The properly and electrostatically measured taping materials are used for the components, but attention should be paid to the fact that there is some danger the parts absorb on the top
tapes to cause a failure in the mounting and the parts are destructed by static electricity (more than 1kV : 1J, 2A, 2B, 2E 0.5kV : 1E, Human Body Model 100pF 1.5kΩ) to change the
resistance in the conditions of an excessive dryness or after the parts are given vibration for a long time as they are packaged on the tapes. Similarly, care should be given not to apply the
excessive static electricity when mounting on the boards.
●
Ionic impurities such as flux etc. that are attached to these products or those mounted onto a PCB, negatively affect their moisture resistance, corrosion resistance, etc. The flux may
contain ionic substances like chlorine, acid, etc. while perspiration and saliva include ionic impurities like sodium (Na
＋
), chrorine (Cl
−
) etc. Therefore these kinds of ionic substances may
induce electrical corrosion when they invade into the products. Either thorough washing or using RMA solder and flux are necessary since lead free solder contains ionic substances.
Washing process is needed, before putting on moisture proof material in order to prevent electrical corrosion.
●
Please pay attention that the top of an iron does not direct touch to the components. There is a risk that may cause a change in resistance. Take care that another risk may happen that
the protecting coat is carbonized in an instant when touched directly by the top of the iron, also climatic-proof for electric corrosion or insulation of protecting coat may be dropped down.
Be sure not to give high temperature on the top of the iron as it will degrade the protecting coat.
●
Avoid storing components under direct sun rays, high temperature/humidity. Direct sun rays will cause quality change of taping and difficulty of keeping appropriate peeling strength. 5∼
35℃/35∼75%RH, there is no deterioration of solderability for 12 months, but take special care for storing, because condensation, dust, and toxic gas like hydrogen sulfide, sulfurous acid
gas, hydrogen chloride, etc. may drop solderability.
备用功能配置（除ADC和DAC外的所有非GPIO功能），使用函数 void GPIO_PinAFConfig(GPIO_TypeDef* GPIOx, uint16_t GPIO_PinSource, uint8_t GPIO_AF) * This GPIO_AF can be one of the following values: * @arg GPIO_AF_RTC_5...[详细]
2024年10月30日，上海， 浩亭新品上市-浩亭Mini PushPull ix Industrial®推拉式连接器AWG22-24 版本现已上市 。这些是期待已久的用于更大电缆横截面的新 IDC版本，有用于以太网应用的 A 型和用于信号和串行总线系统的 B型。 这两个新版本都扩展了现有的 Mini PushPull ix Industrial®推拉式连接器系列，可以在连接电缆、电缆距离和...[详细]
Linux与安卓
