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RC28F640P30T85

8M X 16 FLASH 1.8V PROM, 85 ns, PDSO56

器件类别:存储    存储   

厂商名称:Intel(英特尔)

厂商官网:http://www.intel.com/

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Intel(英特尔)
零件包装代码
BGA
包装说明
BGA-64
针数
64
Reach Compliance Code
compli
ECCN代码
3A991.B.1.A
最长访问时间
85 ns
其他特性
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
启动块
TOP
命令用户界面
YES
通用闪存接口
YES
数据轮询
NO
JESD-30 代码
R-PBGA-B64
JESD-609代码
e0
长度
13 mm
内存密度
67108864 bi
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
部门数/规模
4,63
端子数量
64
字数
4194304 words
字数代码
4000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-40 °C
组织
4MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TBGA
封装等效代码
BGA64,8X8,40
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE
页面大小
4 words
并行/串行
PARALLEL
峰值回流温度(摄氏度)
240
电源
1.8,1.8/3.3 V
编程电压
1.8 V
认证状态
Not Qualified
座面最大高度
1.2 mm
部门规模
16K,64K
最大待机电流
0.000005 A
最大压摆率
0.051 mA
最大供电电压 (Vsup)
2 V
最小供电电压 (Vsup)
1.7 V
标称供电电压 (Vsup)
1.8 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
30
切换位
NO
类型
NOR TYPE
宽度
10 mm
文档预览
Intel StrataFlash
®
Embedded Memory
(P30)
1-Gbit P30 Family
Datasheet
Product Features
Security
— 85/88 ns initial access
— One-Time Programmable Registers:
• 64 unique factory device identifier bits
— 40 MHz with zero wait states, 20 ns clock-to-
• 64 user-programmable OTP bits
data output synchronous-burst read mode
• Additional 2048 user-programmable OTP bits
— 25 ns asynchronous-page read mode
— Selectable OTP Space in Main Array:
— 4-, 8-, 16-, and continuous-word burst mode
• 4x32KB parameter blocks + 3x128KB main
— Buffered Enhanced Factory Programming
blocks (top or bottom configuration)
(BEFP) at 5 µs/byte (Typ)
— Absolute write protection: V
PP
= V
SS
— 1.8 V buffered programming at 7 µs/byte (Typ)
— Power-transition erase/program lockout
Architecture
— Individual zero-latency block locking
— Multi-Level Cell Technology: Highest Density
— Individual block lock-down
at Lowest Cost
Software
— Asymmetrically-blocked architecture
— 20 µs (Typ) program suspend
— Four 32-KByte parameter blocks: top or
— 20 µs (Typ) erase suspend
bottom configuration
— Intel
®
Flash Data Integrator optimized
— 128-KByte main blocks
— Basic Command Set and Extended Command
Voltage and Power
Set compatible
— V
CC
(core) voltage: 1.7 V – 2.0 V
— Common Flash Interface capable
— V
CCQ
(I/O) voltage: 1.7 V – 3.6 V
Density and Packaging
— Standby current: 55 µA (Typ) for 256-Mbit
— 64/128/256-Mbit densities in 56-Lead TSOP
— 4-Word synchronous read current:
package
13 mA (Typ) at 40 MHz
— 64/128/256/512-Mbit densities in 64-Ball
Quality and Reliability
Intel
®
Easy BGA package
— Operating temperature: –40 °C to +85 °C
• 1-Gbit in SCSP is –30 °C to +85 °C
— 64/128/256/512-Mbit and 1-Gbit densities in
Intel
®
QUAD+ SCSP
— Minimum 100,000 erase cycles per block
— 16-bit wide data bus
— ETOX™ VIII process technology (130 nm)
High performance
The Intel StrataFlash
®
Embedded Memory (P30) product is the latest generation of Intel
StrataFlash
®
memory devices. Offered in 64-Mbit up through 1-Gbit densities, the P30 device
brings reliable, two-bit-per-cell storage technology to the embedded flash market segment.
Benefits include more density in less space, high-speed interface, lowest cost-per-bit NOR
device, and support for code and data storage. Features include high-performance synchronous-
burst read mode, fast asynchronous access times, low power, flexible security options, and three
industry standard package choices.
The P30 product family is manufactured using Intel
®
130 nm ETOX™ VIII process technology.
Order Number: 306666, Revision: 001
April 2005
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not
finalize a design with this information.
StrataFlash® Embedded Memory (P30) Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing
your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at
http://www.intel.com.
Copyright © 2005, Intel Corporation
* Other names and brands may be claimed as the property of others.
April 2005
2
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
1-Gbit P30 Family
Contents
1.0 Introduction
...............................................................................................................................7
1.1
1.2
1.3
Nomenclature .......................................................................................................................7
Acronyms ..............................................................................................................................7
Conventions..........................................................................................................................8
2.0 Functional Overview
..............................................................................................................9
3.0 Package Information
............................................................................................................10
3.1
3.2
3.3
4.1
4.2
4.3
4.4
56-Lead TSOP Package .....................................................................................................10
64-Ball Easy BGA Package ................................................................................................12
QUAD+ SCSP Packages....................................................................................................13
Signal Ballout......................................................................................................................17
Signal Descriptions .............................................................................................................20
SCSP Configurations ..........................................................................................................22
Memory Maps .....................................................................................................................24
4.0 Ballout and Signal Descriptions
......................................................................................17
5.0 Maximum Ratings and Operating Conditions
...........................................................29
5.1
5.2
6.1
6.2
7.1
7.2
7.3
7.4
7.5
8.1
8.2
8.3
9.1
Absolute Maximum Ratings ................................................................................................29
Operating Conditions ..........................................................................................................30
DC Current Characteristics .................................................................................................31
DC Voltage Characteristics.................................................................................................32
AC Test Conditions.............................................................................................................33
Capacitance ........................................................................................................................34
AC Read Specifications ......................................................................................................35
AC Write Specifications ......................................................................................................41
Program and Erase Characteristics ....................................................................................45
Power Up and Down ...........................................................................................................46
Reset Specifications ...........................................................................................................46
Power Supply Decoupling...................................................................................................47
Bus Operations ...................................................................................................................48
9.1.1 Reads ....................................................................................................................48
9.1.2 Writes.....................................................................................................................49
9.1.3 Output Disable .......................................................................................................49
9.1.4 Standby..................................................................................................................49
9.1.5 Reset .....................................................................................................................49
Device Commands .............................................................................................................50
Command Definitions .........................................................................................................51
6.0 Electrical Specifications
.....................................................................................................31
7.0 AC Characteristics
................................................................................................................33
8.0 Power and Reset Specifications
.....................................................................................46
9.0 Device Operations
.................................................................................................................48
9.2
9.3
Datasheet
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
April 2005
3
1-Gbit P30 Family
10.0 Read Operations
.................................................................................................................... 53
10.1
10.2
10.3
Asynchronous Page-Mode Read........................................................................................ 53
Synchronous Burst-Mode Read.......................................................................................... 53
Read Configuration Register .............................................................................................. 54
10.3.1 Read Mode ............................................................................................................ 55
10.3.2 Latency Count........................................................................................................ 55
10.3.3 WAIT Polarity......................................................................................................... 57
10.3.4 Data Hold............................................................................................................... 58
10.3.5 WAIT Delay............................................................................................................ 59
10.3.6 Burst Sequence ..................................................................................................... 59
10.3.7 Clock Edge ............................................................................................................ 59
10.3.8 Burst Wrap............................................................................................................. 59
10.3.9 Burst Length .......................................................................................................... 60
Word Programming............................................................................................................. 61
11.1.1 Factory Word Programming................................................................................... 62
Buffered Programming........................................................................................................ 62
Buffered Enhanced Factory Programming ......................................................................... 63
11.3.1 BEFP Requirements and Considerations .............................................................. 64
11.3.2 BEFP Setup Phase................................................................................................ 64
11.3.3 BEFP Program/Verify Phase ................................................................................. 64
11.3.4 BEFP Exit Phase ................................................................................................... 65
Program Suspend............................................................................................................... 65
Program Resume................................................................................................................ 66
Program Protection............................................................................................................. 66
Block Erase......................................................................................................................... 67
Erase Suspend ................................................................................................................... 67
Erase Resume .................................................................................................................... 68
Erase Protection ................................................................................................................. 68
Block Locking...................................................................................................................... 69
13.1.1 Lock Block ............................................................................................................. 69
13.1.2 Unlock Block .......................................................................................................... 69
13.1.3 Lock-Down Block ................................................................................................... 69
13.1.4 Block Lock Status .................................................................................................. 70
13.1.5 Block Locking During Suspend.............................................................................. 70
Selectable One-Time Programmable Blocks...................................................................... 71
Protection Registers ........................................................................................................... 72
13.3.1 Reading the Protection Registers .......................................................................... 73
13.3.2 Programming the Protection Registers.................................................................. 73
13.3.3 Locking the Protection Registers ........................................................................... 74
Read Status Register.......................................................................................................... 75
14.1.1 Clear Status Register............................................................................................. 76
Read Device Identifier ........................................................................................................ 76
11.0 Programming Operations
.................................................................................................. 61
11.1
11.2
11.3
11.4
11.5
11.6
12.1
12.2
12.3
12.4
13.1
12.0 Erase Operations
................................................................................................................... 67
13.0 Security Modes
....................................................................................................................... 69
13.2
13.3
14.0 Special Read States
............................................................................................................. 75
14.1
14.2
April 2005
4
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
Datasheet
1-Gbit P30 Family
14.3
CFI Query ...........................................................................................................................77
Appendix A
Appendix B
Appendix C
Appendix D
Appendix E
Appendix F
Write State Machine
..........................................................................................78
Flowcharts
............................................................................................................85
Common Flash Interface
................................................................................93
Additional Information
................................................................................... 100
Ordering Information for Discrete Products
........................................ 101
Ordering Information for SCSP Products
..............................................102
Datasheet
Intel StrataFlash
®
Embedded Memory (P30)
Order Number: 306666, Revision: 001
April 2005
5
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