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RBP12BTS2773

Fixed Resistor, Thin Film, 0.5W, 277000ohm, 150V, 0.1% +/-Tol, 50ppm/Cel, Surface Mount, 1206, CHIP, LEAD FREE

器件类别:无源元件    电阻器   

厂商名称:TA-I Technology Co Ltd

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
Objectid
1682367802
包装说明
CHIP, LEAD FREE
Reach Compliance Code
compliant
ECCN代码
EAR99
构造
Chip
JESD-609代码
e3
制造商序列号
RBP
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.55 mm
封装长度
3.1 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
1.55 mm
包装方法
TR, PAPER, 7 INCH
额定功率耗散 (P)
0.5 W
额定温度
70 °C
电阻
277000 Ω
电阻器类型
FIXED RESISTOR
系列
RBP12(BC TOL)
尺寸代码
1206
表面贴装
YES
技术
THIN FILM
温度系数
50 ppm/°C
端子面层
Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
0.1%
工作电压
150 V
文档预览
Document No
TRBP-XXOS002D
2011/3/14
1/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
1. Scope :
This specification applies for the RBP series of metal thin film chip resistors made by TA-I.
2. Construction:
Over Coat
Sn Plating
Ni Plating
Resistive Element
Inner electrode
Ceramic Substrate
3. Type Designation:
RBP
Product Code
RBP : Metal Thin Film
10
Size
Power Rating
B
Tolerance
T
Packaging
P
TCR
1001
Nominal
Resistance
06-0603(1608) 1/8W
10-0805(2012) 1/4W
12-1206(3216) 1/2W
13-1210(3226) 1/2W
20-2010(2025) 1W
25-2512(6432) 2W
B- ±0.10%
C- ±0.25%
D- ±0.50%
F- ±1.00%
G-±2.00%
J- ±5.00%
T- Paper
Tape
B- Bulk
Cassette
J-
±5
ppm
k-
±10
ppm
M-
±15
ppm
P-
±25
ppm
S-
±50
ppm
T-
±100
ppm
e.g.,
1001=1kΩ
TA-I TECHNOLOGY CO., LTD
Document No
TRBP-XXOS002D
2011/3/14
2/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
4. Dimensions:
1001
UNIT: mm
Type
RBP06
RBP10
RBP12
RBP13
RBP20
RBP25
L
1.60
±0.10
2.00
±0.10
3.10
±0.10
3.10
±0.10
5.10
±0.15
6.30
±0.20
W
0.80
±0.10
1.25
±0.10
1.55
±0.10
2.55
±0.10
2.50
±0.15
3.20
±0.20
C
0.30
±0.20
0.40
±0.20
0.50
±0.30
0.50
±0.30
0.60
±0.30
0.60
±0.30
0.40
d
t
0.20
0.10
0.45
±0.10
0.50
±0.10
0.55
±0.10
0.60
±0.10
0.60
±0.10
0.60
±0.10
0.45
±0.20
0.5
±0.20
0.5
±0.20
1.4
±0.25
1.85
±0.25
TA-I TECHNOLOGY CO., LTD
Document No
TRBP-XXOS002D
2011/3/14
3/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
5. Ratings & Characteristics
Type
Power
Rating
at 70℃
Rated
Voltage
Max.
Working
Voltage
Max.
Over- Load
Voltage
T.C.R
(PPM/℃)
Resistance Range
Resistance
tolerance(%)
RBP06
1/8 W
Refer 5.2
75V
150V
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
±50
±100
±10
±25
±50
±100
1Ω~9.1Ω
±0.5~5
RBP06
1/8W
Refer 5.2
75V
150V
10Ω~390KΩ
± 0.1 ~ ±5
RBP10
1/4 W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP10
1/4 W
Refer 5.2
150V
300V
10Ω~800KΩ
± 0.1 ~ ±5
RBP12
1/2 W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP12
1/2 W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
RBP13
1/2 W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP13
1/2 W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
RBP20
1W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP20
1W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
RBP25
2W
Refer 5.2
150V
300V
1Ω~9.1Ω
±0.5~5
RBP25
2W
Refer 5.2
150V
300V
10Ω~1MΩ
± 0.1 ~ ±5
Operating Temp(℃): -55℃ ~ +155℃
Note : Except for the above standardized products, we also provide the
customized products.
TA-I TECHNOLOGY CO., LTD
Document No
TRBP-XXOS002D
2011/3/14
4/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
5.1 Derating Curve :
For resistors operated at ambient temperature over 70℃ , power rating shall be derated
according to figure 1.
100
P max.
Power ratio ( % )
50
0
-55
50
70
100
155
Ambient
Figure 1
Temp. (
C
)
5.2 Rated Voltage:
The rated voltage is calculated by the following formula:
E= P * R
E=
Rated Voltage(V)
P=
Rated Power(W)
R=
Resistance Value
TA-I TECHNOLOGY CO., LTD
Document No
TRBP-XXOS002D
2011/3/14
5/15
Metal Thin Film Chip Resistors
( RBP series Standard )
Issued date
page
6. Reliability Tests:( As specified in JIS C 5201-1 or IEC60115-1)
Reference
standard
Temperature Coefficient of IEC60115-1-4.8
Resistance
JIS C5201-1-4.8
IEC60115-1-4.19
Rapid Change of Temp.
JIS C 5201-1-4.19
IEC60115-1-4.13
Short Time Overload
JIS C5201-1-4.13
Test Items
Resistance to Dry Heat
Load Life
Resistance to Solder Heat
Bending
Condition of Test
+25 ~ +125
Test Limits
Refer 5.0
-55℃(30 min. ) / +155℃(30 min. ),
±(0.5%+0.05Ω)
300 cycles
2.5 X rated voltage for 5sec
±(0.5%
+ 0.05Ω)
±(0.5%
+0.05Ω)
IEC60115-1-4.23.2
155±5℃ for 96±4Hrs
JIS C5201-1-4.23.2
IEC60115-1-4.25.1 1000 hours at rated power , 70℃ ,
±(0.5%
+0.05Ω)
JIS C5201-1-4.25.1 1.5hours “ON “, 0.5hour “OFF”
IEC60115-1-4.18
JIS C5201-1-4.18
IEC60115-1-4.33
JIS C5201-1-4.33
260
±5℃
solder , 10
±1
sec dwell .
±(0.1%
+0.05Ω)
3mm deflection
±(0.5%
+0.05Ω)
Dielectric
Withstanding IEC60115-1-4.7
Voltage (Voltage Proof)
JIS C5201-1-4.7
Load Life with Humidity
IEC60115-1-4.24
JIS C5201-1-4.24
Applying voltage :
No abnormalities such
0402 & 0603 : 300V The other
as flashover, burning
500V
dielectric
breakdown
for a minute .
shall appear.
1000 hours 85°C/85%RH. Note:
Specified conditions: 10% of
operating power(not exceeding max
±(0.5%
+0.05Ω)
working voltage). Measurement at
24±2 hours after test conclusion.
Applying voltage 100V for 1 minute.
≧1GΩ
At least 95% of surface
245
±5℃
solder, 2
±0.5
sec dwell. area of electrode shall
Solder : Sn96.5 / Ag3.0 / Cu0.5
be covered with new
solder.
Insulation Resistance
IEC60115-1-4.6
JIS C5201-1-4.6
Solderability
IEC60115-1-4.17
JIS C5201-1-4.17
Note* :RCWV : Rated continuous working voltage .
TA-I TECHNOLOGY CO., LTD
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