End of Life February-2021
RC
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Vishay Techno
Thick Film Chip Resistors, Alternate Terminations
FEATURES
• Suitable for solderable, epoxy bondable, or
wire bondable applications
Available
• Termination material: gold, platinum silver,
platinum palladium gold or solder coated
Available
non-magnetic terminations available
• Multiple styles, termination materials and
configurations, allow wide design flexibility
• Epoxy
bondable
or
wire
bondable
non-magnetic terminations available
• Flow solderable
• Custom sizes available
• Burn-in data available
• Automatic placement capability
• Termination style: 3-sided wraparound termination or
single termination flip chip standard; 5-sided wraparound
termination available
• Tape and reel packaging available
• Internationally standardized sizes
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
CASE SIZE
POWER RATING
P
70 °C
W
MAXIMUM
WORKING
VOLTAGE
(1)
V
40
50
70
100
100
100
125
200
200
RESISTANCE
RANGE
(2)
Ω
TOLERANCE
±%
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
1, 2, 5, 10, 20
TEMPERATURE
COEFFICIENT
(3)
(-55 °C to +155 °C)
± ppm/°C
100
100
100
100
100
100
100
100
100
RC0540
0504
0.100
10 to 500K
RC0550
0505
0.100
10 to 500K
RC0575
0705
(4)
0.200
10 to 1M
RC5100
1005
0.250
10 to 1M
RC1100
1010
0.450
10 to 1M
RC1206
1206
0.300
10 to 1M
RC5150
1505
0.325
10 to 1M
RC7225
2208
0.525
10 to 1M
RC2010
2010
0.575
10 to 1M
Notes
(1)
Continuous working voltage shall be
P
x
R
or maximum working voltage, whichever is less.
(2)
Higher values available. Please consult factory.
(3)
± 100 ppm/°C standard thru 1 MΩ, ± 200 ppm/°C offered from 1.1 MΩ to 10 MΩ.
(4)
MIL case size 0705 and EIA case size 0805 are dimensionally the same.
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: RC0540AA1K00FKSB (preferred part number format)
R
GLOBAL
MODEL
RC
C
SIZE
0540
0550
0575
5100
1100
1206
5150
7225
2010
0
TERM
STYLE
5
4
0
A
A
1
K
0
0
TCR
F
K
S
B
TERM MATERIAL
G
= Non-magnetic
A
= Palladium silver
B
= Platinum gold
C
= Gold
D
= Platinum silver
E
= Platinum
palladium gold
RESISTANCE
VALUE
R=
Ω
K = kΩ
M = MΩ
100R
= 100
Ω
1K00
= 1 kΩ
1M00
= 1 MΩ
TOLERANCE
F
=±1%
G
=±2%
J
=±5%
K
= ± 10 %
M
= ± 20 %
SOLDER
TERMINATION PACKAGING
E
= Sn100
F
= Sn95/Ag5,
HSD
S
=
Sn62/Pb36/Ag2,
HSD
T
= Sn90/Pb10
N
= No solder
B
= Bulk
F
= T/R
(full reel)
1
= T/R
(1000 pcs)
5
= T/R
(500 pcs)
T
= T/R
(250 pcs
min.)
W
= Waffle
tray
A
= 3-sided
B
= Top only
C
= 5-sided
K
= 100 ppm
L
= 150 ppm
N
= 200 ppm
W
= 350 ppm
Historical Part Numbering: CR1AA1001F100S2 (will continue to be accepted)
CR
1
A
A
1001
F
100
S2
HISTORICAL
TERM
TERM
RESISTANCE
SOLDER
SIZE
TOLERANCE
TCR
MODEL
STYLE
MATERIAL
VALUE
TERMINATION
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543).
Revision: 08-Feb-2021
Document Number: 68013
1
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
End of Life February-2021
RC
www.vishay.com
Vishay Techno
ENVIRONMENTAL SPECIFICATIONS
Operating
temperature
Moisture resistance
Life
Short time overload
-55 °C to +155 °C
Less than 0.5 % change when tested
per method 106 of MIL-STD-202
Less than 1 % change when tested
per method 108D (+85 °C)
of MIL-STD-202
Less than 0.5 %
ΔR
MECHANICAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Termination
Ruthenium oxide
Glass
96 % alumina
Gold, palladium silver, platinum gold,
platinum silver, platinum palladium gold or
solder coated non-magnetic terminations
available.
Base metallization without a solder finish
standard. Hot solder dipped tin/silver or
tin/lead/silver solder alloys available.
Solder finish
DIMENSIONS
in inches (millimeters)
Termination Style A
Termination Style B
(3-sided wraparound) (Top conductor only)
Termination Style C
(5-sided wraparound)
MODEL
RC0540
W
L
T
0.025 [0.635]
Max.
T
0.025 [0.635]
Max.
L
W
LENGTH (L)
(1)
± 0.006 (0.152)
0.050 (1.27)
0.050 (1.27)
0.075 (1.90)
0.100 (2.54)
0.100 (2.54)
0.125 (3.18)
0.150 (3.81)
0.225 (5.72)
0.200 (5.08)
WIDTH (W)
(1)
THICKNESS (T)
(1)
± 0.006 (0.152)
± 0.005 (0.127)
0.040 (1.02)
0.050 (1.27)
0.050 (1.27)
0.050 (1.27)
0.100 (2.54)
0.062 (1.57)
0.050 (1.27)
0.075 (1.90)
0.100 (2.54)
0.020 (0.508)
0.020 (0.508)
0.020 (0.508)
0.020 (0.508)
0.020 (0.508)
0.025 (0.635)
0.020 (0.508)
0.020 (0.508)
0.025 (0.635)
W
L
T
0.025 [0.635]
Max.
RC0550
RC0575
RC5100
RC1100
RC1206
RC5150
RC7225
RC2010
Note
(1)
All dimensions are before solder coating.
TERMINATION
MATERIAL
Non-magnetic
TERMINATION
STYLE
3-sided (wraparound)
Top only (flip chip)
3-sided (wraparound)
Epoxy bondable/
solderable
Platinum palladium gold
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Wire bondable/
Epoxy bondable
Gold
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Palladium silver
(4)
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Epoxy bondable
Platinum gold
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Platinum silver
Top only (flip chip)
5-sided (wraparound)
TERMINATION STYLE/
MATERIAL CODE
AG
BG
AE
BE
CE
AC
BC
CC
AA
BA
CA
AB
BB
CB
AD
BD
CD
N
N
N (standard);
F or S (optional)
(3)
SOLDER TERMINATION
CODE
E or T (standard);
F or S (optional)
(2)
TYPE
Solderable
Notes
(2)
Standard solder plating for the non-magnetic parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.
(3)
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting.
(4)
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues.
Revision: 08-Feb-2021
Document Number: 68013
2
For technical questions, contact:
te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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Revision: 01-Jan-2021
1
Document Number: 91000