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RLS418-811MG

IC Socket, DIP18, 18 Contact(s), ROHS COMPLIANT

器件类别:连接器    插座   

厂商名称:Advanced Interconnections Corp

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Advanced Interconnections Corp
包装说明
ROHS COMPLIANT
Reach Compliance Code
compliant
ECCN代码
EAR99
其他特性
94V-0
联系完成配合
GOLD OVER NICKEL
联系完成终止
Matte Tin (Sn) - with Nickel (Ni) barrier
触点材料
BERYLLIUM COPPER/COPPER ALLOY
设备插槽类型
IC SOCKET
使用的设备类型
DIP18
外壳材料
LIQUID CRYSTAL POLYMER
JESD-609代码
e3
触点数
18
文档预览
DIP Sockets
Table of Models
Molded DIP Sockets
Closed Frame and Open Frame
Description:
Closed Frame (RDS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.125
(3.18)
Description:
Open Frame (RLS)
Material: High Temp. Liquid Crystal Polymer
(LCP)
Index: -40°C to 260°C (-40°F to 500°F)
.050
(1.27)
Features:
• Multiple finger contact on all
sockets assures maximum
reliability.
• Tapered entry for ease of insertion.
• Closed bottom sleeve for 100%
anti-wicking of solder.
• To fit .100/(2.54mm) pitch.
• Easily customized to fit your
application.
Description:
Peel-A-Way
®
(KS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
For more information, refer to the Peel-A-Way
®
DIP Sockets pages.
RDS replaces DS and HDS.
RLS replaces LS and HLS.
.005
(.13)
Polyimide
Film
Options
Tape Sealant - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper - Copper Alloy
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per MIL-G-45204
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
RDS 3
16 - 01
M
G
Contact Plating
RoHS Compliant:
Body Type
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
RDS - New Hi-Temp
Closed Frame Molded
RLS - New Hi-Temp
Open Frame Molded
DIP Spacing
3 - .300/(7.62mm)
4 - .400/(10.16mm)
6 - .600/(15.24mm)
9 - .900/(22.86mm)*
*Open Frame only
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Number of Pins
Closed Frame 8 - 40
Open Frame 8 - 64
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
14
inch/(mm)
Molded DIP Sockets
Closed Frame and Open Frame
Standard Quick-Turn Terminals
Type -01
Low Profile Solder Tail
DIP Sockets
Type -30
Low Profile Solder Tail
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Type -51
Low Profile Solder Tail
Type -29
Low Profile Solder Tail
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
.020 Dia.
(.51)
.165
(4.19)
.170
(4.32)
.020 Dia.
(.51)
.165
(4.19)
.275
(6.99)
.020 Dia.
(.51)
.130
(3.30)
.110
(2.79)
Type -04
Super Low Profile
Not for use with Closed Frame
Type -49
Ultra Low Profile
Not for use with Closed Frame
Type -237
Surface Mount
.120
(3.05)
.110
(2.79)
.028 Dia.
(.71)
.028 Dia.
(.71)
.095
(2.41)
.095
(2.41)
.155
(3.94)
Intrusive Reflow Application:
.052 Dia.
(1.32)
Solder Preform
Solder Preform Terminals
Tin/Lead: Type -150
Lead-free: Type -811
.072 Dia.
(1.83)
Tin/Lead: Type -151
Lead-free: Type -812
.072 Dia.
(1.83)
.130
(3.30)
PC Board
Preform After
Solder Flow
.165
(4.19)
Solder
Preform
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.110
(2.79)
.020 Dia.
(.51)
• Combines the labor of socket
loading and solder application into
one operation.
• Eliminates the use of solder paste
and screening operation.
• Eliminates solder bridges and/or
solder shorts due to excess
solder.
A
C
B
Dimensional Information
A
C
B
• Ensures a reliable solder joint with
controlled solder volume.
• Ideal for surface mount and mixed
technology applications.
Closed Frame
Open Frame
.125
(3.18)
.050*
(1.27)
• For custom solder preform
terminal applications consult
factory.
C
1.100
(27.54)
1.200
(30.48)
1.200
(30.48)
1.400
(35.56)
1.600
(40.64)
2.000
(50.80)
2.400
(60.96)
3.200
(81.28)
# of Pins
8
14
16
18
20
22
24
28
A
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
.300
(7.62)
B
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
.400
(10.16)
C
.400
(10.16)
.700
(17.78)
.800
(20.32)
.900
(22.86)
1.000
(25.40)
1.100
(27.94)
1.200
(30.48)
1.400
(35.56)
# of Pins
22
24
24
28
32
40
48*
64*
A
.400
(10.16)
.400
(10.16)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.600
(15.24)
.900
(22.86)
B
.500
(12.70)
.500
(12.70)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
.700
(17.78)
1.000
(25.40)
Available Online:
• RoHS Qualification Test Report
The dimensions in
blue
are for Open Frame only.
*Socket body thickness is .100/(2.54) for 48 and 64 positions.
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
15
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
CAT16-PREVIEW06 Rev. 1/06
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