RESISTORS
TECHNOLOGY OF TOMORROW
RESISTORS
FLAT CHIP
THICK FILM (5% • 2%)
GENERAL PURPOSE
RK73 B
STRUCTURE
1
2
3
4
5
6
7
8
9
10
Ceramic substrate
Top termination (Ag Pd)
Bottom termination (Ag Pd)
Resistive layer
Glass layer
Trimming cut
Protective layer
End termination
Diffusion barrier (Ni)
Solder plating
~ 11
~ 11
~ 11
~ 11
~ 25
~ 0.05
3 ~ 12
3 ~ 12
µm
µm
µm
µm
µm
µm
µm
µm
IDENTIFICATION
TYPE
RK73B 1F … RK73B 1E
RK73B 1J ... RK73B 3A
COATING
COLOR
Black
MARKING
None
White, 3 digits
Products with Pb-free terminations
meet RoHS requirements
TYPE DESIGNATION (HOW TO ORDER)
Old Part No.
New Part No.
(Pb-free)
RK73K
RK73B
PRODUCT CODE
1J
1J
STYLE
1F…3A
G
T
TOLERANCE
TERMINATION
SURFACE MATERIAL
T: Sn L: Sn/Pb
(G: Au)
TD
TD
TAPING*
*Please see “PACKAGING”
10K
103
NOMINAL
RESISTANCE
3 digits
G
TOLERANCE
J: ±5%
G: ±2%
FEATURES
■
RuO
2
thick film resistor element
■
Anti-leaching nickel barrier terminations
■
Excellent heat resistance and moisture resistance are
ensured by the use of metal glaze thick film
■
Also available with expoxy bondable, silver-palladium
inner terminations in 1J, 2A and 2B sizes (see RK73X series)
■
Also available with gold plated electrodes in size 1E, 1J and
2A (10Ω…1MΩ)
■
Rated ambient temperature: +70° C
■
Taping according to IEC-60 286-3
■
Meets or exceeds IEC 60 115, CECC 40 401-802, EIAJ RC-2134A
■
Suitable for reflow and wave soldering
■
Lab Kit available
DIMENSIONS (mm)
SIZE
01005
0201
0402
0603
0805
1206
1210
2010
2512
TYPE
RK73
RK73
RK73
RK73
RK73
RK73
RK73
RK73
RK73
1F**
1H
1E
1J
2A
2B
2E
2H
3A
0.4
0.6
1.0
1.6
2.0
L
± 0.02
± 0.03
+ 0.1
– 0.05
W
0.2 ±
0.3 ±
0.5 ±
0.8 ±
1.25 ±
1.6 ±
2.6 ±
2.5 ±
3.1 ±
0.02
0.03
0.05
0.1
0.1
0.2
0.2
0.2
0.2
c
0.1 ±
0.1 ±
0.2 ±
0.3 ±
0.4 ±
0.03
0.05
0.1
0.1
0.2
d
0.1 ± 0.03
0.15 ± 0.05
0.25
+ 0.05
– 0.1
0.3 ± 0.1
0.3
+ 0.2
– 0.1
0.4
+ 0.2
– 0.1
t
0.12 ± 0.02
0.23 ± 0.03
0.35 ± 0.05
0.45 ± 0.1
0.5 ± 0.1
± 0.2
± 0.2
3.2 ± 0.2
5.0 ± 0.2
6.3 ± 0.2
0.5 ± 0.3
0.4
+ 0.2
– 0.1
0.6 ± 0.1
(0.65 ± 0.15)*
* Time of change to (0.65 ± 0.15) will be announced by PCN.
RATING
SIZE
01005
TYPE
RK73B 1F**
RK73B 1H
RK73B 1E
RK73B 1J
RK73B 2A
RK73B 2B
RK73B 2E
RK73B 2H
RK73B 3A
T.C.R.
(ppm/K)
± 400
± 200
± 400
± 200
± 400
± 200
± 400
± 200
± 400
± 200
± 400
± 200
± 400
± 200
± 400
± 200
POWER*
RATING
MAX.
WORKING
VOLTAGE
15 V
25 V
MAX.
OVERLOAD
VOLTAGE
30 V
50 V
RESISTANCE RANGE (E24)
G (± 2%)
10
Ω
… 1MΩ
–
10
Ω
… 10 MΩ
–
10
Ω
… 10 MΩ
1
Ω
. . . 9.1
Ω
10
Ω
… 10 MΩ
150 V
200 V
1
Ω
. . . 9.1
Ω
1.1 MΩ . . . 10 MΩ
±
E
W
U N D
250
R
0.03
D E V E L O P M E N T
0.05 W
0.063 W
50 V
0.1 W
0.125 W
0.25 W
0.5 W
0.33 W
0.5 W
0.33 W
NEW
0201
0402
0603
0805
1206
1210
2010
2512
J (± 5%)
10
Ω
… 1 MΩ
1
Ω
… 9.1
Ω
10
Ω
… 10 MΩ
1
Ω
. . . 9.1
Ω
10
Ω
… 10 MΩ
1
Ω
. . . 9.1
Ω
11 MΩ . . . 22 MΩ
OPERATING
TEMPERATURE
RANGE
- 55° C … + 125° C*
100 V
10
Ω…
10 MΩ
1
Ω
. . . 9.1
Ω
1.1 MΩ . . . 10 MΩ
10
Ω
… 1 MΩ
1
Ω
. . . 9.1
Ω
6.2 MΩ . . . 10 MΩ
10
Ω
… 1 MΩ
1
Ω
. . . 9.1
Ω
6.2 MΩ . . . 22 MΩ
- 55° C . . . +155° C*
200 V
400 V
10
Ω
… 5.6 MΩ
—
10
Ω
. . . 1 kΩ
1.1 kΩ . . . 5.6 MΩ
10
Ω
… 5.6 MΩ
1
Ω
. . . 9.1
Ω
6.2 MΩ . . . 10 MΩ
10
Ω
. . . 1 kΩ
1.1 kΩ . . . 5.6 MΩ
1
Ω
. . . 9.1
Ω
6.2 MΩ . . . 22 MΩ
1
Ω
. . . 9.1
Ω
6.2 MΩ . . . 22 MΩ
0.75 W
1W
200 V
(500 V)**
—
10
Ω
… 5.6 MΩ
—
10
Ω
… 5.6 MΩ
10
Ω
… 5.6 MΩ
10
Ω
… 5.6 MΩ
* Please note derating diagram
** Under development
Care should be taken that RK73B1F may be damaged when static electricity
occours and is applied in the equipment assembly process
EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de
Revision: 5. Nov. 2004
Specifications given herein may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
RESISTORS
TECHNOLOGY OF TOMORROW
RESISTORS
FLAT CHIP
THICK FILM
RK73
PERFORMANCE
TEST
Life test at 70° C rated power (P
70
)
Rapid change of temperature
Damp heat steady state
Endurance at 125° C
Short time overload
T.C.R.
Bending test
Solderability
Resistance to soldering heat
TEST CONDITIONS
IEC 60115-1 4.25.1
70° C ± 3° C, 1000 h; 1.5 h On / 0.5 h Off cycle
IEC 60115-1 4.19
– 55° C (30 min) / + 125° C (30 min); 5 cycles
IEC 60115-1 4.24
56 days at 40° C and 93% relative humidity
IEC 60115-1 4.25.3
+ 125° C / 1000 h
IEC 60115-1 4.13
6.25 x rated power for 5 sec., but smaller 2.5 x Umax
IEC 60115-1 4.8
Cycle: + 25° C/- 55° C/+ 25 ° C/+ 125 ° C/+ 25 ° C
IEC 60115-1 4.31
Bending: 5 mm (1J, 2A, 2B); 3 mm (1H, 1E); 2 mm (2E, 2H, 3A)
IEC 60068-2-20
235 ± 5° C / 2 ± 0.5 sec.
IEC 60115-1 4.18
10 ± 1 sec. at 260 ± 5° C solder bath temperature
TYP. TEST RESULTS
± (1% · R + 0.05
Ω)
± (0.5 % · R + 0.1
Ω)
± (1% · R + 0.05
Ω)
± (1% · R + 0.05
Ω)
± (1% · R + 0.05
Ω)
Within specified T.C.R.
± (0.5% · R + 0.05
Ω)
Terminations > 95% covered with new solder
± (0.5% · R + 0.05
Ω)
Specifications given herein may be changed at any time without prior notice.
Please confirm technical specifications before you order and/or use.
DERATING CURVE
SURFACE TEMPERATURE RISE
TEMPERATURE RISE (°C)
% RATED POWER
AMBIENT TEMPERATURE (°C)
ONE-PULSE LIMITING ELECTRIC POWER
KOA RK73 Flat Chip Resistors
3A
...
1E
1H
1F,
% RATED POWER
PULSE POWER IN WATTS (P
O
)
PULSE DURATION TIME IN SECONDS (t)
EUROPE GmbH • Kaddenbusch 6 • D-25578 Dägeling / ITZEHOE • PHONE: +49 (0) 48 21 / 89 89-0 • FAX: +49 (0) 48 21/ 89 89 89 • Internet: www.koaeurope.de
Revision: 5. Nov. 2004
NXP MCU
