DATA SHEET
CHIP RESISTORS
RC2010
5%; 1%
Product Specification – Sep. 30, 2003 V.6
Supersedes Date of Jun. 16, 2003
2
Chip Resistor Surface Mount
RC
SERIES
2010
7
SCOPE
This specification describes RC 2010 series chip resistors made by thick film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and
resistance value.
RC2010 X X X XX XXXX
(1) (2) (3)
(4)
(5)
MARKING
RC2010
(1) TOLERANCE
F = ±1%
J = ±5%
E-24 series: 3 digits
ynsc001
(2) PACKAGING TYPE
K = Embossed taping reel
Fig. 1
Value=10KΩ
First two digits for significant figure and 3rd
digit for number of zeros
(3) TEMPERATURE
CHARACTERISTIC OF
RESISTANCE
ynsc001
Both E-24 and E-96 series: 4 digits
First three digits for significant figure and
4th digit for number of zeros
F = ±100ppm/°C
G = ±200ppm/°C
I = ±300ppm/°C
– = Base on spec
Fig. 2
Value=10KΩ
(4) SPECIAL TYPE
07 = 7 inch dia. Reel
CONSTRUCTION
The resistors are constructed out of a high-grade ceramic body. Internal
metal electrodes are added at each end and connected by a resistive
paste. The composition of the paste is adjusted to give the approximate
required resistance and laser cutting of this resistive layer that achieves
tolerance trims the value. The resistive layer is covered with a protective
coat and printed with the resistance value. Finally, the two external
terminations are added. See fig. 3
protective coat
book, 4 columns
(5) RESISTANCE VALUE:
5R6, 56R, 560R, 5K6, 56K, 22M.
resistor layer
inner electrode
H
end termination
I2
ceramic substrate
MBE940_a
Fig. 3
Chip resistor construction
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Sep. 30, 2003 V.6
3
Chip Resistor Surface Mount
RC
SERIES
2010
7
DIMENSION
Table 1
TYPE
L (mm)
W (mm)
H (mm)
I
1
(mm)
I
2
(mm)
RC2010
5.00±0.10
2.50±0.15
0.55±0.10
0.45±0.15
0.50±0.20
MBE940_a
For dimension see Table 1
protective coat
I
1
W
L
Fig. 4
Chip resistor dimension
POWER RATING
RATED POWER AT 70°C,
RC2010 3/4W
lumns
Pmax
MRA632
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
Operating Temperature Range
Maximum Working Voltage
Maximum Overload Voltage
Dielectric Withstanding Voltage
RC2010 3/4 W
–55°C to +155°C
200V
400V
500V
1Ω to 22MΩ (E24)
1Ω to 10MΩ (E96)
Zero Ohm Jumper<0.05Ω
10Ω< R
≤10MΩ
R≤10Ω; R>10MΩ
Rated Current
Maximum Current
±100ppm/°C
±200ppm/°C
2.0A
10.0A
(%Prated )
100
50
0
55
0
50
70
100
Tamb ( C)
o
Resistance Range
155
Fig. 5
Maximum dissipation (P
max
) in
percentage of rated power as
a function of the operating
ambient temperature (T
amb
)
Temperature Coefficient
Jumper Criteria
RATED VOLTAGE:
The DC or AC (rms) continuous
working voltage corresponding to
the rated power is determined by
the following formula:
V=√(P X R)
Where
V=Continuous rated DC
or AC (rms) working voltage (V)
P=Rated power (W)
R=Resistance value (X)
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Sep. 30, 2003 V.6
4
Chip Resistor Surface Mount
RC
SERIES
2010
7
TAPING REEL
Table 3
DIMENSION
Tape Width
ØA (mm)
ØB (mm)
ØC (mm)
W (mm)
T (mm)
RC2010
12mm
180+0/–3
60+1/–0
13.0±0.2
13.0±0.3
15.4±1
Fig. 6
Reel dimension
W
MSA284_a
For dimension see Table 3
T
21 0.8
C
B
A
EMBOSSED TAPE SPECIFICATION
Table 4
DIMENSION
A (mm)
B (mm)
W (mm)
E (mm)
F (mm)
P
0
(mm)
P
1
(mm)
P
2
(mm)
ØD
0
(mm)
ØD
1
(mm)
T (mm)
RC2010
2.80±0.2
5.4±0.2
12±0.2
1.75±0.1
5.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
1.5+0.1/–0
1.5+0.25/–0
1.0.±0.1
Fig. 7
Embossed tape dimension
For dimension see Table 4
A
P1
MBD123_a
P0
T
D0
P2
E
cover tape
B
F
W
PACKING METHOD
LEADER/TRAILER TAPE SPECIFICATION
leader end
trailer end
empty compartments
with cover tape
(min. 240 mm)
cover tape only
trailer (max. 260 mm)
leader
≥400
mm
CCB325
Fig. 8
Leader and trailer tape dimension
Table 5
Packing style and packaging quantity
PACKING STYLE
Embossed Taping Reel (K)
REEL DIMENSION
7" (178 mm)
RC2010
4,000
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Sep. 30, 2003 V.6
5
Chip Resistor Surface Mount
RC
SERIES
2010
7
TYPE
Temperature
Coefficient of
Resistance
(T.C.R.)
TEST METHOD
Measure resistance at
+25°C or specified room
temperature as R
1
, then
measure at –55°C or
+155°C respectively as R
2
.
Determine the
temperature coefficient of
resistance from the
following formula:
ACCEPTANCE STANDARD
Formula
R
2
–R
1
T.C.R. = ------------------------- ×10
6
(ppm/°C)
R
1
(t
2
–t
1
)
Where
t
1
=+25°C or specified room temperature
t
2
=–55°C or +155°C test temperature
R
1
=resistance at reference temperature in ohms
R
2
=resistance at test temperature in ohms
Refer to table 2
Thermal
Shock
At –55±3°C for 2 minutes and at +155±2°C for 2 minutes as one cycle. After 5
cycles, the specimen shall be stabilized at room temp.
Measure the resistance to determine
ΔR/R(%)
after one more hour.
±(0.5%+0.05Ω)
Low
Temperature
Operation
Place the specimen in a test chamber maintained at –65 (+0/–5)°C. After one hour
stabilization at this temperature, full rated working voltage shall be applied for 45
(+5/–0) minutes. Have15 (+5/–0 ) minutes after remove the voltage, the specimen
shall be removed from the chamber and stabilized at room temperature for 24 hrs.
Measure the resistance to determine
ΔR/R(%).
±(0.5%+0.05Ω) for 1% tol .
±(1.0%+0.05Ω) for 5% tol.
No visible damage
Short
Time
Overload
Apply 2.5 times of rated voltage but not exceeding the maximum overload voltage
for 5 seconds. Have the specimen stabilized at room temperature for 30 minutes
minimum.
Measure the resistance to determine
ΔR/R(%).
±(1.0%+0.05Ω)
No visible damage
Insulation
Resistance
Place the specimen in the jig and apply a rated
continues overload voltage (R.C.O.V) for one
minute as shown.
Measure the insulation resistance.
Type
Voltage (DC)
RC2010
400V
≥10,000MΩ
Dielectric
Withstand
Voltage
Place the specimen in the jig and apply a
specified value continuous overload voltage as
shown for one minute.
Type
Voltage (AC)
RC2010
500Vrms
Breakdown voltage>
specification and without
open/short
Resistance
To Soldering
Heat
Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the
specimen stabilized at room temperature for 30 minutes minimum.
Measure the resistance to determine
Δ
R/R(%).
±(0.5%+0.05Ω)
No visible damage
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Sep. 30, 2003 V.6
stm32/stm8
