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RCG0805240RDKEA

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 240ohm, 150V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
Objectid
278416204
包装说明
CHIP
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
RATED AC VOLTAGE : 150
构造
Rectangular
JESD-609代码
e3
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
155 °C
最低工作温度
-55 °C
封装高度
0.45 mm
封装长度
2 mm
封装形式
SMT
封装宽度
1.25 mm
包装方法
TR, Paper, 7 Inch
额定功率耗散 (P)
0.125 W
额定温度
70 °C
参考标准
IEC60068
电阻
240 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
0805
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Tin (Sn)
端子形状
WRAPAROUND
容差
0.5%
工作电压
150 V
文档预览
RCG e3
www.vishay.com
Vishay
Green Thick Film Chip Resistors
FEATURES
• Vishay Green resistor - does not use RoHS
exemptions
• Stability at different environmental conditions
ΔR/R ≤
1 % (1000 h rated power at 70 °C)
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
APPLICATIONS
• Consumer
• Connectivity
D
D
3
3
3D Models
RCG e3 series Vishay Green thick film chip resistors are the
perfect choice for commercial applications where fully
RoHS-compliant products are required. Typical applications
include consumer and connectivity applications.
TECHNICAL SPECIFICATIONS
DESCRIPTION
Imperial size
Metric size code
Resistance range
Resistance tolerance
Temperature coefficient
Rated dissipation,
P
70 (1)
Operating voltage,
U
max.
AC
RMS
/DC
Permissible film temperature,
ϑ
F max. (1)
Operating temperature range
Max. resistance change at
P
70
for
resistance range, IΔR/RI after:
1000 h
Permissible voltage against ambient
(insulation):
1 min,
U
ins
Note
(1)
Please refer to “Application Information” below
75 V
100 V
200 V
300 V
2%
0.063 W
50 V
RCG0402 e3
0402
RR1005M
RCG0603 e3
0603
RR1608M
RCG0805 e3
0805
RR2012M
RCG1206 e3
1206
RR3216M
1
Ω
to 10 MΩ; jumper (0
Ω)
± 5 %; ± 1 %; ± 0.5 %
± 200 ppm/K; ± 150 ppm/K; ± 100 ppm/K
0.10 W
75 V
155 °C
-55 °C to +155 °C
0.125 W
150 V
0.25 W
200 V
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
Revision: 11-Nov-2021
Document Number: 20047
1
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
Vishay
TOLERANCE
±5%
±1%
± 0.5 %
±1%
± 0.5 %
20 mΩ
±5%
±1%
± 0.5 %
20 mΩ
±5%
±1%
± 0.5 %
20 mΩ
±5%
±1%
± 0.5 %
20 mΩ
RESISTANCE
1
Ω
to 10 MΩ
1
Ω
to 147
Ω
E24; E96
150
Ω
to 10 MΩ
0
Ω
1
Ω
to 10 MΩ
0
Ω
1
Ω
to 10 MΩ
0
Ω
1
Ω
to 10 MΩ
0
Ω
-
E24
E24; E96
-
E24
E24; E96
-
E24
E24; E96
-
E-SERIES
E24
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
± 200 ppm/K
± 150 ppm/K
RCG0402 e3
± 100 ppm/K
Jumper,
I
max.
= 1.5 A
± 200 ppm/K
RCG0603 e3
± 100 ppm/K
Jumper,
I
max.
= 2 A
± 200 ppm/K
RCG0805 e3
± 100 ppm/K
Jumper,
I
max.
= 2.5 A
± 200 ppm/K
RCG1206 e3
± 100 ppm/K
Jumper,
I
max.
= 3.5 A
Note
• The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumper
PACKAGING
TYPE / SIZE
RCG0402 e3
CODE
ED
EE
EI
ED
EL
EE
EA
EB
EC
EA
EB
EC
EA
EB
EC
QUANTITY
10 000
50 000
5000
10 000
20 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
PACKAGING STYLE
WIDTH
8 mm
PITCH
2 mm
PACKAGING
DIMENSIONS
180 mm / 7"
330 mm / 13"
180 mm / 7"
180 mm / 7"
285 mm / 11.25"
330 mm / 13"
180 mm / 7"
285 mm / 11.25"
330 mm / 13"
180 mm / 7"
285 mm / 11.25"
330 mm / 13"
180 mm / 7"
285 mm / 11.25"
330 mm / 13"
2 mm
8 mm
Paper tape acc. to
IEC 60286-3, Type 1a
8 mm
4 mm
RCG0603 e3
RCG0805 e3
4 mm
RCG1206 e3
8 mm
4 mm
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: RCG080510K0FKEA
R
C
G
0
8
0
5
1
0
K
0
F
K
E
A
TYPE / SIZE
RCG0402
RCG0603
RCG0805
RCG1206
RESISTANCE
R
= decimal
K
= thousand
M
= million
0000
= 0
Ω
jumper
100
TCR
± 100
ppm/K
± 150
ppm/K
± 200
ppm/K
TOLERANCE
D
= ± 0.5 %
F
= ± 1.0 %
J
= ± 5.0 %
Z
= jumper
TCR
K
= ± 100 ppm/K
L
= ± 150 ppm/K
N
= ± 200 ppm/K
0
= jumper
PACKAGING
EA, EB, EC, ED,
EE, EI, EL
Product Description: RCG0805 100 10K 1 % EA
RCG0805
TYPE / SIZE
RCG0402
RCG0603
RCG0805
RCG1206
10K
RESISTANCE
10R
= 10
Ω
10K
= 10 kΩ
1M
= 1 MΩ
0R0
= jumper
1%
TOLERANCE
± 0.5 %
±1%
±5%
EA
PACKAGING
EA, EB, EC, ED,
EE, EI, EL
Revision: 11-Nov-2021
Document Number: 20047
2
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A Vishay
Green cermet film layer and a glass-over are deposited on a
high grade (Al
2
O
3
) ceramic substrate with its prepared inner
Vishay Green contacts. A special laser is used to achieve the
target value by smoothly fine trimming the resistive layer
without damaging the ceramics. The resistor elements are
covered by a protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure on 100 % of the individual chip
resistors. Only accepted products are laid directly into
the tape in accordance with
IEC 60286-3 Type 1a.
Vishay
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein
(2)
• The Global Automotive Declarable Substance List
(GADSL)
(3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC)
(4)
for its
supply chain
The products do not contain any of the banned
substances as per IEC 62474, GADSL, or the SVHC list,
see
www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1
(1)
. The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are fully RoHS-compliant, the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
APPROVALS
Where applicable, the resistors are tested in accordance
with
EN 140401-802
which refers to
EN 60115-1,
EN 60115-8
and the variety of environmental test
procedures of the
IEC 60068
(1)
series.
RELATED PRODUCTS
For RoHS-compliant thick film resistors please refer to
“D/CRCW e3, Standard Thick Film Chip Resistors”
datasheet (www.vishay.com/doc?20035).
For RoHS-compliant thick film chip resistors with medium
power rating and operating voltage, please refer to “RCC e3
Medium Power Thick Film Chip Resistors” datasheet
(www.vishay.com/docs?20066).
Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
(2)
The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at
http://std.iec.ch/iec62474
(3)
The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org
(4)
The SVHC list is maintained by the European Chemical Agency (ECHA) and available at
http://echa.europa.eu/candidate-list-table
Revision: 11-Nov-2021
Document Number: 20047
3
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
FUNCTIONAL PERFORMANCE
Derating
Axis Title
10000
RCG1206
RCG0805
RCG0603
RCG0402
Vishay
2nd line
P
- Power Dissipation (W)
0.2
1000
1st line
2nd line
100
0
-70
-60
-50
-40
-30
-20
-10
0
10
70
ϑ
amb
- Ambient Temperature (°C)
20
30
40
50
60
80
90
100 110 120 130 140 150 160
10
VISHAY GREEN REQUIREMENTS
SUBSTANCES
Lead (Pb)
Mercury (Hg)
Cadmium (Cd)
Hexavalent chronium
Polybrominated biphenyl (PBB)
Polybrominated diphenyl ether (PBDE)
Bromine (Br)
Chlorine (Cl)
Sum of bromine and chlorine
Antimony (Sb)
Red phosphorous
CONCENTRATION LIMIT
< 1000 ppm
< 1000 ppm
< 100 ppm
< 1000 ppm
< 1000 ppm
< 1000 ppm
< 900 ppm
< 900 ppm
1500 ppm
< 900 ppm
< 100 ppm
Notes
• No exemptions (e.g. Pb in glass) may be applied to any substances or application for the “Vishay Green” category
• All concentration levels are based on homogenous materials
TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
EN 60115-1, generic specification
EN 60115-8, sectional specification
EN 140401-802, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days). The components are
mounted for testing on boards in accordance with EN
60115-8, 2.4.2 unless otherwise specified.
Revision: 11-Nov-2021
Document Number: 20047
4
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCG e3
www.vishay.com
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
4.5
4.8
4.25.1
4.25.3
4.24
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
4.19
4.13
IEC
60068-2
(1)
TEST
METHOD
-
-
-
-
78 (Cab)
-
2 (Ba)
30 (Db)
1 (Ab)
13 (M)
30 (Db)
-
1 (Aa)
14 (Na)
-
PROCEDURE
TEST
Stability for product types:
RCG e3
Resistance
Temperature coefficient
Endurance at 70 °C
Endurance at upper
category temperature
Damp heat, steady state
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
Cold
Rapid change
of temperature
Short time overload
Single pulse high
voltage overload
-
At (20 / -55 / 20) °C and
(20 / 125 / 20) °C
U
=
P
70
x
R
U
max.
;
1.5 h on; 0.5 h off
70 °C; 1000 h
155 °C; 1000 h
(40 ± 2) °C; (93 ± 3) % RH; 56 days
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 1 STABILITY CLASS 2
OR BETTER
OR BETTER
1
Ω
to 10 MΩ
± 0.5 %; ± 1 %
± 100 ppm/K;
± 150 ppm/K
±5%
± 500 ppm/K
Vishay
± (1 %
R
+ 0.05
Ω)
± (1 %
R
+ 0.05
Ω)
± (1 %
R
+ 0.05
Ω)
± (2 %
R
+ 0.1
Ω)
± (2 %
R
+ 0.1
Ω)
± (1 %
R
+ 0.1
Ω)
4.27
-
4.39
-
Periodic electric overload
Electrostatic discharge
(human body model)
4.38
-
4.22
6 (Fc)
Vibration
4.17
58 (Td)
Solderability
4.18
4.29
4.32
4.33
4.7
4.35
58 (Td)
45 (XA)
21 (Uu
3
)
21 (Uu
1
)
-
-
Resistance to
soldering heat
Component solvent
resistance
Shear (adhesion)
Substrate bending
Voltage proof
Flammability,
needle flame test
125 °C; 16 h
55 °C; 24 h;
90 % RH; 1 cycle
-55 °C; 2 h
± (1 %
R
+ 0.05
Ω)
± (2 %
R
+ 0.1
Ω)
8.5 kPa; 2 h; (25 ± 10) °C
55 °C; 5 days; > 90 % RH; 5 cycles
U
=
P
70
x
R
U
max.
; 1 min
-55 °C; 2 h
± (0.5 %
R
+ 0.1
Ω)
30 min. at -55 °C and 30 min. at 125 °C;
± (1 %
R
+ 0.05
Ω)
1000 cycles
U
= 2.5 x
P
70
x
R
2 x
U
max.
;
± (2 %
R
+ 0.05
Ω)
whichever is the less severe; 5 s
Severity no. 4:
U
= 10 x
P
70
x
R
or
U
2 x
U
max.;
± (1 %
R
+ 0.05
Ω)
whichever is the less severe;
10 pulses 10 μs / 700 μs
U
= 15 x
P
70
x
R
2 x
U
max.;
whichever is the less severe;
± (1 %
R
+ 0.05
Ω)
0.1 s on; 2.5 s off; 1000 cycles
IEC 61340-3-1
(1)
;
± (1 %
R
+ 0.05
Ω)
3 positive + 3 negative discharges;
ESD voltage acc. to size
Endurance by sweeping;
10 Hz to 2000 Hz;
± (0.25 %
R
+ 0.05
Ω)
± (0.5 %
R
+ 0.05
Ω)
no resonance;
no visible damage
no visible damage
amplitude
1.5 mm or
200 m/s
2
;
7.5 h
Solder bath method,
Sn60Pb40; non-activated flux;
(235 ± 5) °C; (2 ± 0.2) s
Good tinning (≥ 95 % covered);
Solder bath method,
no visible damage
Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7
non-activated flux;
(245 ± 5) °C or (250 ± 5) °C; (3 ± 0.3) s
Solder bath method;
± (0.25 %
R
+ 0.05
Ω)
± (0.5 %
R
+ 0.05
Ω)
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol;
No visible damage
50 °C; method 2
RCG0402 e3 and RCG0603 e3: 9 N
No visible damage
RCG0805 e3 and RCG1206 e3: 45 N
No visible damage,
no open circuit in bent position
Depth 2 mm; 3 times
± (0.25 %
R
+ 0.05
Ω)
± (0.5 %
R
+ 0.05
Ω)
No flashover or breakdown
U
= 1.4 x
U
ins
; 60 s
(1)
;
IEC 60695-11-5
No burning after 30 s
10 s
Note
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 11-Nov-2021
Document Number: 20047
5
For technical questions, contact:
thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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