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R5F21336TNFP

The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)

器件类别：嵌入式处理器和控制器    微控制器和处理器   

厂商名称：Renesas(瑞萨电子)

厂商官网：https://www.renesas.com/

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参数 预览 参数对比
器件参数
参数名称
属性值
厂商名称
Renesas(瑞萨电子)
零件包装代码
QFP
包装说明
7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32
针数
32
Reach Compliance Code
compli
具有ADC
YES
其他特性
ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ
地址总线宽度
位大小
8
最大时钟频率
20 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
S-PQFP-G32
长度
7 mm
I/O 线路数量
28
端子数量
32
最高工作温度
85 °C
最低工作温度
-20 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LQFP
封装等效代码
QFP32,.35SQ,32
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE
电源
2/5 V
认证状态
Not Qualified
RAM（字节）
2560
ROM（单词）
32768
ROM可编程性
FLASH
座面最大高度
1.7 mm
速度
20 MHz
最大压摆率
15 mA
最大供电电压
5.5 V
最小供电电压
2.7 V
标称供电电压
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子形式
GULL WING
端子节距
0.8 mm
端子位置
QUAD
宽度
7 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
R8C/33T Group
RENESAS MCU
R01DS0046EJ0110
Rev.1.10
Apr 26, 2011
1.
1.1
Overview
Features
The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions
for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high
speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are
designed to maximize EMI/EMS performance.
Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of
system components.
The R8C/33T Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.
1.1.1
Applications
Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.
R01DS0046EJ0110 Rev.1.10
Apr 26, 2011
Page 1 of 47
R8C/33T Group
1. Overview
1.1.2
Specifications
Tables 1.1 and 1.2 outline the Specifications for R8C/33T Group.
Table 1.1
Item
CPU
Specifications for R8C/33T Group (1)
Function
Central processing
unit
Specification
R8C CPU core
• Number of fundamental instructions: 89
• Minimum instruction execution time:
50 ns (f(XIN) = 20 MHz, VCC = 2.7 V to 5.5 V)
200 ns (f(XIN) = 5 MHz, VCC = 1.8 V to 5.5 V)
• Multiplier: 16 bits × 16 bits
→
32 bits
• Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits
→
32 bits
• Operation mode: Single-chip mode (address space: 1 Mbyte)
Refer to
Table 1.3 Product List for R8C/33T Group.
• Power-on reset
• Voltage detection 3 (detection level of voltage detection 0 and voltage
detection 1 selectable)
• Input-only: 1 pin
• CMOS I/O ports: 27, selectable pull-up resistor
• High current drive ports: 27
• 3 circuits: XIN clock oscillation circuit,
High-speed on-chip oscillator (with frequency adjustment function),
Low-speed on-chip oscillator
• Oscillation stop detection: XIN clock oscillation stop detection function
• Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16
• Low power consumption modes:
Standard operating mode (high-speed clock, high-speed on-chip oscillator,
low-speed on-chip oscillator), wait mode, stop mode
• Number of interrupt vectors: 69
• External Interrupt: 7 (INT × 4, Key input × 4)
• Priority levels: 7 levels
• 14 bits × 1 (with prescaler)
• Reset start selectable
• Low-speed on-chip oscillator for watchdog timer selectable
• 1 channel
• Activation sources: 22
• Transfer modes: 2 (normal mode, repeat mode)
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), pulse output mode (output level inverted every
period), event counter mode, pulse width measurement mode, pulse period
measurement mode
8 bits × 1 (with 8-bit prescaler)
Timer mode (period timer), programmable waveform generation mode (PWM
output), programmable one-shot generation mode, programmable wait one-
shot generation mode
16 bits × 1 (with 4 capture/compare registers)
Timer mode (input capture function, output compare function), PWM mode
(output 3 pins), PWM2 mode (PWM output pin)
ROM, RAM,
Data flash
Power Supply Voltage detection
Voltage
circuit
Detection
I/O Ports
Programmable I/O
ports
Clock
Clock generation
circuits
Memory
Interrupts
Watchdog Timer
DTC (Data Transfer Controller)
Timer
Timer RA
Timer RB
Timer RC
R01DS0046EJ0110 Rev.1.10
Apr 26, 2011
Page 2 of 47
R8C/33T Group
1. Overview
Table 1.2
Item
Serial
Interface
LIN Module
A/D Converter
Specifications for R8C/33T Group (2)
Function
UART0
UART2
Specification
Clock synchronous serial I/O/UART
Clock synchronous serial I/O/UART, I
2
C mode (I
2
C-bus), SSU mode,
multiprocessor communication function
Hardware LIN: 1 (timer RA, UART0)
10-bit resolution × 12 channels, includes sample and hold function, with sweep
mode
System CH × 3, electrostatic capacitive touch detection × 18
• Programming and erasure voltage: VCC = 2.7 V to 5.5 V
• Programming and erasure endurance: 10,000 times (data flash)
1,000 times (program ROM)
• Program security: ROM code protect, ID code check
• Debug functions: On-chip debug, on-board flash rewrite function
• Background operation (BGO) function
f(XIN) = 20 MHz (VCC = 2.7 V to 5.5 V)
f(XIN) = 5 MHz (VCC = 1.8 V to 5.5 V)
Typ. 6.5 mA (VCC = 5.0 V, f(XIN) = 20 MHz)
Typ. 3.5 mA (VCC = 3.0 V, f(XIN) = 10 MHz)
Typ. 3.5
µA
(VCC = 3.0 V, wait mode)
Typ. 2.0
µA
(VCC = 3.0 V, stop mode)
−20
to 85°C (N version)
32-pin LQFP
Package code: PLQP0032GB-A (previous code: 32P6U-A)
Sensor Control Unit
Flash Memory
Operating Frequency/Supply
Voltage
Current Consumption
Operating Ambient Temperature
Package
R01DS0046EJ0110 Rev.1.10
Apr 26, 2011
Page 3 of 47
R8C/33T Group
1. Overview
1.2
Product List
Table 1.3 lists Product List for R8C/33T Group. Figure 1.1 shows a Part Number, Memory Size, and Package of
R8C/33T Group.
Table 1.3
Product List for R8C/33T Group
ROM Capacity
Program ROM
Data flash
16 Kbytes
1 Kbyte × 4
24 Kbytes
1 Kbyte × 4
32 Kbytes
1 Kbyte × 4
16 Kbytes
1 Kbyte × 4
24 Kbytes
1 Kbyte × 4
32 Kbytes
1 Kbyte × 4
RAM
Capacity
1.5 Kbytes
2 Kbytes
2.5 Kbytes
1.5 Kbytes
2 Kbytes
2.5 Kbytes
Current of Apr 2011
Package Type
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
PLQP0032GB-A
Remarks
N version
Part No.
R5F21334TNFP
R5F21335TNFP
R5F21336TNFP
R5F21334TNXXXFP
R5F21335TNXXXFP
R5F21336TNXXXFP
N version
Factory-
programming
product
(1)
Note:
1. The user ROM is programmed before shipment.
Part No. R 5 F 21 33 6 T N XXX FP
Package type:
FP: PLQP0032GB-A (0.8 mm pin-pitch, 7 mm square body)
ROM number
Classification
N: Operating ambient temperature
−20°C
to 85°C
ROM capacity
4: 16 KB
5: 24 KB
6: 32 KB
R8C/33T Group
R8C/3x Series
Memory type
F: Flash memory
Renesas MCU
Renesas semiconductor
Figure 1.1
Part Number, Memory Size, and Package of R8C/33T Group
R01DS0046EJ0110 Rev.1.10
Apr 26, 2011
Page 4 of 47
R8C/33T Group
1. Overview
1.3
Block Diagram
Figure 1.2 shows a Block Diagram.
8
8
3
5
3
1
I/O ports
Peripheral functions
Timers
Timer RA (8 bits
×
1)
Timer RB (8 bits
×
1)
Timer RC (16 bits
×
1)
Port P0
Port P1
Port P2
Port P3
Port P4
UART or
clock synchronous serial I/O
(8 bits
×
2)
LIN module
System clock generation
circuit
XIN-XOUT
High-speed on-chip oscillator
Low-speed on-chip oscillator
Sensor Control Unit
Watchdog timer
(14 bits)
Low-speed on-chip oscillator
for watchdog timer
A/D converter
(10 bits
×
12 channels)
Voltage detection circuit
DTC
R8C CPU core
R0H
R1H
R2
R3
A0
A1
FB
R0L
R1L
SB
USP
ISP
INTB
PC
FLG
Memory
ROM
(1)
RAM
(2)
Multiplier
Notes:
1. ROM size varies with MCU type.
2. RAM size varies with MCU type.
Figure 1.2
Block Diagram
R01DS0046EJ0110 Rev.1.10
Apr 26, 2011
Page 5 of 47
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参数对比
与R5F21336TNFP相近的元器件有：R5F21334TNFP、R5F21334TNXXXFP、R5F21335TNXXXFP、R5F21336TNXXXFP、R5F21335TNFP、R5F21334TNFP_11。描述及对比如下：
型号 R5F21336TNFP R5F21334TNFP R5F21334TNXXXFP R5F21335TNXXXFP R5F21336TNXXXFP R5F21335TNFP R5F21334TNFP_11
描述 The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO) The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO) The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO) The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO) The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO) The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO) The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) -
零件包装代码 QFP QFP QFP QFP QFP QFP -
包装说明 7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32 LQFP, QFP32,.35SQ,32 LQFP, QFP32,.35SQ,32 LQFP, QFP32,.35SQ,32 LQFP, QFP32,.35SQ,32 LQFP, QFP32,.35SQ,32 -
针数 32 32 32 32 32 32 -
Reach Compliance Code compli compli compli compli compli compli -
具有ADC YES YES YES YES YES YES -
其他特性 ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ -
位大小 8 8 8 8 8 8 -
最大时钟频率 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
DAC 通道 NO NO NO NO NO NO -
DMA 通道 NO NO NO NO NO NO -
JESD-30 代码 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 S-PQFP-G32 -
长度 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm -
I/O 线路数量 28 28 28 28 28 28 -
端子数量 32 32 32 32 32 32 -
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
最低工作温度 -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -
PWM 通道 YES YES YES YES YES YES -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 LQFP LQFP LQFP LQFP LQFP LQFP -
封装等效代码 QFP32,.35SQ,32 QFP32,.35SQ,32 QFP32,.35SQ,32 QFP32,.35SQ,32 QFP32,.35SQ,32 QFP32,.35SQ,32 -
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE -
封装形式 FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE -
电源 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V 2/5 V -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
RAM（字节） 2560 1536 1536 2048 2560 2048 -
ROM（单词） 32768 16384 16384 24576 32768 24576 -
ROM可编程性 FLASH FLASH FLASH FLASH FLASH FLASH -
座面最大高度 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm 1.7 mm -
速度 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz -
最大压摆率 15 mA 15 mA 15 mA 15 mA 15 mA 15 mA -
最大供电电压 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
最小供电电压 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V -
标称供电电压 3 V 3 V 3 V 3 V 3 V 3 V -
表面贴装 YES YES YES YES YES YES -
技术 CMOS CMOS CMOS CMOS CMOS CMOS -
温度等级 OTHER OTHER OTHER OTHER OTHER OTHER -
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING -
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm -
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD -
宽度 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm -
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器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
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