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RP-21002D0-290W

Analog Circuit, 1 Func, Hybrid, DIP-10

器件类别:模拟混合信号IC    信号电路   

厂商名称:Data Device Corporation

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器件参数
参数名称
属性值
零件包装代码
MODULE
包装说明
,
针数
10
Reach Compliance Code
unknown
其他特性
ALSO REQUIRES 9V TO 40V SUPPLY
模拟集成电路 - 其他类型
ANALOG CIRCUIT
JESD-30 代码
R-XDMA-P10
功能数量
1
端子数量
10
最高工作温度
85 °C
最低工作温度
-40 °C
封装主体材料
UNSPECIFIED
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
认证状态
Not Qualified
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
HYBRID
温度等级
INDUSTRIAL
端子形式
PIN/PEG
端子位置
DUAL
Base Number Matches
1
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RP-21000 SERIES
Make sure the next
Card you purchase
has...
®
28 VDC SOLID-STATE POWER
CONTROLLERS
FEATURES
Available in 2, 5, 10, 15, 20 and 25
Amp Ratings
True I
2
T Protection
Compliant to MIL-STD-704 and
MIL-PRF-38534
Isolated Control Circuitry
Status Outputs
Instant Trip Protection
No Thermal Derating
Low Power Dissipation
Solid-State Reliability
DESCRIPTION
The RP-21000 Series (formerly SSP-21110 Series) of 28 Vdc, Solid-
State Power Controllers (SSPCs) replace electromagnetic circuit
breakers and solid-state relays rated from 2 through 25 amperes.
These SSPCs offer status outputs and permit external input logic
control so that they may be remotely located near to the load. There
are five models in the series, differing only in rated current, so that
fault and I
2
T trip characteristics can be selected to protect wiring and
loads.
Using Power MOSFET switches, these Power Controllers offer low
“on” resistance, low voltage drop, high “off” impedance, and low
power dissipation. Built with Power MOSFETs and custom mono-
lithics and using thick-film hybrid technology, they offer small size, low
power, and high reliability.
Built-In-Test (BIT) has been provided to monitor, in real time, the sta-
tus of the internal circuitry as well as circuitry external to the SSPC.
This BIT monitors MOSFET failure and control circuit failure. The
RP-21000 Series will operate over the full MIL temperature range
from -55°C to +125°C with no thermal derating. See ordering infor-
mation for more details.
APPLICATIONS
Designed to replace circuit breakers in land, air, and space vehicles,
these Solid-State Power Controllers provide status outputs for light
and heavy overloads as well as minimum load current.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7381
All trademarks are the property of their respective owners.
©
1990, 1999 Data Device Corporation
Data Device Corporation
www.ddc-web.com
HIGH SIDE
LOW SIDE
OR
SWITCH CONFIG.
SWITCH CONFIG.
+28 Vdc
VCC1 VCC2
POWER IN
POWER IN
PINS 6,7
+28 Vdc
VBIAS SUPPLY
INPUT
INTERNAL
POWER
SUPPLIES
VEE1
MOSFET
DRIVER,
SHORT
CIRCUIT
CONTROL,
STATUS
CIRCUIT,
AND
R
SENSE
PINS 6,7
LOAD
STATUS1
STATUS2
CONTROL
CMD
2
RP-21000 Series
H-04/03-0
ISOLATED
CONTROL
CIRCUIT
POWER OUT
PINS 9,10
POWER OUT
PINS 9,10
LOAD
LATCHES
SLEW
CONTROL
VBIAS SUPPLY
COMMON
PIN 8
SLEW
CONTROL
PIN 8
SYSTEM
GND
FIGURE 1. RP-21000 SERIES BLOCK DIAGRAM
TABLE 1. ABSOLUTE MAXIMUM RATINGS
PARAMETER
Power In to Power Out
UNIT
Vdc
VALUE
50 continuous
100 Volts, 50 ms
transient
50 continuous
-0.5 to VBias +0.5
-100 to +100
-0.5 to +7.0
-1000 to +1000
+300 (within 10 sec.)
+150
TABLE 3. RP-21000 SPECIFICATIONS (CONTD)
PARAMETER
POWER CIRCUIT
(continued)
Output-to-Input Parasitic
Diode, Continuous
Current Per Amp Of
Rated Current
Output-to-Input Parasitic
Diode, Pulsed
Current Per Amp Of
Rated Current
Output-to-Input Parasitic
Diode, Forward Voltage
at Continuous Current
Isolation Resistance
Any Pin to Case
Isolation Resistance
Power Out to
Signal Ground
Voltage Drop
Trip Characteristics
Response Time
TEMPERATURE RANGE
Operating (Case)
Storage
THERMAL RESISTANCE
Case to Sink (θ
CS
)
Case to Ambient (θ
CA
)
Temperature Rise,
Junction-to-Case
PHYSICAL
CHARACTERISTICS
Size
Weight
CONDITIONS
UNIT
VALUE
Power Out to Slew Control
Control Input to Signal Ground
Power Out to Signal Ground
VBias Voltage (see note 4)
Pin-to-Case
Lead Temperature (soldering)
Junction Temperature
Vdc
Vdc
Vdc
Vdc
Vdc
°C
°C
Power Out Voltage >
Power In Voltage
A
1.0 typ
Power Out Voltage >
Power In Voltage
Pulse Width
100µS
Power Out Voltage >
Power In Voltage
Pin-to-Case Voltage =
100Vdc
Power Ground to
Signal Ground
Voltage = 50Vdc
across pins 6&7, 9&10
see FIGURE 2
see FIGURE 3
A
4.0 typ
TABLE 2. RECOMMENDED OPERATING
CONDITIONS
PARAMETER
Power In to Power Out
Control Input to Signal Ground
Power Out to Signal Ground
VBias voltage (see note 4)
UNIT
Vdc
Vdc
Vdc
Vdc
VALUE
+9.0 to +40.0
+4.5 to VBias
-40 to +40
+4.5 to +5.5
V
MΩ
MΩ
1.8 max
50 min
50 min
TABLE 3. RP-21000 SPECIFICATIONS
(SEE NOTES 1 AND 2)
PARAMETER
CONTROL CIRCUIT
Logic Type
VBias Supply Current
Control Turn-On Voltage
Control Turn-Off Voltage
Control Input Current
Control Input Current
Control Input Current
Status Output Voltage
Status Output Voltage
Status Truth Table
POWER CIRCUIT
Max. Continuous Current
"On" Resistance
Power Dissipation
Power Input Leakage
Current to Power Out
Max Load Capacitance
for Start-Up
Signal Ground to Power
Out Isolation
Output Capacitance
Trip Reset Time
Rupture Capacity
Unlimited
Power In = 9 - 40 V
(see note 2 )
Power In = 9 - 40 V
(see note 2 )
at 100 Vdc
see note 2
CONDITIONS
Note 3
UNIT
VALUE
TTL/CMOS
compatible
mA
V
V
30 typ
70 max
2.0 to 5.5
-0.5 to 0.8
Vdc 0.25 max
°C
°C
-55 to +125
-55 to +150
VCC = 4.5 to 5.5 Vdc
°C/W 0.5
°C/W 12
Rated Load
°C
10
control voltage = 5.0 V
µA
50 max
control voltage = 2.4 V
µA
50 max
control voltage = 0.8 V
µA
-50 min
V
CC
= 4.5V,
I
OL
= 2.5 mA
V
CC
= 4.5V,
I
OH
= -1.0mA
see TABLE 5
See TABLE 4
See TABLE 4
See TABLE 4
mA/
0.1 max
A
µF/A
36 typ
pF
1000 typ
V
V
0.4 max
2.4 min
See FIGURE 4
g
65 max
Notes:
1. -55°C
Case Temperature
125°C.
2. 'A' is Amps of Rated SSPC Current.
3. Control Input must never be left floating.
4. An external 0.1µf ceramic capacitor from VBias to the +5V return ground is
recommended.
TABLE 4. POWER DISSIPATION
PART
NUMBER
RP-21002
RP-21005
RP-21010
RP-21015
RP-21020
RP-21025
I-MAX*
(AMPS)
2
5
10
15
20
25
“ON”
POWER DISSIPATION
RESISTANCE
(WATTS)**
(OHMS)**
0.1
0.03
0.023
0.015
0.012
0.012
0.6
0.95
2.6
3.6
5.0
7.7
pF/A 300 typ
ms 30 min
A
Unlimited
* I-MAX is the maximum continuous current.
** Specified for -55° to +105°C case temperature; Please increase by 0.6%/°C
between +105°C and +125°C Max Limit.
Data Device Corporation
www.ddc-web.com
3
RP-21000 Series
H-04/03-0
FUNCTIONAL DESCRIPTION
The RP-21000 series of Solid-State Power Controllers incorpo-
rates the wire protection feature of electromechanical circuit
breakers and the reliability of solid-state relays. In addition to the
solid-state relay's input logic compatibility, the RP-21000 series
provides logic compatible status outputs.
A TTL/CMOS compatible input provides external control of the
power switch's "ON/OFF" state. A logic high on this control input
turns the power to the load "on". A logic low will turn the power
switch off, which removes power from the load.
In the event of an overload the RP-21000 series will trip, just like
a circuit breaker, and automatically remove power from the load.
In order to turn back on, the control input must be brought to a
logic low, and then returned to a logic high state.
As in a circuit breaker, the SSPC’s time to trip depends on the
current level. Slight overloads will cause longer trip times. Heavy
overloads will cause shorter trip times. The fault ("Instant Trip")
and I
2
T trip curve (see FIGURE 2) shows the trip time as a func-
tion of current for a single trip or repetitive trips with at least 10
seconds between trip and turn on. Attempts to repeatedly turn on
into an overload will result in the thermal memory shortening
each trip time. This "memory" protects the wire, load and Solid-
State Power Controller.
The status lines are TTL/CMOS compatible outputs which reflect
the state of the SSPC, the load, and the Built-In-Test (BIT) cir-
cuits. The status permits an external subsystem to monitor and
ultimately control the SSPC. TABLE 5 defines the status lines'
states which indicate the various states of the SSPC. Further
explanation of the status lines appears in the applications infor-
mation section.
The RP-21000 series SSPCs are characterized by their current
rating and maximum "on" resistance listed in TABLE 4. These
parameters are established by the number of Power FETs
placed in parallel within the SSPC.
The trip function is implemented by two separate circuits, a true
I
2
T trip comparator and a short circuit fault comparator. They are
independent of each other but work together to protect the sys-
tem.
If the load current is less than 110% of rated current, the SSPC
will never trip. If the load current is greater than 145%, the SSPC
will always trip.
For load currents less than 800%, the trip time can be found from
FIGURE 2 by drawing a horizontal line on FIGURE 2 at the cur-
rent level of interest. The SSPC will always trip at a time between
the two curves. This is true I
2
T tripping.
10,000
INSTANT
TRIP
MAX
TRIP LIMIT
.
1,200
ALW
AYS
TRIP
LOAD CURRENT%I
- MAX
1,000
800
600
MIN. TRIP LIMIT
400
NEVER TRIP
200
145%
110%
0
25
µs
0.001
0.01
0.1
1.0
10
TIME
- SECONDS
FIGURE 2. TRIP CHARACTERISTICS
Data Device Corporation
www.ddc-web.com
4
RP-21000 Series
H-04/03-0
When the SSPC trips in accordance with the I
2
T characteristics,
the fall time is 200 µs, maximum.
For load currents greater than 1200%, the SSPC will turn off in
less than 25 µs. Between 800% and 1200%, the SSPC will turn
off in a time less than the "max. trip limit" shown in FIGURE 2
and may turn off in less than 25
µs.
When the SSPC turns off
under these fault conditions, the fall time is less than 25 µs.
While the SSPC will always turn off in less than 25 µs when the
load current is greater than 1200%, the actual current may
"spike" to a value higher than 1200% due to circuit delays. The
MOSFETs inherently self-limit the maximum current, depending
on the number of MOSFETs and their rating.
During turn-on and turn-off the rise and fall time of the output
voltage is controlled to be less than 200 µs. This value is a com-
promise between faster response time with a greater amount of
RFI and EMI generated, and slower response time with less RFI
and EMI but greater power dissipated in the SSPC during transi-
tions. Since the Power MOSFET switches are not saturated dur-
ing transitions, the switching power dissipation is much greater
than the static dissipation, and longer transitions result in a larg-
er temperature rise. If the SSPC is rapidly turned on and off, the
high average dissipation could result in a significant temperature
rise in the SSPC. For this reason do not turn the SSPC off and
on more rapidly than 30 msec. This will limit the maximum tem-
perature of the switches to a safe level.
The RP-21000 has been designed to derive its internal power
requirements from the bias supply input (+5 Vdc).
APPLICATIONS INFORMATION
In some applications, low side switching will be required as
shown in FIGURE 1. In this configuration the load is being
switched through to system ground. The external 28 Vdc is con-
nected directly to the load while the return is connected to Pins
9 and 10, which are the Power Out pins. The Slew Control (Pin
8) is connected to maintain a controlled turn-on and turn-off of
the load current.
CONTROL INPUT
TRIP POINT
LOAD CURRENT
STATUS 2
STATUS 1
T1 T2 T3 T4 T5
T6 T7
T8 T9
T10
T11 T12
T13
SOLID-STATE POWER CONTROLLER TIMING AT 28 VDC
TIME
T1-T2
T2-3
T1-T4
T4-T5
T6-7
T7-T8
T6-T9
T10-T11
T11-T12
T11-T12
T11-T13
DESCRIPTION
TURN-ON DELAY
VOLTAGE RISE TIME
STATUS 1 & STATUS 2 TURN ON DELAY
STATUS 1 & STATUS 2 RISE AND FALL TIME
TURN OFF DELAY
VOLTAGE FALL TIME
STATUS 1 & STATUS 2 TURN OFF DELAY
TRIP TIME AFTER TURN-ON
VOLTAGE FALL TIME AFTER TRIP
VOLTAGE FALL TIME AFTER TRIP
TRIP TURN-OFF STATUS 1 DELAY
MAXIMUM
350
200
7.5
350
350
200
5.0
SEE FIG. 2
200
25
5.0
UNIT
µs
µs
ms
ns
µs
µs
ms
s
µs
µs
ms
*LOAD CURRENT < 800%
*LOAD CURRENT > 1200%
*
*
NOTES
Note: *Voltage rise/fall time is specified for Power In equal to 28 Vdc and is proportional to the Power In voltage.
FIGURE 3. SOLID-STATE POWER CONTROLLER TIMING
Data Device Corporation
www.ddc-web.com
5
RP-21000 Series
H-04/03-0
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