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R5F56106VNFP#V0

32位微控制器 - MCU RX610 1M/128K QFP144 3.0-3.6V

器件类别：嵌入式处理器和控制器    微控制器和处理器   

厂商名称：Renesas(瑞萨电子)

厂商官网：https://www.renesas.com/

器件标准：

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参数 预览 参数对比
器件参数
参数名称
属性值
Brand Name
Renesas
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Renesas(瑞萨电子)
零件包装代码
LFQFP
包装说明
LFQFP, QFP144,.87SQ,20
针数
144
制造商包装代码
PLQP0144KA-A144
Reach Compliance Code
compliant
Factory Lead Time
20 weeks
Samacsys Description
Renesas Electronics R5F56106VNFP#V0, 32bit RX Microcontroller, 100MHz, 1 MB, 32 kB Flash, ROM, 144-Pin LQFP
具有ADC
YES
地址总线宽度
24
位大小
32
CPU系列
RX
最大时钟频率
25 MHz
DAC 通道
YES
DMA 通道
YES
外部数据总线宽度
16
JESD-30 代码
S-PQFP-G144
长度
20 mm
I/O 线路数量
117
端子数量
144
最高工作温度
85 °C
最低工作温度
-40 °C
PWM 通道
YES
封装主体材料
PLASTIC/EPOXY
封装代码
LFQFP
封装等效代码
QFP144,.87SQ,20
封装形状
SQUARE
封装形式
FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）
NOT SPECIFIED
电源
3.3 V
认证状态
Not Qualified
RAM（字节）
131072
ROM（单词）
1048576
ROM可编程性
FLASH
座面最大高度
1.7 mm
速度
100 MHz
最大压摆率
100 mA
最大供电电压
3.6 V
最小供电电压
3 V
标称供电电压
3.3 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
0.5 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
20 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
文档预览
Datasheet
RX610 Group Datasheet
RENESAS 32-Bit MCU
R01DS0097EJ0120
Rev.1.20
Feb 20, 2013
1.
1.1
Overview
Features
The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
One basic instruction is executable in one cycle of the system clock. Calculation functionality is further enhanced, with
the inclusion of a single-precision floating-point calculation unit as well as a 32-bit multiplier and divider. Additionally,
code efficiency is improved by instructions with lengths that are variable in byte units and by an enhanced range of
addressing modes.
Timers, serial communication interfaces, I
2
C bus interfaces, an A/D converter, and a D/A converter are incorporated as
peripheral functions which are essential to embedded devices.
Facilities for connecting external memory are also included, enabling direct connection to memory and peripheral LSI
circuits. The on-chip memory is flash memory capable of large-capacity, high-speed operation, and this significantly
reduces the cost of configuring systems.
1.1.1
Applications
Office automation equipment and digital industrial equipment
R01DS0097EJ0120
Feb 20, 2013
Rev.1.20
Page 1 of 84
RX610 Group
1. Overview
1.1.2
Outline of Specifications
Table 1.1 lists the specifications of the RX610 Group in outline.
Table 1.1
CPU
Outline of Specifications
Module/Function
CPU
Description
•
Maximum operating frequency: 100 MHz
•
32-bit RX CPU
•
Minimum instruction execution time: One instruction in one state (in one system clock
Classification
cycle)
•
Address space: 4-Gbyte linear address
•
Register set of the CPU
General purpose: Sixteen 32-bit registers
Control: Nine 32-bit registers
Accumulator: One 64-bit register
•
Basic instructions: 73
•
Floating-point operation instructions: 8
•
DSP instructions: 9
•
Addressing modes: 10
•
Data arrangement
Instructions: Little endian
Data: Selectable as little endian or big endian
•
On-chip 32-bit multiplier: 32 x 32
→
64 bits
•
On-chip divider: 32 / 32
→
32 bits
•
Barrel shifter: 32 bits
FPU
Memory
Flash
•
Single precision (32-bit) floating point
•
Data types and floating-point exceptions conforming to the IEEE754 standard
•
Flash capacity: 2 Mbytes (max.)
•
Three types of on-board programming modes
SCI boot mode, user program mode, and user boot mode
RAM
Data flash
MCU operating modes
Clock
Clock generation circuit
RAM capacity: 128 Kbytes
Data flash capacity: 32 Kbytes
Single-chip mode, on-chip ROM enabled extended mode, and on-chip ROM disabled
extended mode
•
One main clock oscillation circuit
•
Includes a PLL circuit and frequency divider, so the operating frequency is selectable
•
System clock, peripheral module clock, and external bus clock are independently
specifiable.
The CPU, DMAC, DTC, ROM, and RAM run in synchronization with the system
clock (ICLK): 8 to 100 MHz
Peripheral modules run in synchronization with the peripheral module
clock (PCLK): 8 to 50 MHz
Devices connected to the external bus run in synchronization with the external bus
clock (BCLK): 8 to 25 MHz
Power down
Power-down function
•
Module stop function
•
Four power-down modes
Sleep mode, all-module clock stop mode, software standby mode, and deep software
standby mode
R01DS0097EJ0120
Feb 20, 2013
Rev.1.20
Page 2 of 84
RX610 Group
Classification
Interrupt
Module/Function
Interrupt control unit
Description
•
Peripheral function interrupts: 116
•
External interrupts: 16 (pins IRQ15 to IRQ0)
•
Non-maskable interrupt: 1 (the NMI pin)
•
Eight priority orders specifiable
1. Overview
External bus extension
•
The external address space can be divided into eight areas (CS0 to CS7), each of
which is independently controllable.
Capacity of each area: 16 Mbytes
Chip-select signals (CS0# to CS7#) can be output for each area.
8-bit or 16-bit bus space can be specified for each area.
The data arrangement is selectable as little endian or big endian for each area. (only
for data)
•
Separate bus system
•
Wait control
•
Write buffer programming
DMA
DMA controller
•
4-channel DMA transfer available
•
Activation sources: Software trigger, external interrupts, and interrupt requests from
peripheral functions
Data transfer controller
I/O ports
Programmable I/O ports
•
Three transfer modes: Normal transfer, repeat transfer, and block transfer
•
Activated by interrupt requests (chain transfer enabled)
•
I/O pins: 117 (144-pin LQFP), 140 (176-pin LFBGA)
•
Pull-up resistors: 40
•
Open-drain outputs: 16
•
5-V tolerance: 10
Timer
16-bit timer pulse unit
•
(16 bits x 6 channels) x 2 units
•
Up to 16 pulse inputs and outputs
•
Select from among 7 or 8 counter-input clocks for each channel
•
Input capture/output compare function
•
Maximum of 15-phase PWM output possible in PWM mode
•
Buffered operation, phase counting mode (two-phase encoder input), and cascaded
operation (32 bits x 2 channels) settable for each channel
•
PPG output trigger can be generated
•
Conversion start trigger for the A/D converter can be generated
Programmable pulse
generator
8-bit timer
•
(4 bits x 4 groups) x 2 units
•
Provides pulse outputs by using the TPU output as a trigger
•
Maximum of 32-bit pulse output possible
•
(8 bits x 2 channels) x 2 units
•
Select from among 8 clock sources (7 internal clocks and 1 external clock)
•
Allows the output of pulse trains with a desired duty cycle or PWM signals
•
Cascading of 2 channels enables it to be used as a 16-bit timer
•
Generation of trigger to start A/D converter conversion
•
Capable of generating baud rate clock for SCI5 and SCI6
Compare match timer
•
(16 bits x 2 channels) x 2 units
•
Select from among 4 counter-input clocks
R01DS0097EJ0120
Feb 20, 2013
Rev.1.20
Page 3 of 84
RX610 Group
Watchdog timer
•
8 bits x 1 channel
•
Select from among 8 counter-input clocks
•
Switchable between watchdog timer mode and interval timer mode
1. Overview
Communication
function
Serial communication
interface
•
7 channels
•
Serial communication mode:
Asynchronous, clock synchronous, and smart card interface
•
On-chip baud rate generator allows any bit rate to be selected
•
Choice of LSB-first or MSB-first transfer
•
Enables average transfer rate clock input from TMR (SCI5, SCI6)
I
2
C bus interface
•
2 channels
•
Communication format
I
2
C bus format/SMBus format
Master/slave selectable (For multi-master operation)
•
Maximum transfer rate: 1 Mbps
A/D converter
•
4 units (1 unit x 4 channels)
•
10-bit resolution
•
Conversion time: 1.0
µs
per channel (at 50-MHz (PCLK) operation)
•
Two kinds of operating modes
Single mode and scan mode (single scan mode or continuous scan mode)
•
Sample-and-hold function
•
Three types of A/D conversion start
Conversion can be started by software, a conversion start trigger by the timer (TPU or
TMR), or an external trigger signal.
D/A converter
•
2 channels
•
10-bit resolution
•
Output voltage: 0 V to VREFH
CRC calculator
•
CRC code generation for arbitrary data lengths in 8-bit units
•
One of three generating polynomials selectable
X
8
+ X
2
+ X + 1, X
16
+ X
15
+ X
2
+ 1, X
16
+ X
12
+ X
5
+ 1
•
CRC code generation for LSB-first or MSB-first communication selectable
Operating frequency
Power supply voltage
Supply current
Operating temperature
Package
8 to 100 MHz
V
CC
= PLLV
CC
= AV
CC
= 3.0 to 3.6V, VREFH = 3.0 to AV
CC
50 mA (typ.) (regular specifications)
−20
to +85°C (regular specifications),
−40
to +85°C (wide-range specifications)
176-pin LFBGA (PLBG0176GA-A)
144-pin LQFP (PLQP0144KA-A)
R01DS0097EJ0120
Feb 20, 2013
Rev.1.20
Page 4 of 84
RX610 Group
1. Overview
1.2
List of Products
Table 1.2 is the list of products, and figure 1.1 shows how to read the product part no.
Table 1.2
Part No.
List of Products
Operating
Package
PLQP0144KA-A
PLQP0144KA-A
PLBG0176GA-A
PLBG0176GA-A
PLQP0144KA-A
PLQP0144KA-A
PLBG0176GA-A
PLBG0176GA-A
PLQP0144KA-A
PLQP0144KA-A
PLBG0176GA-A
PLBG0176GA-A
PLQP0144KA-A
PLQP0144KA-A
PLBG0176GA-A
PLBG0176GA-A
ROM Capacity
2 Mbytes
2 Mbytes
2 Mbytes
2 Mbytes
1.5 Mbytes
1.5 Mbytes
1.5 Mbytes
1.5 Mbytes
1 Mbyte
1 Mbyte
1 Mbyte
1 Mbyte
768 Kbytes
768 Kbytes
768 Kbytes
768 Kbytes
RAM Capacity
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
128 Kbytes
Data Flash
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
32 Kbytes
Frequency (Max.)
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
100 MHz
R5F56108VNFP
R5F56108VDFP
R5F56108WNBG
R5F56108WDBG
R5F56107VNFP
R5F56107VDFP
R5F56107WNBG
R5F56107WDBG
R5F56106VNFP
R5F56106VDFP
R5F56106WNBG
R5F56106WDBG
R5F56104VNFP
R5F56104VDFP
R5F56104WNBG
R5F56104WDBG
R01DS0097EJ0120
Feb 20, 2013
Rev.1.20
Page 5 of 84
查看更多>
参数对比
与R5F56106VNFP#V0相近的元器件有：R5F56107WDBG#U0、R5F56104WNBG#U0、R5F56108VDFP#V0、R5F56104VNFP#V0、R5F56104WDBG#U0、R5F56104VDFP#V0、R5F56108WNBG#U0、R5F56108WDBG#U0、R5F56106WNBG#U0。描述及对比如下：
型号 R5F56106VNFP#V0 R5F56107WDBG#U0 R5F56104WNBG#U0 R5F56108VDFP#V0 R5F56104VNFP#V0 R5F56104WDBG#U0 R5F56104VDFP#V0 R5F56108WNBG#U0 R5F56108WDBG#U0 R5F56106WNBG#U0
描述 32位微控制器 - MCU RX610 1M/128K QFP144 3.0-3.6V 32位微控制器 - MCU RX610 1.5M/128K BGA176 3.0-3.6V 32位微控制器 - MCU RX610 768K/128K BGA176 3.0-3.6V 32位微控制器 - MCU RX610 2M/128K QFP144 3.0-3.6V 32位微控制器 - MCU RX610 MCU 768K/128K QFP144 3.0-3.6V 32位微控制器 - MCU RX610 768K/128K BGA176 3.0-3.6V 32位微控制器 - MCU RX610 768K/128K QFP144 3.0-3.6V 32位微控制器 - MCU RX610 2M/128K BGA176 3.0-3.6V 32位微控制器 - MCU RX610 2M/128K BGA176 3.0-3.6V 32位微控制器 - MCU RX610 1M/128K BGA176 3.0-3.6V
Brand Name Renesas Renesas Renesas Renesas Renesas Renesas Renesas Renesas Renesas Renesas
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合 符合 符合 符合
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 LFQFP LFBGA LFBGA LFQFP LFQFP LFBGA LFQFP LFBGA LFBGA LFBGA
包装说明 LFQFP, QFP144,.87SQ,20 LFBGA, BGA176,15X15,32 LFBGA, BGA176,15X15,32 LFQFP, QFP144,.87SQ,20 LFQFP, QFP144,.87SQ,20 LFBGA, BGA176,15X15,32 LFQFP, QFP144,.87SQ,20 LFBGA, BGA176,15X15,32 LFBGA, BGA176,15X15,32 LFBGA, BGA176,15X15,32
针数 144 176 176 144 144 176 144 176 176 176
制造商包装代码 PLQP0144KA-A144 PLBG0176GA-A176 PLBG0176GA-A176 PLQP0144KA-A144 PLQP0144KA-A144 PLBG0176GA-A176 PLQP0144KA-A144 PLBG0176GA-A176 PLBG0176GA-A176 PLBG0176GA-A176
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
Factory Lead Time 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks 20 weeks
具有ADC YES YES YES YES YES YES YES YES YES YES
地址总线宽度 24 24 24 24 24 24 24 24 24 24
位大小 32 32 32 32 32 32 32 32 32 32
最大时钟频率 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
DAC 通道 YES YES YES YES YES YES YES YES YES YES
DMA 通道 YES YES YES YES YES YES YES YES YES YES
外部数据总线宽度 16 16 16 16 16 16 16 16 16 16
JESD-30 代码 S-PQFP-G144 S-PBGA-B176 S-PBGA-B176 S-PQFP-G144 S-PQFP-G144 S-PBGA-B176 S-PQFP-G144 S-PBGA-B176 S-PBGA-B176 S-PBGA-B176
长度 20 mm 13 mm 13 mm 20 mm 20 mm 13 mm 20 mm 13 mm 13 mm 13 mm
I/O 线路数量 117 140 140 117 117 140 117 140 140 140
端子数量 144 176 176 144 144 176 144 176 176 176
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -20 °C -40 °C -20 °C -40 °C -20 °C -20 °C -40 °C -20 °C -40 °C
PWM 通道 YES YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFBGA LFBGA LFQFP LFQFP LFBGA LFQFP LFBGA LFBGA LFBGA
封装等效代码 QFP144,.87SQ,20 BGA176,15X15,32 BGA176,15X15,32 QFP144,.87SQ,20 QFP144,.87SQ,20 BGA176,15X15,32 QFP144,.87SQ,20 BGA176,15X15,32 BGA176,15X15,32 BGA176,15X15,32
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度） NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM（字节） 131072 131072 131072 131072 131072 131072 131072 131072 131072 131072
ROM（单词） 1048576 1572864 786432 2097152 786432 786432 786432 2097152 2097152 1048576
ROM可编程性 FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
座面最大高度 1.7 mm 1.4 mm 1.4 mm 1.7 mm 1.7 mm 1.4 mm 1.7 mm 1.4 mm 1.4 mm 1.4 mm
速度 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz 100 MHz
最大压摆率 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL OTHER INDUSTRIAL OTHER INDUSTRIAL OTHER OTHER INDUSTRIAL OTHER INDUSTRIAL
端子形式 GULL WING BALL BALL GULL WING GULL WING BALL GULL WING BALL BALL BALL
端子节距 0.5 mm 0.8 mm 0.8 mm 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 QUAD BOTTOM BOTTOM QUAD QUAD BOTTOM QUAD BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 20 mm 13 mm 13 mm 20 mm 20 mm 13 mm 20 mm 13 mm 13 mm 13 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
CPU系列 RX RX RX RX - RX RX RX RX RX
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器件捷径:
L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ
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