RCL e3
Vishay Draloric
Long Side Termination Thick Film Chip Resistors
FEATURES
Enhanced power rating
Long side terminations
Pure tin solder contacts on Ni barrier layer,
provides compatibility with lead (Pb)-free and
lead containing soldering processes
Compliant to RoHS Directive 2002/95/EC
Halogen-free according to IEC 61249-2-21 definition
AEC-Q200 qualified
STANDARD ELECTRICAL SPECIFICATIONS
SIZE
MODEL
INCH
METRIC
RATED
DISSIPATION
P
70
W
LIMITING
ELEMENT
VOLTAGE
U
max.
AC/DC
V
75
± 200
± 100
RCL1218 e3
1218
RR 3246M
1.0
200
± 200
RCL1225 e3
1225
RR 3263M
2.0
(1)
± 100
200
± 200
±5
±5
±1
1R0 to 1M
E24
±5
±1
1R0 to 2.2M
E24
E24; E96
TEMPERATURE
COEFFICIENT
ppm/K
± 100
RCL0612 e3
0612
RR 1632M
0.5
TOLERANCE
%
RESISTANCE
RANGE
SERIES
±1
1R0 to 1M
E24; E96
E24
E24; E96
Notes
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
Marking: See datasheet “Surface Mount Resistor Marking” (document number 20020).
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
(1)
Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance.
TECHNICAL SPECIFICATIONS
DESCRIPTION
Rated Dissipation
P
70 (2)
Limiting Element Voltage
U
max.
AC/DC
Insulation Voltage
U
ins
(1 min)
Insulation Resistance
Category Temperature Range
Weight
(2)
UNIT
W
V
V
°C
mg
RCL0612
0.5
75
> 100
RCL1218
1.0
200
> 300
> 10
9
- 55 to + 155
RCL1225
2.0
(3)
200
> 300
11
29.5
55
Notes
The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
(3)
Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance.
Document Number: 20046
Revision: 14-Jun-11
For technical questions, contact:
thickfilmchip@vishay.com
www.vishay.com
269
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
Vishay Draloric
Long Side Termination Thick Film Chip Resistors
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: RCL061210K0FKEA
R
C
L
0
6
1
2
1
0
K
0
F
K
E
A
0
0
SPECIAL
Up to 2 digits
00
= Standard
MODEL/SIZE
RCL0612
RCL1218
RCL1225
RESISTANCE
R =
Decimal
K =
Thousand
M =
Million
0000 =
Jumper
TOLERANCE
F=
±1%
J=
±5%
Z =
Jumper
TCR
K =
± 100 ppm/K
N =
± 200 ppm/K
0 =
Jumper
PACKAGING
EA
EB
EC
EK
EG
PRODUCT DESCRIPTION: RCL0612 100 10K 1 % ET1 e3
RCL0612
MODEL
RCL0612
RCL1218
RCL1225
100
TCR
±
100
ppm/K
±
200
ppm/K
10K
RESISTANCE
10R
= 10
10K
= 10 k
1M
= 1 M
0R0
= Jumper
1%
TOLERANCE
±
1%
±
5%
ET1
PACKAGING
ET1
ET5
ET6
ET9
E67
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination
finish
PACKAGING
MODEL
UNIT
180 mm/7"
RCL0612
RCL1218
RCL1225
285 mm/11.25"
330 mm/13"
180 mm/7"
180 mm/7"
5000
10 000
20 000
PAPER TAPE ON REEL
ACC. TO IEC 60286-3, TYPE I
QUANTITY
PART NUMBER
EA
EB
EC
PRODUCT DESC.
ET1
ET5
ET6
4000
2000
EK
EG
ET9
E67
BLISTER TAPE ON REEL
ACC. TO IEC 60286-3, TYPE II
QUANTITY
PART NUMBER
PRODUCT DESC.
DIMENSIONS
in millimeters
T2
L
H
l
W
T1
b
a
SIZE
INCH
0612
1218
1225
METRIC
1632
3246
3263
L
1.6 ± 0.2
3.2
+ 0.10
- 0.20
DIMENSIONS
W
3.2 ± 0.2
4.6 ± 0.15
6.3 ± 0.2
H
0.55 ± 0.1
0.55 ± 0.05
0.75 ± 0.15
T1
0.35 ± 0.15
0.45 ± 0.2
0.8 ± 0.2
T2
0.25 ± 0.15
0.4 ± 0.2
0.4 ± 0.2
SOLDER PAD DIMENSIONS
REFLOW SOLDERING
a
0.6
1.1
1.9
b
3.2
4.9
7.6
l
1.0
1.9
1.2
WAVE SOLDERING
a
1.1
1.25
1.9
b
3.2
4.8
7.6
l
1.0
1.9
1.2
3.2 ± 0.2
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For technical questions, contact:
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Document Number: 20046
Revision: 14-Jun-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
Long Side Termination Thick Film Chip Resistors
Vishay Draloric
FUNCTIONAL PERFORMANCE
Single Pulse
Pulse Load
P
max.
(W)
1000
1225
1218
0612
100
10
1
0.1
0.01
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
100
Pulse Duration
t
i
(s)
Maximum pulse load, single pulse; applicable if
P
0 and n < 1000 and
Û
≤
Û
max.
;
for permissible resistance change equivalent to
8000
h operation
Continuous Pulse
Continuous Pulse Load
P
max.
(W)
1000
1225
1218
0612
100
10
1
0.1
0.01
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
1
10
100
Pulse Duration
t
i
(s)
Maximum pulse load, continuous pulses; applicable if
P
≤
P
(ϑ
amb
) and
Û
≤
Û
max.
;
for permissible resistance change equivalent to
8000
h operation
Pulse Voltage
Pulse Voltage
Û
max.
(V)
800
1225, 1218
700
600
500
400
300
200
100
0
-6
10
10
- 5
10
- 4
10
- 3
10
- 2
10
- 1
1
10
0612
Pulse Duration
t
i
(s)
Maximum pulse
voltage,
single and continuous pulses; applicable if
P
≤
P
max.
; for permissible resistance change equivalent to
8000
h operation
Document Number: 20046
Revision: 14-Jun-11
For technical questions, contact:
thickfilmchip@vishay.com
www.vishay.com
271
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
Vishay Draloric
Long Side Termination Thick Film Chip Resistors
Derating
Fraction of Rated Dissipation
P
70
in
%
100
50
0
- 50
0
50
100
150
70
Ambient Temperature
ϑ
amb
in °C
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
RCL e3
4.5
4.7
4.13
-
-
-
Resistance
Voltage proof
Short time overload
-
U
= 1.4 x
U
ins
; 60 s
U
= 2.5 x
P
70
x
R
2 x
U
max.
;
Duration acc. to style
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
4.17.2
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 ± 5)
C
(3 ± 0.3) s
4.8.4.2
4.32
-
21 (Uu
3
)
Temperature
coefficient
Shear
(adhesion)
Substrate bending
(20/- 55/20)
C
and
(20/125/20)
C
45N
Depth 2 mm;
3 times
30 min at - 55 °C;
30 min at 125 °C
5 cycles
1000 cycles
± (0.25 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
Good tinning ( 95 % covered);
no visible damage
±1%
No flashover or breakdown
±0.25 %
R
+ 0.05)
±0.5 %
R
+ 0.05)
1
to 2.2 M
±5%
Good tinning ( 95 % covered);
no visible damage
± 100 ppm/K
No visible damage
± 200 ppm/K
No visible damage, no open circuit in bent position
± (0.25 %
R
+ 0.05
)
4.33
21 (Uu
1
)
4.19
14 (Na)
Rapid change of
temperature
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For technical questions, contact:
thickfilmchip@vishay.com
Document Number: 20046
Revision: 14-Jun-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
RCL e3
Long Side Termination Thick Film Chip Resistors
Vishay Draloric
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
Stability for product types:
RCL e3
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
Endurance
at 70 °C
-
125 °C; 16 h
55 °C;
90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C;
90 % RH;
24 h; 5 cycles
U
=
P
70
x
R
U
=
P
70
x
R
U
max.
;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
Solder bath method
(260 ± 5)
C;
(10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
155 °C, 1000 h
IEC 61340-3-1
3 pos. + 3 neg.
discharges;
ESD voltage: 1000 V
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1,
toothbrush
f = 10 Hz to 2000 Hz;
x, y, z
1.5 mm;
A
200 m/s
2
;
10 sweeps per axis
U
= 15 x
P
70
x
R
2 x
U
max.
;
0.1 s on; 2.5 s off;
1000 cycles
Û
= 10 x
P
70
x
R
2 x
U
max.
;
10 pulses
1
to 2.2 M
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.25.1
-
± (0.5 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (0.25 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
± (4 %
R
+ 0.1
)
± (0.5 %
R
+ 0.05
)
4.18.2
4.35
4.24
58 (Td)
-
78 (Cab)
Resistance to
soldering heat
Flamability,
needle flame test
Damp heat,
steady state
Endurance at
upper category
temperature
Electrostatic
discharge
(Human Body Model)
Component solvent
resistance
Solvent resistance
of marking
Vibration, endurance
by sweeping
No burning after 30 s
± (1 %
R
+ 0.05
)
± (1 %
R
+ 0.05
)
± (2 %
R
+ 0.1
)
4.25.3
-
4.40
-
± (1 %
R
+ 0.05
)
4.29
4.30
45 (XA)
45 (XA)
No visible damage
Marking legible,
no visible damage
± (0.25 %
R
+ 0.05
)
± (0.5 %
R
+ 0.05
)
4.22
6 (Fc)
4.37
-
Periodic electric
overload
Single pulse high
voltage overload,
10 µs/700 µs
± (1 %
R
+ 0.05
)
4.27
-
± (1 %
R
+ 0.05
)
All tests are carried out in accordance with the following specifications:
EN 60115-1, generic specification
EN 140400, sectional specification
EN 140401-802, detail specification
IEC 60068-2-x environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3
Document Number: 20046
Revision: 14-Jun-11
For technical questions, contact:
thickfilmchip@vishay.com
www.vishay.com
273
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
