RFPO55
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SMD Oven Controlled Crystal Oscillator
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Rakon’s Mercury oven controlled crystal oscillator (OCXO) provides comparable stability
to ‘traditional’ OCXOs in a small SMD package.
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Product description
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Using Rakon’s proprietary Mercury ASIC, the OCXO is capable of short term ageing of typically
less than ±2 ppb per day, with temperature stability down to ±10 ppb. The miniature, highly
integrated oven used ensures short warm up times with power consumption of only 350 mW
at room temperature.
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Applications
• IP timing
• LTE
• Network timing and synchronisation
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Features
• ±20 ppb stability over -40 to 85°C
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Specifications
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1.0
Line
1.1
1.2
1.3
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SPECIFICATION REFERENCES
Parameter
Model description
RoHS compliant
Package size
Description
RFPO55
Yes
2.0
Line
2.1
2.2
2.3
2.4
FREQUENCY CHARACTERISTICS
Parameter
Frequency range
Test Condition
m
14.6 mm x 9.7 mm x 6.2 mm
in
ar
Value
10 to 26
±0.5 max
±1 max
±10 to 100
Unit
MHz
ppm
ppm
ppb
-40 to 85
±0.5 to 2
±10
±10
3
2
±2.5 to 4
±4.6 max
3 min
°C
ppb/°C
ppb
ppb
minutes
ppb/g
ppb
ppm
mHz
Page 1
Frequency calibration
Reflow shift
Frequency stability
over temperature in
still air
Temperature range
Frequency slope in
still air
Supply voltage
stability
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
Load sensitivity
Warm-up time
g-sensitivity
Holdover drift
Free-run accuracy
Loop bandwidth for
wander generation
compliance
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Frequency range available (note 1)
At 25°C±2°C, at time of shipment, reference to nominal frequency
(note 2)
After 1 hour recovery at 25°C
Reference to (Fmax+Fmin)/2, see model code builder (note 3)
The operating temperature range over which the frequency
stability is measured (note 3)
Temperature ramp 1°C/minute max.
±5%
variation, reference to frequency at 3.3V, typical...
±5pF
variation, reference to frequency at 15pF, typical...
Note 4, typically less than...
Gamma vector of all three axes from 30 Hz to 1500 Hz, typically
less than...
24 hours, temperature variation
≤ ±1°C
(note 5), typically less
than...
All causes, 20 years life, reference to nominal frequency
MTIE compliant with GR-1244 Fig 5-5 & G.812 Type III Fig1 (≤
100 ns), TDEV compliant with GR-1244 Fig 5-4 & G.812 Type III
Fig2 (≤10 ns), oscillator stabilised 24 hours at Constant
temperature (±1°C, still air), data collected over 100,000 seconds
at 1 second intervals (-3dB cut-off, 2nd order high pass loop
filter)
y
3.0
Line
3.1
3.2
3.3
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FREQUENCY AGING
Parameter
Long term stability
Long term stability
Long term stability
Test Condition
Per day (note 5), typically less than...
First year
20 years
Value
±2
±1 max
±3 max
Unit
ppb
ppm
ppm
4.0
Line
4.1
4.2
4.3
4.4
4.5
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ROOT ALLAN VARIANCE
Parameter
Root Allan Variance
Root Allan Variance
Root Allan Variance
Root Allan Variance
Root Allan Variance
Test Condition
Typical value for a 20 MHz unit at 25°C, tau = 0.1s
Typical value for a 20 MHz unit at 25°C, tau = 1.0s
Typical value for a 20 MHz unit at 25°C, tau = 10s
Typical value for a 20 MHz unit at 25°C, tau = 100s
Typical value for a 20 MHz unit at 25°C, tau = 1000s
Value
7
7
7
8
8
Unit
E-11
E-11
E-11
E-11
E-11
5.0
Line
5.1
5.2
5.3
5.4
5.5
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POWER SUPPLY
Parameter
Supply voltage
Input power
Input power
Input power
Input power
Test Condition
±5%
y
in
ar
Page 2
Value
3.3
1000
800
400 max
350 max
Unit
V
mW
mW
mW
mW
warm up, -40°C to 85°C devices, typical...
warm up, -20°C to 70°C devices, typical...
Steady state in still air at 25°C, -40°C to 85°C devices
Steady state in still air at 25°C, -20°C to 70°C devices
6.0
Line
6.1
6.2
6.3
6.4
6.5
6.6
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HCMOS OSCILLATOR OUTPUT
Parameter
Output waveform
Output voltage level
low
Output voltage level
high
Rise and fall times
Duty cycle
Output load
Test Condition
HCMOS
Value
Unit
Measured with a capacitive load of 15pF
Measured with a capacitive load of 15pF
Measured with a capacitive load of 15pF
m
10 max
90 min
4 max
45 to 55
15
%Vcc
%Vcc
ns
%
pF
7.0
Line
7.1
SSB PHASE NOISE
Parameter
eli
Measured at 50% level
Nominal
Test Condition
Value
-70
Unit
dBc/Hz
7.2
SSB phase noise
power density at 10
Hz offset
Pr
SSB phase noise
power density at 1 Hz
offset
Typical value for a 12.8MHz carrier at 25°C
Typical value for a 12.8MHz carrier at 25°C
-96
dBc/Hz
7.3
SSB phase noise
power density at 100
Hz offset
Typical value for a 12.8MHz carrier at 25°C
-123
dBc/Hz
7.4
SSB phase noise
power density at 1kHz
offset
SSB phase noise
power density at
10kHz offset
SSB phase noise
power density at
100kHz offset
SSB phase noise
power density at
1MHz offset
Typical value for a 12.8MHz carrier at 25°C
-143
dBc/Hz
7.5
Typical value for a 12.8MHz carrier at 25°C
-152
dBc/Hz
7.6
Typical value for a 12.8MHz carrier at 25°C
-153
dBc/Hz
7.7
Typical value for a 12.8MHz carrier at 25°C
-154
dBc/Hz
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8.0
Line
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
ENVIRONMENTAL
Parameter
Storage temperature
Acceleration steady
state
Moisture sensitivity
Temperature cycling
Solder ability
Humidity
Shock
Vibration
RoHS
IEC 60068-2-7 test Ga, 5000g, 10s (at peak acceleration), Y-axis
only
IPC/JEDEC J-STD-020, Class 1
IEC 60068-2-14 test Na, 400 cycles, -40°C to +125°C
JESD 22-B102D, Method 2 Preconditioning 150°C, 16 hours
EIA/JEDEC22-A101, 85°C/85%R.H., 1000 hours
IEC 60068-2-27, test Ea; 1500g, 0.5ms, 18 shocks total
IEC 60068-2-6, test Fc: 20g, 60 to 2000Hz 12 hours total
Parts are fully compliant with the European Union directive
2002/95/EC on the restriction of t he use of certain hazardous
substances in electrical and electronic equipment. Note parts are
suitable for assembly using both Lead-free solders and Tin/Lead
solders
Test Condition
Value
-55 to 125
Unit
°C
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9.0
Line
9.1
9.2
9.3
9.4
9.5
9.6
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PIN CONNECTIONS
Parameter
Pin 1: Do Not Connect
Pin 2: NC
Pin 3: GND
Pin 4: OUTPUT
Pin 5: NC
Pin 6: VCC
Description
For correct operation decouple the supply voltage with a 10
µF
capacitor close to the oscillator
10.0
Line
10.1
10.2
10.3
10.4
10.5
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MARKING
Parameter
Type
Line 1
Line 2
Line 3
Line 4
Description
Laser marked
RAKON
Part number (Mxxxx)
11.0
Line
11.1
11.2
MANUFACTURING INFORMATION
Parameter
Reflow
Packaging description
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12.0
Line
12.1
12.2
SPECIFICATION NOTES
Parameter
Note 1
Note 2
12.3
12.4
12.5
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Note 3
Note 4
Note 5
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Description
Description
Frequency in MHz (xx.x MHz)
Pin 1 identifier (dot), and date / location code (YYWWX)
IPC/JEDEC J-STD-020, Package reflow temperature for the Pb-Free process is 245°C. The
solder reflow process is as per the attached profile
Tape and reel. 24mm wide tape and
Ø330mm
(Ø13”) reel. Standard packing quantity is 100 to
1000 units per reel
Standard frequencies are 10, 12.8, 13, 19.44, 20, 25 and 26 MHz. Other frequencies available
on request
The characteristics of the component may be temporarily affected by the processes of
assembly and soldering. The frequency specifications apply 48 hours after assembly. Nominal
conditions apply unless otherwise stated
Stability / temperature range options other than listed may be available upon request. Please
consult sales office for availability
Time needed for frequency to be within
±20
ppb reference to frequency after 1 hour, at 25°C.
Parameter is frequency, assembly and operating history dependent
After 30 days of continuous operation
m
in
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Page 3
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13.0
Line
13.1
DISCLAIMER
Parameter
Disclaimer
Description
“Samples
supplied according to this specification are supplied from our development or pre-
production programme and as such are not qualification approved products. No condition,
warranty or representation regarding quality, suitability, performance, life or continuation of
supply is given or implied and Guarantee in clause 6.1 of our standard Conditions of Sale is
not applicable. The right is reserved to change the design or specification or cease supply
without notice.” RAKON UK Limited
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Drawing Name: RFPO50/55 Model Drawing
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