OUT
ΔV
OUT
/
ΔI
OUT
Item
Output Voltage
Output Current
Load Regulation
Conditions
V
IN
−V
OUT
=1.0V,
I
OUT
=200mA
V
IN
−V
OUT
=1.0V
V
IN
−V
OUT
=1.0V
1mA
<
I
OUT
<
300mA
=
=
1.5
1.6
V
DIF
Dropout Voltage
I
OUT
=300mA
1.7
1.8
2.0
2.5
I
SS
I
standby
ΔV
OUT
/ΔV
IN
RR
V
IN
ΔV
OUT
/
ΔT
opt
I
lim
R
PU
V
CEH
V
CEL
T
TSD
T
TSR
Supply Current
Standby Current
Line Regulation
Ripple Rejection
Input Voltage
Output Voltage
Temperature Coefficient
Short Current Limit
Pull-up resistance for
CE
pin
CE
Input Voltage "H"
CE
Input Voltage "L"
Thermal Shutdown
Junction Temperature
Detector Threshold Temperature
Thermal Shutdown
Junction Temperature
Released Temperature
<
=
<
=
<
=
<
=
<
=
<
=
Topt=25°C
Min.
×0.98
1.5
Typ.
Max.
×1.02
Unit
V
A
10
0.16
0.14
0.13
0.12
0.10
0.09
130
0.1
60
0.35
0.32
0.28
0.24
0.21
0.18
320
2.0
mV
V
OUT
<1.6
V
OUT
<1.7
V
OUT
<1.8
V
OUT
<2.0
V
OUT
<2.5
V
OUT
<
=
V
5.0
V
IN
−V
OUT
=1.0V,
V
CE
=0V
V
IN
−V
OUT
=1.0V,
V
IN
=V
CE
I
OUT
=200mA
f=1kHz, Ripple 0.5Vp-p
I
OUT
=10mA
−40°C
<
T
opt
=
V
OUT
=0V
2.5
1.2
0
μA
μA
Refer to the following table
2.1
6.0
±100
200
5.0
10.0
V
IN
0.25
150
120
V
ppm/°C
mA
MΩ
V
V
°C
°C
Topt=25°C
<
=
85°C
•
Line Regulation by Output Voltage
Output Voltage
V
OUT
(V)
1.5
1.6
<
=
<
=
Line Regulation
ΔV
OUT
/ΔV
IN
(%/V)
Condition
I
OUT
=200mA,
2.1V
<
=
Typ.
<
=
<
=
Max.
0.30
V
OUT
< 1.6
V
OUT
<
=
V
IN
6.0V
V
IN
<
=
5.0
I
OUT
=200mA,
V
OUT
+0.5V
0.05
6.0V
•
Ripple Rejection by Output Voltage
Output Voltage
V
OUT
(V)
1.5
4.7
<
=
<
=
Topt=25°C
Ripple Rejection RR (dB)
Condition
f=1kHz, Ripple 0.5Vp-p, V
IN
−V
OUT
=1.0V
f=1kHz, Ripple 0.5Vp-p, V
IN
=5.75V
Typ.
50
V
OUT
< 4.7
V
OUT
<
=
5.0
5
