Intel
®
Pentium
®
M Processor with
2-MB L2 Cache and 533-MHz
Front Side Bus
Datasheet
July 2005
Reference Number: 305262-002
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future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Pentium® M Processor with 2-MB L2 cache and 533-MHz Front Side Bus may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
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∆
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.
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Copyright© 2005, Intel Corporation. All rights reserved.
2
Datasheet
Contents
1
1.1
1.2
2
2.1
Introduction.................................................................................................................................... 7
Terminology .................................................................................................................................. 8
References ................................................................................................................................... 9
Low Power Features.................................................................................................................... 11
Clock Control and Low Power States ......................................................................................... 11
2.1.1 Normal State.................................................................................................................. 11
2.1.2 AutoHALT Powerdown State ......................................................................................... 11
2.1.3 Stop-Grant State............................................................................................................ 12
2.1.4 HALT/Grant Snoop State............................................................................................... 12
2.1.5 Sleep State .................................................................................................................... 12
2.1.6 Deep Sleep State...........................................................................................................13
2.1.7 Deeper Sleep State ....................................................................................................... 13
Enhanced Intel SpeedStep
®
Technology ................................................................................... 14
FSB Low Power Enhancements ................................................................................................. 15
Processor Power Status Indicator (PSI#) Signal ........................................................................ 15
Electrical Specifications ............................................................................................................. 17
Power and Ground Pins.............................................................................................................. 17
FSB Clock (BCLK[1:0]) and Processor Clocking ........................................................................ 17
Voltage Identification .................................................................................................................. 17
Catastrophic Thermal Protection ................................................................................................ 18
Signal Terminations and Unused Pins........................................................................................ 19
FSB Frequency Select Signals (BSEL[1:0]) ............................................................................... 19
FSB Signal Groups ..................................................................................................................... 19
CMOS Signals ............................................................................................................................ 20
Maximum Ratings ....................................................................................................................... 21
Processor DC Specifications ...................................................................................................... 21
Package Mechanical Specifications and Pin Information ....................................................... 27
Processor Pinout and Pin List..................................................................................................... 35
Alphabetical Signals Reference.................................................................................................. 51
Thermal Specifications and Design Considerations................................................................ 59
Thermal Specifications ............................................................................................................... 61
5.1.1 Thermal Diode ............................................................................................................... 61
5.1.2 Thermal Diode Offset..................................................................................................... 61
5.1.3 Intel
®
Thermal Monitor................................................................................................... 62
2.2
2.3
2.4
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
4
4.1
4.2
5
5.1
Datasheet
3
Figures
2-1
3-1
3-2
4-1
4-2
4-3
4-4
4-5
4-6
4-7
Clock Control States................................................................................................................11
Active VCC and ICC Load Line ...............................................................................................23
Deep Sleep VCC and ICC Load Line ......................................................................................24
Micro-FCPGA Package Top and Bottom Isometric Views ......................................................27
Micro-FCPGA Package - Top and Side Views ........................................................................28
Micro-FCPGA Package - Bottom View ....................................................................................29
Micro-FCBGA Package Top and Bottom Isometric View ........................................................31
Micro-FCBGA Package Top and Side Views ..........................................................................32
Micro-FCBGA Package Bottom View ......................................................................................34
The Coordinates of the Processor Pins As Viewed from the Top of the Package ..................35
Tables
1-1
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
4-1
4-2
4-3
4-4
4-5
5-1
5-2
5-3
References ................................................................................................................................ 9
Voltage Identification Definition ............................................................................................... 18
BSEL[1:0] Encoding for BCLK Frequency............................................................................... 19
FSB Pin Groups....................................................................................................................... 20
Processor DC Absolute Maximum Ratings ............................................................................. 21
Voltage and Current Specifications ......................................................................................... 22
FSB Differential BCLK Specifications ...................................................................................... 24
AGTL+ Signal Group DC Specifications.................................................................................. 25
CMOS Signal Group DC Specifications .................................................................................. 25
Open Drain Signal Group DC Specifications ........................................................................... 26
Micro-FCPGA Package Dimensions ....................................................................................... 30
Micro-FCBGA Package Dimensions ....................................................................................... 33
Pin Listing by Pin Name .......................................................................................................... 37
Pin Listing by Pin Number ....................................................................................................... 43
Signal Description.................................................................................................................... 51
Power Specifications for Intel
®
Pentium
®
M Processor........................................................... 60
Thermal Diode Interface .......................................................................................................... 61
Thermal Diode Specifications .................................................................................................. 62
4
Datasheet
Revision History
Revision
001
002
Initial release
Added Intel
®
Pentium
®
M Processor 780 specifications
Description
Date
January 2005
July 2005
§
Datasheet
5
