Open Circuit Inductance (OCL) Test Parameters: 10 kHz, 0.1 V
rms
, 0.0 Adc,
+25
°C
2.
I
rms
: DC current for an approximate temperature rise of 40 °C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed
+125
°C under worst case operating conditions verified in the end
application.
3.
I
sat
: Peak current for approximately 5% rolloff at +25 °C
4.
Part Number Definition: RL1011-yyy-R
- RL1011 = Product code and size
- yyy= Inductance value in μH, R = decimal point,
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
Dimensions - mm
Do not route traces or vias underneath the inductor
2
RL1011
Unshielded radial leaded drum core inductors
Packaging information - mm
Technical Data 10278
E
ffective
October 2017
Supplied on cut tape roll packaging, 800 parts per roll.
Inductance characteristics
% of OCL vs. % of I
sat
120%
100%
80%
% of OCL
60%
40%
20%
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
180%
200%
% of I
sat
www.eaton.com/electronics
3
Technical Data 10278
E
ffective
October 2017
Wave solder profile
t
p
T
p
RL1011
Unshielded radial leaded drum core inductors
First Wave
Second Wave
Temperature
T
smax
T
styp
T
smin
Preheat area
Cool down area
Time
Reference EN 61760-1:2006
Profile Feature
Preheat
Temperature min. (T
smin
)
Temperature typ. (T
styp
)
Temperature max. (T
smax
)
Time (T
smin
to T
smax
) (t
s
)
preheat to max Temeperature
Peak temperature (T
p
)
Time at peak temperature (t
p
)
Ramp-down rate
Time 25°C to 25°C
Standard SnPb Solder
100°C
120°C
130°C
70 seconds
150°C max.
235
°
C - 260
°
C
Lead (Pb) Free Solder
100°C
120°C
130°C
70 seconds
150°C max.
250
°
C - 260
°
C
10 seconds max
5 seconds max each wave
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
4 minutes
10 seconds max
5 seconds max each wave
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
4 minutes
Manual solder
350°C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
无疑，从200亿美元（2006年）飙升到700亿美元（2011年）的市场是诱人的。为此，微软和Google纷纷高调宣布以其HealthVault和GoogleHealth服务进击医护领域，EZURiO公司CTO Nick Hunn更是将此举形容为“秃鹰粉饰自己的羽毛把自己打扮成孔雀时，肯定嗅出了不寻常的味道。” 这种味道可能足以催生一个令目前计算市场相形见绌的生态系统——M2M（Mac...[详细]
模拟电子
